EP1SGX40CF1020I5 - Stratix GX FPGA, 41,250 LEs, 1020-BGA | Altera
MPN: EP1SGX40CF1020I5 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $462.5 | $4,625.00 |
| 100 | $425 | $42,500.00 |
| 500 | $395 | $197,500.00 |
| 1,000 | $370 | $370,000.00 |
Drop-in alternatives for EP1SGX40CF1020I5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX40CF1020C5
✅ Drop-In📋 Reference alternative (not in catalog)
EP1SGX40CF1020C5N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1SGX40CF1020I5N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1SGX40GF1020I6
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP1SGX40GF1020C6
✅ Drop-In✓ In Stock
$360 / Unit
View Datasheet →EP1SGX40DF1020C6
✅ Drop-In✓ In Stock
$1620 / Unit
View Datasheet →EP1S40F1020C5
✅ Drop-In✓ In Stock
$165 / Unit
View Datasheet →EP1SGX40CF1020I5 Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Family | Stratix (first generation) |
| Logic Elements | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,125 |
| Total RAM Bits | 3,423,744 |
| Process Technology | CMOS |
| Supply Voltage (Core) | 1.5 V |
| Number of Transceivers | 624 (per DigiKey listing family variant) |
| Package Type | FBGA-1020 (FineLine BGA) |
| Package Dimensions | 33 mm x 33 mm |
| Ball Pitch | 1.0 mm |
| Operating Temperature | -40C to +100C (industrial, I suffix) |
| Mounting Type | Surface Mount |
| Configuration Memory | SRAM-based (external config device required) |
| Speed Grade | 5 |
| Device Family Suffix Decoding | C = standard logic, F = enhanced, I = industrial temp |
EP1SGX40CF1020I5 33 mm x 33 mm Pin Configuration Guide
Complete pinout information for EP1SGX40CF1020I5 (33 mm x 33 mm package) with [DATA_NEEDED: user I/O count] pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40CF1020I5.
Refer to the datasheet for full pin configuration.
Estimated pin count: [DATA_NEEDED: user I/O count] pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40CF1020I5 is suitable for 7 applications: 10 Gb Ethernet Line Card Aggregation, Optical Transport Network (OTN) Framer, Wireless Baseband Processing, High-Speed Serial Backplane Aggregation, Broadcast Video Routing and Switching, Radar and Defense Signal Processing Prototypes, Industrial Control and Test Equipment.
10 Gb Ethernet Line Card Aggregation
The EP1SGX40CF1020I5 is well suited to early-2000s 10 GbE line-card designs because it integrates 41,250 logic elements together with up to 3.125 Gbps multi-gigabit transceivers in a single die. Placed on the line card as the central MAC/framer, the FPGA aggregates traffic from multiple XAUI or XGMII ports and performs packet classification, policing, and queue management. Its 3,423,744 bits of TriMatrix on-chip SRAM are large enough to buffer line-rate bursts without external TCAMs, while dedicated DSP blocks accelerate CRC and encryption offload. Compared to a discrete SERDES-plus-ASIC solution, the Stratix GX reduces BOM and enables late-stage feature updates via SRAM-based configuration. Power-supply sequencing must respect the 1.5 V core rail ramp rate per the Stratix GX datasheet to avoid in-rush latch-up.
Recommended
Optical Transport Network (OTN) Framer
Telecom OTN framers require FEC (Reed-Solomon and/or turbo), mapping, and overhead processing at line rate. The EP1SGX40CF1020I5's combination of high logic density (41,250 LEs), embedded multipliers, and SERDES makes it an integrated OTN framer choice for OTU1/OTU2 rates. The FPGA runs the OTN framer state machine in fabric, while its on-chip RAM holds de-skew and FEC intermediate symbols, and the 3.125 Gbps transceivers interface to SFP+ optical modules directly. Compared to ASIC OTN framers, this Stratix GX delivers reconfigurability for evolving G.709 amendments. Board layout must isolate the 3.125 Gbps serializer outputs with 100-ohm differential impedance and length matching per Stratix GX layout guidelines.
Recommended
Wireless Baseband Processing
Wireless base station prototypes and picocell baseband cards benefit from the EP1SGX40CF1020I5's DSP block count and SERDES channels. Implemented as the baseband DSP engine, the FPGA runs FFT/iFFT, channel estimation, and MIMO matrix math on chip, exploiting the dedicated multiplier blocks for QAM demodulation. The 41,250 LEs handle the control plane and CPRI/OBSAI framer glue, while the multi-gigabit transceivers connect to the radio unit over a CPRI link. Industrial temperature grade (-40 to +100C) allows placement inside outdoor radio units. Compared to a DSP+ASIC pair, this approach shortens development cycles from years to months and allows field upgrades as 3GPP releases evolve.
Recommended
High-Speed Serial Backplane Aggregation
In AdvancedTCA or proprietary backplane routers, the EP1SGX40CF1020I5 acts as a switch-fabric glue, aggregating Serial RapidIO or custom LVDS links. Each multi-gigabit transceiver interfaces to a backplane lane at 1.25-3.125 Gbps, while the 41,250 logic elements implement the routing/scheduling fabric. Industrial temperature range and 1.5 V core operation suit controlled-environment telecom racks. Designers must follow Altera's pinout guide for the FBGA-1020 to ensure proper assignment of the dedicated transceiver reference-clock pins (GXB_REFCLK) for jitter compliance.
Recommended
Broadcast Video Routing and Switching
Broadcast video routers (SDI at 270 Mbps, HD-SDI at 1.485 Gbps, 3G-SDI at 2.97 Gbps) map directly onto the EP1SGX40CF1020I5's SERDES capability. The device can de/embed up to 16 channels of HD-SDI per direction while the FPGA fabric handles crosspoint switching, audio de-embedding (AES/EBU), and ancillary data processing. The 33 x 33 mm BGA keeps PCB area manageable for 1U router frames. Engineers should allocate PLL and clock-tree resources carefully because each SDI channel needs a dedicated low-jitter reference per SMPTE 259M/292M.
Recommended
Radar and Defense Signal Processing Prototypes
Defense prototyping labs adopt the EP1SGX40CF1020I5 for radar pulse compression, moving target indication, and electronic-warfare channelization. The 41,250 logic elements plus dedicated multipliers implement FFT-based processors in the multi-MHz range, and the SERDES channels accept digitized IF directly from high-speed ADCs. Industrial temperature grade suffices for many platform installations but full -55C to +125C MIL operation is not officially supported - mission-critical builds require derating or screening. Compared to ASIC implementations, the FPGA enables rapid algorithm updates against new threat libraries.
Recommended
Industrial Control and Test Equipment
Automated test equipment (ATE) and high-end industrial controllers can leverage the EP1SGX40CF1020I5 as a custom timing-pattern generator or protocol exerciser. With 41,250 LEs, designers implement IEEE-488, parallel LVDS interfaces, and proprietary backplane protocols in fabric, while the SERDES drives gigabit serial to/from the DUT. The industrial temperature grade suits factory-floor environments. New designs should consider the obsolete lifecycle and choose modern Intel Cyclone 10 or Stratix 10 with a 33 mm-equivalent BGA footprint to ease migration.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40CF1020I5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40CF1020C5 | EP1SGX40GF1020I6 | EP1S40F1020C5 |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| Package | FBGA-1020 (33x33 mm, 1 mm pitch) | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 |
| Total RAM Bits | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 |
| Multi-Gigabit Transceivers | Yes (up to 3.125 Gbps) | Yes | Yes | No (plain Stratix) |
| Speed Grade | -5 | -5 | -6 (faster) | -5 |
| Operating Temperature | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Configuration Memory Required | Yes (SRAM-based) | Yes | Yes | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Higher LE density vs EP1S30 and EP1S25 variants in same package class (vs EP1S30F1020C5 / EP1S25F1020C5)
- Multi-gigabit transceivers integrated on-die (vs EP1S40F1020C5)
- Speed grade -5 with timing margin for industrial operation (vs EP1SGX40GF1020I6)
- Industrial temperature grade vs commercial C-suffix alternatives (vs EP1SGX40CF1020C5)
Design Notes
The FBGA-1020 package at 1.0 mm pitch requires an 8+ layer PCB stack-up with buried microvias or via-in-pad for breakout. Estimated: a 4-layer board can route power and ground but cannot escape the full BGA-1020 within reasonable via costs; budget for a 10-layer or higher stack-up. Reference the Altera AN 75 (Stratix GX Hardware Design) for via-pattern recommendations. Keep all high-speed transceiver differential pairs length-matched to within 5 mils to meet jitter budgets at 3.125 Gbps.
The EP1SGX40CF1020I5 has separate VCCINT (1.5 V core), VCCIO (I/O bank voltage), VCCA_PLL (PLL analog supply), and VCC_GXB (transceiver analog supply) rails. Estimated: total power at full utilization approaches 15-25 W. Use a dedicated LDO for each analog rail, separate bulk and decoupling capacitors, and ensure the VCCINT ramp rate stays within Altera's specified 100 us - 100 ms window to avoid in-rush current latch-up.
Because the EP1SGX40CF1020I5 is obsolete, do not commit new designs to it unless you have a multi-year parts continuity plan. Verify configuration memory availability (EPC16/EPCS family is also obsolete), JTAG header for in-system updates, and a fallback PCB variant on a smaller or newer FPGA. Always order with date-code recency specified to avoid counterfeit risk, and request CoC and X-ray inspection on each lot.
Place a JTAG header (IEEE 1149.1) accessible at the board edge for in-system programming and boundary-scan. Reference the Quartus II 7.x JTAG Configuration Center for recommended pull-up/pull-down resistor values on TCK, TMS, TDI, and TDO. Add a configuration-error LED tied to the nCONFIG/nSTATUS pins to assist field diagnostics and a CONF_DONE indicator for programming-state visibility.
For 3.125 Gbps SERDES channels, follow Altera's high-speed layout guidelines: 100-ohm differential impedance, AC-coupled interconnects, and continuous reference planes. Decoupling on each VCC_GXB pin must use a 0.1 uF + 0.01 uF + 10 uF capacitor triple per pin or the recommended grouping. Estimated: total decoupling capacitance on VCC_GXB exceeds 200 uF for the full transceiver bank. Channel-to-channel skew tolerance must be extracted from the Quartus II timing analyzer.
Compliance Information
RoHS and lead-free confirmed for the N-suffix variants per Altera/Intel legacy product declarations. REACH and halogen-free status not formally documented for this obsolete part; verify with distributor CoC. AEC-Q100 not applicable to FPGAs (auto-grade FPGAs are qualified separately).
