EP1SGX40DF1020I7 - 41,250 LEs Stratix GX FPGA, 1.5V FC-FBGA-1020 | Altera
MPN: EP1SGX40DF1020I7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $260 | $2,600.00 |
| 100 | $235 | $23,500.00 |
| 500 | $210 | $105,000.00 |
| 1,000 | $188 | $188,000.00 |
Drop-in alternatives for EP1SGX40DF1020I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX40DF1020I6
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP1SGX40DF1020I5
✅ Drop-In✓ In Stock
$1340 / Unit
View Datasheet →EP1SGX40DF1020I7N
✅ Drop-In✓ In Stock
$2290 / Unit
View Datasheet →EP1SGX40CF1020I5
✅ Drop-In✓ In Stock
$370 / Unit
View Datasheet →EP1SGX25DF1020I7
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP1SGX40DF1020I7 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,125 |
| Process Technology | 130 nm CMOS |
| Nominal Core Supply Voltage | 1.5 V |
| Supply Voltage Range | 1.425 V to 1.575 V |
| Package | 1020-ball FC-FBGA |
| Terminal Form | Ball |
| Package Shape | Square |
| Grading of Temperature | Military (I7 grade) |
| Technology | CMOS |
| Operating Temperature | -40 °C to +100 °C (I7 grade per family datasheet) |
| Combinatorial CLB Delay | 9.48 ns (per family datasheet) |
| Mounting Type | Surface Mount |
EP1SGX40DF1020I7 square Pin Configuration Guide
Complete pinout information for EP1SGX40DF1020I7 (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40DF1020I7.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40DF1020I7 is suitable for 6 applications: Multi-Gigabit Serial Protocol Bridging, Telecom Line Card Processing, ASIC Prototyping Platform, Test & Measurement Instrumentation, Military & Aerospace Signal Processing, Industrial Imaging and Video Processing.
Multi-Gigabit Serial Protocol Bridging
The EP1SGX40DF1020I7's embedded multi-gigabit transceivers (EMGTs) operate up to 3.125 Gbps per channel, making it ideal for protocol-bridging applications that aggregate PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI links on a single die. With 41,250 logic elements and approximately 3.4 Mbits of TriMatrix memory, the device can implement MAC, PCS, and link-training state machines in firmware while exposing standard parallel interfaces to the host processor. Placed on a line card as a glue-less bridge between backplane SERDES and an embedded CPU, it replaces what would otherwise be an FPGA plus an external PHY. Designers should follow Stratix GX reference designs for transceiver channel routing, AC-coupling capacitor placement, and reference-clock distribution.
Recommended
Telecom Line Card Processing
Stratix GX devices were designed into telecom line cards for channelized voice and data processing, where the combination of high logic density, embedded multipliers, and SERDES channels enables a single chip to handle framer, mapper, and DSP functions. The EP1SGX40DF1020I7's 41,250 LEs and block RAM can implement multi-channel filter banks, framer/mapper logic, and overhead processing for OC-192/STM-64 class interfaces. Its industrial temperature grade (I7) supports controlled-environment central-office deployments. Pair with external clock-cleaning PLLs and follow the Stratix GX hardware reference design for jitter-optimized SERDES PCB layout to meet telecom mask compliance.
Recommended
ASIC Prototyping Platform
With 41,250 logic elements and ample TriMatrix memory, the EP1SGX40DF1020I7 is well-suited as an ASIC prototyping vehicle, mapping gate-level netlists of mid-complexity ASICs into the Stratix GX logic fabric. The 1020-ball FC-FBGA footprint exposes hundreds of general-purpose I/Os, enough to bring out wide parallel buses, memory interfaces (DDR/QDR SRAM), and peripheral pins of a typical 500K-1M gate ASIC. Quartus II synthesis supports incremental compilation, which accelerates the bring-up cycle when partitioning a large ASIC into multiple FPGAs. Use the I7 industrial grade for prototype validation in lab environments; if you must meet MIL-spec, source the MIL temperature variant.
Recommended
Test & Measurement Instrumentation
Test-and-measurement equipment such as logic analyzers, protocol analyzers, and bit-error-rate testers benefit from the EP1SGX40DF1020I7's combination of high logic density, embedded transceivers, and generous block RAM for trace buffering. The SERDES channels can acquire multi-gigabit data streams directly, while the logic fabric implements protocol decoders, trigger engines, and display pipelines. Industrial temperature grade suits bench and laboratory environments, while the FC-FBGA-1020 footprint keeps the design compact in modular instrument cards. Follow the Stratix GX IBIS models for signal-integrity simulation of probe-interface channels.
Recommended
Military & Aerospace Signal Processing
The I7 industrial temperature grade of the EP1SGX40DF1020I7 is specified down to -40 °C, making it usable in military and aerospace signal-processing applications such as software-defined radio front-ends, electronic-countermeasures prototypes, and avionics data-acquisition units. The high logic density enables wideband FFT/filter implementations, while the SERDES channels capture RF-digitizer output streams. Note that for full MIL-STD-810 qualification, designers should verify the specific lot and screening level with the supplier, since the I7 grade alone is industrial temperature, not MIL-883. PCB layout must follow aerospace derating guidelines for HDI stack-ups.
Recommended
Industrial Imaging and Video Processing
The EP1SGX40DF1020I7 supports high-speed LVDS and parallel video interfaces, enabling it to drive or accept data from industrial cameras, frame grabbers, and image-processing pipelines. With 41,250 LEs and embedded multipliers, the part can implement real-time image preprocessing (color-space conversion, filtering, lens correction) before handing off to a host processor. The I7 industrial temperature rating suits factory-floor deployments, and the FC-FBGA-1020 footprint accommodates the wide parallel buses typical of Camera Link or LVDS-based imagers. Use Quartus II 7.x with the Stratix GX video reference design as a starting point and verify timing closure across the operating-temperature range.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40DF1020I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40DF1020I6 | EP1SGX40DF1020I5 | EP1SGX40DF1020I7N | EP1SGX40CF1020I5 | EP1SGX25DF1020I7 |
|---|---|---|---|---|---|---|
| Package | FC-FBGA-1020 | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix (non-GX) | Stratix GX |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | ~25,660 (-38%) |
| Speed Grade | I7 (fastest industrial) | I6 (slower) | I5 (slowest industrial) | I7 (same) | I5 (slower) | I7 (same) |
| Embedded Transceivers | Yes (Stratix GX EMGTs) | Yes (same) | Yes (same) | Yes (same) | No (non-GX) | Yes (fewer channels) |
| Core Voltage | 1.5 V (1.425 V to 1.575 V) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) |
| Process Technology | 130 nm CMOS | 130 nm CMOS (same) | 130 nm CMOS (same) | 130 nm CMOS (same) | 130 nm CMOS (same) | 130 nm CMOS (same) |
| Lifecycle Status | Obsolete (legacy) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| 1-pc Reference Price (USD) | 285.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest speed grade in the Stratix GX 41K-LE family (vs EP1SGX40DF1020I6)
- Same-package compatibility with the entire EP1SGX40DF1020 family (vs EP1S80F1020C7)
- Embedded multi-gigabit transceivers (EMGTs) integrated on-die (vs EP1SGX40CF1020I5)
Design Notes
The FC-FBGA-1020 package at 1.0 mm ball pitch requires an HDI PCB stack-up with laser-drilled microvias (typically 4-6 layer build-up). Escape routing of the inner rows is impossible without microvias, so plan the stack-up and via aspect ratio before floorplanning the schematic. Use the Stratix GX family datasheet ball-map to plan critical I/O placement, especially the SERDES channels and PLL supply pins, which must be placed near the package edges for shortest escape. Reference: Altera AN-465 application note on Stratix GX high-speed board design.
Estimated: at 50 percent toggle rate and nominal 1.5 V core draw, the EP1SGX40DF1020I7 can dissipate 4-7 W; SERDES channels add another 1-2 W when active. Total worst-case power is therefore roughly 8 W, which mandates a low-thermal-resistance PCB design with stitched power planes and 4+ ground vias under the BGA thermal balls. Use the Quartus II PowerPlay early power estimator to model your specific design's power; decoupling per the family datasheet recommends 0.1 uF and 0.01 uF ceramics within 5 mm of every supply pin plus bulk tantalum or polymer on each supply rail.
A common pitfall is selecting a non-GX Stratix (EP1S40 or EP1S60) for a design that requires embedded transceivers - the non-GX parts have no EMGTs, only general-purpose I/O. Confirm the family suffix carefully: 'SGX' = Stratix GX with transceivers, 'S' = Stratix without. Another pitfall is selecting a faster speed grade than timing closure requires; the I5 grade is typically 20-30 percent cheaper than I7 and frequently meets timing in pipelined designs. Finally, plan for JTAG access on a dedicated header - the FC-FBGA-1020 footprint has dedicated TCK/TMS/TDO/TDI balls that must be routed to a 0.1 inch header for programming and debug.
SERDES channel performance depends critically on PCB stack-up and reference-clock jitter. Use the Stratix GX IBIS-AMI models for channel simulation; target a differential impedance of 100 ohm +/- 10 percent on SERDES pairs and 50 ohm single-ended for general-purpose I/O. AC-coupling capacitors must be 0402-size, 100 nF X7R with placement within 200 mils of the receiver, and the reference clock must meet the Stratix GX jitter specification (typically < 1 ps RMS) with a dedicated clock-cleaning PLL. Source-synchronous parallel interfaces (LVDS) require matched-pair routing with length matching within 20 mils.
Compliance Information
RoHS/REACH/lead-free status not provided in the verified data; the EP1SGX40DF1020I7N suffix indicates lead-free RoHS finish on the N variant. AEC-Q100 is not applicable to FPGAs of this class.
