EP1SGX25FF1020I7 - Stratix GX FPGA 25,660 Cells, 1.5V, FC-FBGA-1020 | Altera / Intel
MPN: EP1SGX25FF1020I7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $320 | $320.00 |
| 10 | $290 | $2,900.00 |
| 100 | $260 | $26,000.00 |
| 500 | $235 | $117,500.00 |
| 1,000 | $210 | $210,000.00 |
Drop-in alternatives for EP1SGX25FF1020I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1SGX25FF1020I6N
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View Datasheet →EP1SGX25FF1020I5N
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View Datasheet →EP1SGX25FF1020C7
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View Datasheet →EP1SGX25FF1020C6
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View Datasheet →EP1SGX25DF1020C7
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View Datasheet →EP1SGX25FF1020I7 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Series | EP1SGX25 |
| Logic Cells | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Package | FC-FBGA-1020 (Flip-Chip Fine-pitch BGA) |
| Number of Terminals / Balls | 1020 |
| Terminal Form | Ball |
| Temperature Grade (suffix 'I') | Industrial |
| Speed Grade | 7 (highest production grade) |
| Combinatorial Delay per CLB | 9.48 ns (per Microchip USA listing) |
| Embedded Transceivers | Yes (Stratix GX feature) |
| Configuration Method | SRAM-based (volatile, requires configuration at power-up) |
| Mounting Type | Surface Mount (FC-FBGA) |
EP1SGX25FF1020I7 Pin Configuration
| Pin 1 | BALL A1 — User I/O (specific bank assignment per datasheet) |
| Pin 256 | BALL / IO / GND / VCC — [DATA_NEEDED: ball assignment index 256] |
| Pin 512 | BALL / IO / GND / VCC — [DATA_NEEDED: ball assignment index 512] |
| Pin 768 | BALL / IO / GND / VCC — [DATA_NEEDED: ball assignment index 768] |
| Pin 1020 | BALL / IO / GND / VCC — [DATA_NEEDED: ball assignment index 1020] |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25FF1020I7 is suitable for 6 applications: High-Speed Serial Backplane Line Cards, Telecom Channel Aggregation Equipment, Broadcast and Video Processing Infrastructure, High-Throughput DSP and Signal Processing, Protocol Bridging and Custom I/O Cards, Test and Measurement Instrumentation Backplanes.
High-Speed Serial Backplane Line Cards
The EP1SGX25FF1020I7's defining feature is its embedded multi-gigabit transceivers (Stratix GX hallmark), which deliver SERDES rates commonly used in backplane interconnect standards of the Stratix GX generation. In telecom line cards, the device aggregates multiple high-speed serial links and performs protocol conversion at line rate, with the 25,660 logic cells providing enough headroom for packet processing, framing, and forward-error-correction engines. The FC-FBGA-1020 package's 1020 balls expose enough dedicated transceiver pins to drive multi-channel SERDES layouts; engineers typically pair it with the Stratix GX Device Family Data Sheet reference pin assignments. Compared with a discrete SERDES plus glue logic approach, this single-chip integration reduces board area, BOM, and timing closure complexity.
Recommended
Telecom Channel Aggregation Equipment
Channel aggregation systems require simultaneous high-throughput SERDES aggregation and substantial logic for traffic management. The EP1SGX25FF1020I7's combination of 25,660 logic cells and the embedded transceiver suite lets it consolidate SERDES, queuing, and forwarding logic on one die, reducing latency versus multi-chip designs. Industrial temperature grading (the 'I' suffix) makes it suitable for outdoor-cabinet and central-office environments. The FC-FBGA-1020 package supports the necessary I/O density for multi-channel aggregation cards, and Quartus II provides pre-built IP cores for common telecom functions to shorten the design cycle.
Recommended
Broadcast and Video Processing Infrastructure
Broadcast video infrastructure demands deterministic, high-throughput pixel processing for SD/HD/3G-SDI streams and ancillary data handling. The EP1SGX25FF1020I7's 2,566 CLBs and embedded multipliers provide the DSP resources needed for color-space conversion, scaling, and frame-rate conversion at line rate. Its multi-gigabit transceivers can directly drive SDI physical layers, eliminating external serializer chips. The 1020-ball FC-FBGA exposes enough I/O to manage multiple parallel video streams, while industrial temperature grading supports broadcast equipment installed in unconditioned outdoor or remote racks.
Recommended
High-Throughput DSP and Signal Processing
The EP1SGX25FF1020I7's embedded DSP blocks and hardware multipliers enable fixed-point and floating-point DSP pipelines at line-rate sample frequencies. With 25,660 logic cells and 2,566 CLBs, the device can implement FIR filters, FFT engines, channelizers, and modulators for radar, sonar, and software-defined-radio front-ends. Industrial temperature grading lets the same device operate in deployed field systems and lab test benches. The FC-FBGA-1020 package provides ample user I/O for parallel ADC/DAC interfaces typical in DSP front-ends, and Quartus II ships megafunctions for FFTs and FIR filters that engineers can parameterize directly.
Recommended
Protocol Bridging and Custom I/O Cards
Custom I/O cards often need to bridge between proprietary backplane protocols and standardized interfaces such as PCI Express, Serial RapidIO, or custom SERDES. The EP1SGX25FF1020I7's programmable transceivers and rich I/O banks make it a natural fit, with embedded PCS/PMA logic configurable in Quartus II's transceiver toolkit. The 1020-ball FC-FBGA package accommodates both high-speed serial pins and parallel LVTTL/LVCMOS I/O without sacrificing one for the other. Industrial temperature grading supports installation in factory automation and industrial I/O racks.
Recommended
Test and Measurement Instrumentation Backplanes
Test and measurement instruments (logic analyzers, protocol testers, digitizers) need high-speed data acquisition with deterministic processing and dense I/O. The EP1SGX25FF1020I7's combination of high-density user I/O and multi-gigabit transceivers allows it to capture and process multiple high-speed serial streams simultaneously while exposing parallel control/observation interfaces to host CPUs. Its 1.5 V core and 130 nm process deliver the noise characteristics required for sensitive measurement front-ends, and the industrial temperature grade lets it operate in test-rack environments without active cooling.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25FF1020I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25FF1020I6N | EP1SGX25FF1020I5N | EP1SGX25FF1020C7 | EP1SGX25FF1020C6 | EP1SGX25DF1020C7 |
|---|---|---|---|---|---|---|
| Package | FC-FBGA-1020 | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Family | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX |
| Logic Cells | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 7 (fastest) | 6 (~15% slower) | 5 (~25-30% slower) | 7 (fastest) | 6 (~15% slower) | 7 (fastest) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Embedded Transceivers | Yes (Stratix GX) | Yes (Stratix GX) | Yes (Stratix GX) | Yes (Stratix GX) | Yes (Stratix GX) | Yes (Stratix GX DF variant) |
Key Differentiators
- Highest production speed grade in the Stratix GX FC-FBGA-1020 family (vs EP1SGX25FF1020I6N)
- Industrial temperature grade (-40C to +100C) enables outdoor and factory deployment (vs EP1SGX25FF1020C7)
- 25,660 logic cells / 2,566 CLBs of logic density on a single device (vs EP1SGX10CF672C7)
Design Notes
Estimated: Stratix GX FPGAs at 1.5 V core and full transceiver utilization typically dissipate 5-10 W. The 1020-ball FC-FBGA package requires a continuous copper thermal pad or heat-spreader pattern beneath the BGA land array, connected by thermal vias to inner-layer ground planes. Junction-to-ambient thermal resistance (theta_JA) on the standard Stratix GX FC-FBGA-1020 board setup is typically in the 15-25 C/W range with proper thermal design; without thermal vias, junction temperature can exceed safe limits at full utilization. Verify via the manufacturer's Stratix GX thermal model.
The 1020-ball FC-FBGA package uses a fine terminal pitch (typical Stratix GX FC-FBGA is 1.00 mm per the Microchip USA listing for the family). PCB layout must follow the manufacturer's land pattern and use a 6-layer stackup minimum with continuous power and ground planes. Microstrip-controlled-impedance traces (typically 50 ohm single-ended, 100 ohm differential) are required for transceiver channels, and all transceiver reference-clock pins must be routed with matched lengths and properly terminated. Cross-check with the Stratix GX Hardware Reference Manual.
Stratix GX FPGAs require a configuration source at every power-up because the configuration memory is SRAM-based (volatile). Common pitfalls include: omitting the JTAG download header (which blocks debug and re-programmability), failing to drive MSEL pins to the correct mode-select state, and leaving CONF_DONE / nSTATUS / nCONFIG floating instead of pulling them to known logic levels per the datasheet. The dedicated PLL analog supply (VCCA_PLL) must be filtered with the manufacturer's recommended LC network; noisy PLL supply will manifest as excessive jitter on clock outputs and degraded SERDES eye margins.
Each multi-gigabit transceiver channel requires its own AC-coupling capacitors on the serial TX/RX pins; place these capacitors as close to the FPGA balls as the routing allows. Transceiver reference clocks must be supplied by a low-jitter oscillator or clock synthesizer that meets the Stratix GX jitter specification, and must be routed as a 100 ohm differential pair. Use HyperLynx or equivalent SI simulation to verify channel loss and crosstalk budgets before committing to PCB fabrication.
Compliance Information
Specific compliance certifications not present in the Verified Web Data; RoHS/REACH status of the EP1SGX25FF1020I7 vs the lead-free EP1SGX25FF1020I7N variant should be confirmed via the manufacturer's certification letters or the distributor's environmental compliance disclosure. AEC-Q100 is not applicable as this is an FPGA, not an automotive-grade IC.
