EP1SGX25DF1020C6N - Stratix GX FPGA 25K LE 607 I/O 1020-BGA | Intel
MPN: EP1SGX25DF1020C6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265 | $2,650.00 |
| 100 | $235 | $23,500.00 |
| 500 | $210 | $105,000.00 |
| 1,000 | $195 | $195,000.00 |
Drop-in alternatives for EP1SGX25DF1020C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX25DF1020C6
✅ Drop-In✓ In Stock
$289 / Unit
View Datasheet →EP1SGX25DF1020C5N
✅ Drop-In✓ In Stock
$650 / Unit
View Datasheet →EP1SGX25DF1020C7N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP1SGX25FF1020C6N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1S25F1020C6N
✅ Drop-In✓ In Stock
$450 / Unit
View Datasheet →EP1SGX40DF1020C6N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1SGX25DF1020C6N Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Embedded Memory | 1,944,576 bits |
| User I/O | 607 |
| Transceiver Channels | 20 (up to 3.125 Gbps) |
| DSP Blocks | 80 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Maximum Internal Frequency | 4385.97 MHz |
| Operating Temperature | 0 C to +85 C (Commercial) |
| Package | 1020-ball FC-FBGA (DF) 33 x 33 mm, 1 mm pitch |
| Mounting Type | Surface Mount |
| Speed Grade | C6 |
| Lead Free | Yes |
| RoHS Status | Compliant |
EP1SGX25DF1020C6N 1020-ball fc-fbga (df) 33 x 33 mm, 1 mm pitch Pin Configuration Guide
Complete pinout information for EP1SGX25DF1020C6N (1020-ball fc-fbga (df) 33 x 33 mm, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25DF1020C6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF1020C6N is suitable for 6 applications: Wireless Baseband Processing, Serial RapidIO Backplane, PCI Express Endpoint Card, Broadcast Video Router, Industrial Multi-Gigabit Gateway, XAUI 10G Ethernet Aggregation.
Wireless Baseband Processing
The EP1SGX25DF1020C6N fits wireless baseband cards because 20 integrated transceiver channels support CPRI and OBSAI links to remote radio heads at up to 3.125 Gbps, eliminating external PHY chips. Its 25,660 logic elements and 80 DSP blocks handle uplink/downlink baseband computations (channel estimation, FFT/iFFT, scrambling) while 1,944,576 bits of embedded RAM buffer interleaved data streams. The 607 user I/O connect to backplane buses and external memory. Compared to a discrete SERDES-plus-FPGA solution, the integrated transceivers reduce BOM and simplify PCB routing.
Recommended
Serial RapidIO Backplane
The EP1SGX25DF1020C6N is well-suited for Serial RapidIO (SRIO) switch and endpoint cards because 20 transceiver channels aggregate to support multiple SRIO lanes at 1.25/2.5/3.125 Gbps. Its TriMatrix memory architecture provides 1,944,576 bits of distributed buffer for packet queuing, while 80 DSP blocks accelerate message-header processing. The 607 user I/O maintain compatibility with legacy 32-bit RapidIO parallel interfaces when bridging to serial. Power consumption is moderate for the 33x33 mm DF BGA, but designers should budget ~8-10 W for full transceiver utilization.
Recommended
PCI Express Endpoint Card
The EP1SGX25DF1020C6N implements a single x4 or x8 PCI Express endpoint using 4-8 of its 20 transceiver channels at 2.5 Gbps per lane, leaving 12-16 channels for other high-speed links or local interconnect. The hard PCI Express IP core in Quartus II handles protocol layer, link training, and transaction handling, while 25,660 logic elements implement application-layer functions such as DMA engines and data movers. Designers gain a fully integrated Gen1 PCIe solution without external PCIe PHY silicon. Migration to Gen2 requires upgrading to a Stratix IV GX or later device.
Recommended
Broadcast Video Router
The EP1SGX25DF1020C6N serves in broadcast SDI/HD-SDI routers and cross-point switches because 20 transceivers support 10-bit SDI links at 270 Mbps, 1.485 Gbps HD-SDI, and 2.97 Gbps 3G-SDI simultaneously. Embedded RAM buffers video frames while 80 DSP blocks perform color-space conversion and overlay composition. 607 user I/O accommodate control planes and audio embedding. Compared to ASSP video crosspoint chips, the Stratix GX approach offers reconfigurable I/O mapping and field upgradability via FPGA bitstream updates.
Recommended
Industrial Multi-Gigabit Gateway
The EP1SGX25DF1020C6N is a strong fit for industrial gateways bridging PROFINET, EtherCAT, and Serial RapidIO because 20 integrated transceivers handle multiple industrial Ethernet protocols concurrently. The 130 nm process and 0-85 C commercial temperature range are sufficient for indoor industrial enclosures. 80 DSP blocks and 1,944,576 bits of embedded memory enable on-chip protocol stack processing without external co-processors. The 1020-ball DF BGA package is well-supported by contract manufacturers; consider EP1SGX25FF1020C6N for harsher thermal environments.
Recommended
XAUI 10G Ethernet Aggregation
The EP1SGX25DF1020C6N supports XAUI (10 Gigabit Attachment Unit Interface) by bonding four 3.125 Gbps transceivers per XAUI lane, allowing up to five independent XAUI links from 20 transceivers. This is ideal for 10G Ethernet aggregation switches, line cards, and MAC designs. The hard XAUI IP in Quartus II implements the XGMII-to-XAUI conversion, while 25,660 logic elements implement MAC and address-table logic. Compared to an ASIC-based 10G solution, the FPGA approach allows late-stage protocol changes and field firmware updates across multiple Ethernet standards.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF1020C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF1020C6 | EP1SGX25DF1020C5N | EP1SGX25DF1020C7N | EP1SGX25FF1020C6N | EP1S25F1020C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FC-FBGA (DF) 33x33 mm | 1020-ball FC-FBGA (DF) - same | 1020-ball FC-FBGA (DF) - same | 1020-ball FC-FBGA (DF) - same | 1020-ball FC-FBGA (FF) - same | 1020-ball FC-FBGA (F) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Transceiver Channels | 20 @ up to 3.125 Gbps | 20 @ 3.125 Gbps | 20 @ 3.125 Gbps | 20 @ 3.125 Gbps | 20 @ 3.125 Gbps | 0 (no transceivers) |
| Speed Grade | C6 | C6 | C5 (slower) | C7 (faster) | C6 | C6 |
| Embedded Memory | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits |
| User I/O | 607 | 607 | 607 | 607 | 607 | 706 |
| Lifecycle Status | Obsolete (EOL) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Integrated multi-gigabit transceivers (vs EP1S25F1020C6N)
- Faster speed grade for tight timing closure (vs EP1SGX25DF1020C5N)
- Enhanced BGA thermal package option (vs EP1SGX25FF1020C6N)
Design Notes
The 1020-ball FC-FBGA at 1 mm pitch requires a 4-6 layer PCB with ENIG finish and via-in-pad technology for reliable assembly. Use a solder paste stencil of 0.125 mm thickness with apertures sized 0.4-0.5 mm diameter. Plan for 8 mil (0.2 mm) trace width and 4 mil (0.1 mm) clearance in the fanout region. Verify your assembly house supports 1 mm pitch BGA before committing to the layout; otherwise migrate to the FF Enhanced BGA variant (same ball count but easier thermal profiling).
Estimate: core power for a fully utilized EP1SGX25 at 50% toggle rate and 25,660 LE is approximately 5-7 W. With 20 transceivers active at 3.125 Gbps, add 2-4 W for the SERDES blocks, giving a 7-11 W total. Use the Quartus II PowerPlay early estimator with your actual toggle rates; for a conservative design, budget 12 W and design the power supply and PCB thermal dissipation accordingly. Decoupling requires 100 uF bulk + 0.1 uF + 0.01 uF + 0.001 uF per supply pin group, placed within 5 mm of the BGA balls.
Route all 20 transceiver channels with controlled impedance of 100 ohm differential (85 ohm for PCIe), using a stripline or microstrip topology with reference planes on adjacent layers. Match intra-pair skew to under 5 mil (0.125 mm) and inter-pair skew to under 50 mil (1.25 mm) to maintain signal integrity at 3.125 Gbps. Use the Quartus II transceiver toolkit post-layout to validate eye margins; do not rely on simulation alone. Transceiver reference clock routing is similarly critical - use 50 ohm single-ended or 100 ohm differential with isolated ground returns.
Do not confuse DF (FineLine BGA, 33x33 mm) with FF (Enhanced FineLine BGA, same ball count) or F (legacy FC-BGA) - all three are 1020-ball but have different land patterns. Verify the exact ball-map file in the Quartus II device library matches your PCB footprint before assembly. A common mistake is to assign 3.3 V LVCMOS to a bank without checking VCCIO compatibility with the chosen I/O standard; the EP1SGX25 supports 1.5/1.8/2.5/3.3 V per bank, but each bank must be uniformly supplied. Finally, configure unused transceiver channels to power-down mode in software to reduce quiescent power by up to 30%.
Compliance Information
RoHS compliant per Alldatasheet and DigiKey product pages. Lead-free / lead-free designator "N" suffix. Not AEC-Q100 qualified (commercial-grade FPGA, not automotive). Halogen-free status not explicitly stated in the verified data; treat as unknown.
