EP1S40F780C8 - Stratix FPGA 41,250 LEs 780-FBGA | Intel / Altera
MPN: EP1S40F780C8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1045.53 | $1,045.53 |
| 10 | $990 | $9,900.00 |
| 50 | $920 | $46,000.00 |
| 100 | $875 | $87,500.00 |
| 500 | $820 | $410,000.00 |
Drop-in alternatives for EP1S40F780C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1S40F780C8 Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 41,250 |
| Total Memory Bits | 3,423,744 |
| User I/O Pins | 615 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum Operating Frequency | 357.14 MHz (Fmax) |
| Speed Grade | -8 |
| Package | 780-ball FBGA (FineLine BGA, 29 x 29 mm, 1 mm pitch) |
| Operating Temperature | 0 C to 85 C (commercial) |
| Mounting Type | Surface Mount |
| Logic Family | CMOS |
| Embedded Memory | TriMatrix (M512, M4K, M-RAM blocks) |
| DSP Blocks | Yes - dedicated hardware multipliers |
| PLLs | Up to 12 |
| Configuration Interface | JTAG (IEEE 1149.1), passive serial, passive parallel |
| RoHS Status | unknown |
| Logic Cells | 41,250 (per Stratix family datasheet) |
EP1S40F780C8 780-ball fbga (fineline bga, 29 x 29 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for EP1S40F780C8 (780-ball fbga (fineline bga, 29 x 29 mm, 1 mm pitch) package) with 615 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S40F780C8.
Refer to the datasheet for full pin configuration.
Estimated pin count: 615 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S40F780C8 is suitable for 6 applications: ASIC Prototyping and Emulation, Telecom Line-Card Packet Processing, Software-Defined Radio Baseband, Video Processing and Image Pipeline, Industrial Control and Automation, Test and Measurement Instrumentation.
ASIC Prototyping and Emulation
The EP1S40F780C8 is well-suited for ASIC prototyping because its 41,250 logic elements and 3,423,744 bits of embedded TriMatrix memory can emulate multi-million-gate ASIC designs. Designers typically partition the target ASIC across one or more Stratix devices, leveraging the 615 user I/Os and the dedicated DSP blocks to validate pre-silicon RTL in hardware. Compared with using a single larger FPGA, the EP1S40F780C8 offers a balance of density and package routability. Real-world use cases include prototyping custom CPUs, network processors, and DSP pipelines before committing to a multi-million-dollar mask set.
Recommended
Telecom Line-Card Packet Processing
The EP1S40F780C8 fits telecom line-card packet processing because its hardware multipliers and DSP blocks accelerate CRC, hashing, and traffic-management functions at line rate, while the 615 I/Os accommodate multiple SGMII/UTMI/UTOPIA external interfaces. Designs in this application typically implement custom NPU offload, queue management, and deep packet inspection in the FPGA fabric alongside standard PHY/MAC companion chips. The 357.14 MHz Fmax in the -8 speed grade supports GbE and OC-48 class throughput. Compared with using an off-the-shelf NPU, the EP1S40F780C8 allows proprietary algorithms to be deployed without software license fees.
Recommended
Software-Defined Radio Baseband
The EP1S40F780C8 fits SDR baseband processing because its DSP blocks implement FIR filters and FFT butterflies with deterministic latency, and the abundant TriMatrix memory (3,423,744 bits) buffers sample streams between the ADC and the host processor. Typical use cases include military radio and base-station baseband prototypes, where the FPGA handles DDC/DUC, channelization, and modulation/demodulation in hardware while software handles higher-layer stack functions. Compared with using a CPU/GPU, the EP1S40F780C8 delivers deterministic latency and parallel sample throughput required by SDR front-ends.
Recommended
Video Processing and Image Pipeline
The EP1S40F780C8 fits real-time video processing because its DSP blocks implement 2D convolutions, scaling, and color-space conversion at pixel rate, while its 615 I/Os accept DVI/HDMI/VGA input streams via external TMDS receivers. Real-world designs in this space use the EP1S40F780C8 for industrial machine-vision cameras, medical imaging pre-processing, and broadcast video format conversion. The TriMatrix memory acts as line buffers between pipeline stages. Compared with fixed-function video processors, the EP1S40F780C8 allows custom algorithms to be deployed without an ASIC design cycle.
Recommended
Industrial Control and Automation
The EP1S40F780C8 fits industrial control because its programmable logic implements custom real-time control loops and its LVDS/LVTTL/PCI I/O standards interface directly to motor drivers, encoders, and fieldbus transceivers. Typical applications include multi-axis motion controllers, programmable logic controllers (PLCs), and machine-vision inspection systems. Compared with using a microcontroller, the EP1S40F780C8 delivers deterministic multi-axis timing and parallel sensor processing at microsecond resolution. The 0 C to 85 C commercial temperature grade is suitable for factory-floor environments.
Recommended
Test and Measurement Instrumentation
The EP1S40F780C8 fits high-end test equipment because its combination of high-speed DSP blocks, deep memory, and many I/Os enables custom protocol generation, signal capture, and pattern recognition in ATE, oscilloscope, and protocol-analyzer products. Real-world use cases include logic analyzer probe ASICs, BERT pattern generators, and custom protocol-aware test heads. Compared with using commercial processor modules, the EP1S40F780C8 delivers sample-accurate timing and parallel stimulus generation required by high-pin-count test systems. The 357.14 MHz Fmax supports GbE-class stimulus rates.
Recommended
Recommended Products Summary
Engineering reference data for EP1S40F780C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S40F780C7N | EP1S40F780C7 | EP1S40F780C6 | EP1S40F780C5 | EP1S40F780C | EP1S30F780C8N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FBGA (29x29 mm) | 780-ball FBGA (29x29 mm) - same | 780-ball FBGA (29x29 mm) - same | 780-ball FBGA (29x29 mm) - same | 780-ball FBGA (29x29 mm) - same | 780-ball FBGA (29x29 mm) - same | 780-ball FBGA (29x29 mm) - same |
| Speed Grade | -8 (Fmax 357.14 MHz) | -7 (Fmax ~300 MHz) | -7 (Fmax ~300 MHz) | -6 (Fmax ~260 MHz) | -5 (Fmax ~210 MHz) | Unspecified commercial | -8 (Fmax 357.14 MHz) |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 30,000 |
| Total Memory Bits | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 2,215,104 |
| User I/O Pins | 615 | 615 | 615 | 615 | 615 | 615 | 615 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lead-Free / RoHS | unknown | Yes (N suffix) | No (SnPb) | unknown | unknown | unknown | Yes (N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest speed grade in the EP1S40 780-FBGA family (vs EP1S40F780C7N)
- Highest logic density in the original Stratix family (vs EP1S30F780C8N)
- Wider signal-integrity margin than the EP1S40 1020-ball variant (vs EP1S40F1020C8N)
Design Notes
Estimated: based on Stratix family datasheet typical ICC_CORE ~1.5 A at 1.5 V plus ICCIO dependent on I/O bank activity, total power can reach 5-8 W on the EP1S40F780C8 under typical logic utilization. Decouple each VCC_CORE pin with a 0.1 uF MLCC placed as close as possible to the package, plus bulk 33 uF-100 uF polymer caps per Stratix Hardware Reference manual section on power distribution. PLL analog VCC (VCC_PLL) requires dedicated filtered supply with ferrite bead and 10 uF + 0.1 uF local decoupling - never share this rail with digital VCC to avoid jitter.
The 780-ball FBGA at 1.0 mm pitch requires microvia PCB technology (laser-drilled stacked vias on inner layers) for breakout routing. Use a 6+ layer stack-up with dedicated ground and 1.5 V power planes directly under the BGA. Route all differential pairs (LVDS clock, DDR) with 100 ohm differential impedance and length-matching per Stratix Device Handbook pin connection guidelines. Never route signals under the BGA; fan-out only on the breakout layer to avoid stubs.
Do not assume all 615 user I/O are simultaneously usable - I/O bank VCCIO constraints mean LVDS and 3.3 V LVTTL cannot share banks. Verify pin assignments in the Quartus II Fitter report before tape-out. For configuration, JTAG chain integrity is critical for production programming; add a TCK pull-down and TMS pull-up per the IEEE 1149.1 spec to prevent floating JTAG pins from latching configuration in AS mode during board power-up.
Compliance Information
Compliance status not specified in verified web data. The part was originally manufactured by Altera (acquired by Intel in 2015); RoHS/REACH compliance depends on date code - parts with 'N' suffix (e.g. EP1S40F780C7N) are typically lead-free/Rohs-compliant, while parts without N may be SnPb.
