EP1SGX25FF1020I7N - Stratix GX 1020-FBGA FPGA 25K LE | Intel
MPN: EP1SGX25FF1020I7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $186 | $186.00 |
| 10 | $172.5 | $1,725.00 |
| 100 | $149.9 | $14,990.00 |
| 500 | $129.8 | $64,900.00 |
| 1,000 | $98.5 | $98,500.00 |
Drop-in alternatives for EP1SGX25FF1020I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX25FF1020I7N Maximum Ratings & Electrical Characteristics
| Product Family | Stratix GX |
| Logic Family | CMOS |
| Number of Logic Cells | 25,660 |
| Number of CLBs | 2,566 |
| Process Technology | 130 nm |
| Core Supply Voltage | 1.5 V |
| Number of Terminals | 1020 |
| Terminal Form | Ball |
| Package Code | BGA |
| Package Shape | Square |
| Package Body | 33 x 33 mm, 1.0 mm pitch, FBGA-1020, lead-free |
| Operating Temperature Range | 0 to 85 °C (DigChip excerpt for this MPN) |
| Mounting Type | Surface Mount (BGA) |
| Lifecycle Status | Obsolete / NRND (Stratix GX family end-of-life) |
EP1SGX25FF1020I7N 33 x 33 mm, 1.0 mm pitch, fbga-1020, lead-free Pin Configuration Guide
Complete pinout information for EP1SGX25FF1020I7N (33 x 33 mm, 1.0 mm pitch, fbga-1020, lead-free package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25FF1020I7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25FF1020I7N is suitable for 6 applications: Telecom / Optical Transport Line Card, Broadcast Video Infrastructure, High-End Test and Measurement, Military / Aerospace Signal Processing, Industrial Control and Automation, FPGA Prototyping and Research.
Telecom / Optical Transport Line Card
Telecom and optical transport equipment such as line cards, routers and protocol processors use the EP1SGX25FF1020I7N because its 1020-terminal FC-FBGA supports wide parallel switch interfaces while the Stratix GX architecture includes the high-speed transceivers needed for backplane and optical modules. The 25,660 logic cells provide room for framers, packet classification and soft PHYs, and the 1.5 V core is standard for 130 nm FPGA power trees. In a typical design, the FPGA sits between optical transceivers and the system switch fabric; parallel LVDS or SERDES-style lanes connect the device to PHYs. A power-sequence controller and configuration CPLD are placed nearby. Because this is a legacy FPGA, verify remaining inventory, timing models and thermal solution before committing to a high-volume line card.
Recommended
Broadcast Video Infrastructure
Broadcast video equipment such as format converters, multiviewers and video routers can use the EP1SGX25FF1020I7N for high-density parallel video I/O and packet processing. The 1020-ball package gives enough pins for multiple SDI, parallel video, and control buses, while the 25,660 logic cells support color-space conversion, scaling and video processing. Designers usually configure the FPGA in a broadcast motherboard with high-speed serial links feeding an upstream video processor. The lead-free N finish helps meet environmental requirements in modern broadcast rack products. Because the I7 code implies an industrial ordering option, it can tolerate wider temperature swings than a C-grade part. For legacy broadcast equipment that already uses a Stratix GX 1020-ball footprint, this is a direct footprint-compatible alternative with the same configurable hardware platform.
Recommended
High-End Test and Measurement
High-end test and measurement instruments benefit from the EP1SGX25FF1020I7N's combination of configurable I/O, high logic capacity and 1020-ball fine-pitch BGA routing. Instruments such as logic analyzers, arbitrary waveform generators and protocol analyzers need numerous fast I/O lanes plus internal acquisition state machines; the 25,660 logic cells can implement trigger logic, memory controllers and digital down-conversion blocks. The large package permits parallel ADC/DAC data buses to connect on one side and a host processor interface on another side. Because test equipment often operates in controlled indoor environments, some designs can use the C7N commercial alternative, but the I7N's industrial ordering code provides margin for rack-mounted and environmental chamber applications. A clean 1.5 V core supply and multi-layer design are required for repeatable analog measurements.
Recommended
Military / Aerospace Signal Processing
Military and aerospace signal-processing boards may use the EP1SGX25FF1020I7N in radar, electronic warfare and protected-communications subsystems where an FPGA must handle wideband data streams with deterministic latency. The 130 nm Stratix GX family was designed with multiple clock domains, high-speed serial interfaces and abundant I/O, all useful in rugged embedded systems. A typical board places the FPGA near high-speed ADC/DACs or a serial fabric, with the 1.5 V core powered by a radiation-tolerant DC-DC supply. The industrial-grade I7 ordering option is important when the board is deployed in an unpressurized avionics bay or ground mobile shelter. No cross-brand pin-compatible alternative exists, so board reuse depends on retaining Intel/Altera Stratix GX variants. Designers should confirm long-term supply and radiation-performance expectations before selecting legacy FPGAs for new defense programs.
Recommended
Industrial Control and Automation
Industrial control and automation systems can use the EP1SGX25FF1020I7N for multi-axis motion control, vision processing, protocol bridging and modular I/O. The 1020-ball package provides enough pins to connect to isolated digital inputs, encoder interfaces and fieldbus controllers. The 25,660 logic cells permit deterministic hardware logic for servo loops, safety interlocks and communication protocol state machines without burdening a host CPU. Because industrial environments often experience wider temperature swings, the I7N industrial ordering code is preferred over C-grade FPGAs for outdoor cabinet or motor-drive applications. Designers typically pair the FPGA with a microcontroller for application management and a flash configuration memory. The lead-free N finish also aligns with modern RoHS-oriented industrial control platforms.
Recommended
FPGA Prototyping and Research
University laboratories, chip-design teams and prototyping houses use the EP1SGX25FF1020I7N to emulate digital logic, validate RTL blocks and build custom research instruments. The 25,660 logic cells are enough for soft processors, DSP chains and bus-functional models, while the 1020-ball FBGA exposes many pins to the printed-circuit board for probing and expansion headers. Because the Stratix GX family is supported by Altera Quartus II design software, researchers can synthesize Verilog or VHDL and verify timing simulation before hardware bring-up. The I7N variant provides industrial temperature and lead-free assembly options that simplify compliance in academic and small-volume production environments. However, because this is an obsolete FPGA, research projects should secure sufficient inventory for the full project duration or plan a migration to a larger Stratix-family device in the same tool flow.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25FF1020I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25FF1020I7 | EP1SGX25FF1020I6N | EP1SGX25FF1020C7N |
|---|---|---|---|---|
| Package | FC-FBGA-1020, 33x33 mm, 1.0 mm pitch | FC-FBGA-1020, same package | FC-FBGA-1020, same package | FC-FBGA-1020, same package |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Product Family | Stratix GX | Stratix GX | Stratix GX | Stratix GX |
| Logic Cells | 25,660 | 25,660 | 25,660 | 25,660 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Grade | I-grade per ordering code (DigChip lists 0 to 85 °C) | I-grade per ordering code | I-grade per ordering code | C-grade per ordering code |
| Speed Grade | 7 | 7 | 6 | 7 |
| Lead-Free Finish | Yes (N suffix) | No (non-N) | Yes (N suffix) | Yes (N suffix) |
| Lifecycle | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND |
Key Differentiators
- Lead-free industrial-grade ordering option in a 1020-ball Stratix GX array (vs EP1SGX25FF1020I7)
- Industrial I ordering option for extended temperature environments (vs EP1SGX25FF1020C7N)
- A complete 25,660-logic-cell Stratix GX ordering code in a high-pin-count 1020-ball package (vs EP1SGX25FF1020)
Design Notes
The EP1SGX25FF1020I7N uses a 1.5 V core supply; plan separate core and I/O voltage domains. Because Stratix GX is an SRAM FPGA, the configuration supply must be stable at power-up, so use a supervisory circuit or reset generator if the board has slow-ramping rails. Provide a low-impedance 1.5 V plane with distributed 100 nF capacitors and a few 10 µF ceramics near the BGA core balls. Do not connect the 1.5 V core directly to 2.5 V or 3.3 V I/O, which would damage the 130 nm device.
Estimated: Core power for a 25,660-logic-cell, 130 nm FPGA at 1.5 V can exceed several watts at high utilization. With the 33 x 33 mm 1020-ball body, route thermal vias under the die and use forced airflow for high-density or high-ambient applications. This is an engineering estimate, not a data sheet figure; run the Intel/Altera power estimator for an exact thermal budget.
For the 1.0 mm pitch 1020-ball BGA, use microvias or via-in-pad for dense fanout and keep trace lengths matched on differential pairs. Use controlled-impedance routing for high-speed transceiver traces and place ground vias adjacent to signal vias to reduce return-path inductance. Because the N suffix indicates a lead-free device, use a lead-free reflow profile and perform X-ray inspection on the BGA after soldering.
Compliance Information
Lead-free finish is indicated by the N suffix in the MPN and by the DigChip package description. Full RoHS certificate, REACH registration and conflict-mineral status were not present in the fetched web data.
