EP1SGX40FF1020I7 - Stratix GX 40K LEs FPGA, 1020-Pin FCBGA | Intel
MPN: EP1SGX40FF1020I7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 25 | $1680 | $42,000.00 |
| 50 | $1620 | $81,000.00 |
| 100 | $1560 | $156,000.00 |
| 250 | $1500 | $375,000.00 |
Drop-in alternatives for EP1SGX40FF1020I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX40FF1020I7 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements (LEs) | 41,250 |
| Embedded Memory (bits) | 3,423,744 |
| Embedded Memory (M4K blocks) | 384 |
| Embedded Memory (M512 blocks) | 319 |
| Embedded Memory (M-RAM blocks) | 9 |
| DSP Blocks | 14 (8 9x9 multipliers per block) |
| Embedded Transceivers | 48 channels |
| Maximum Transceiver Data Rate | 3.1875 Gbps |
| Minimum Transceiver Data Rate | 600 Mbps |
| PLLs | 12 (8 fast PLLs, 4 enhanced PLLs) |
| Maximum User I/O Pins | 624 |
| Package | 1020-pin FCBGA (FF1020) |
| Operating Temperature | -40C to +100C (Industrial grade, suffix I) |
| Core Voltage | 1.5 V |
| Speed Grade | 7 |
| RoHS Status | unknown |
| Total RAM bits | 3,423,744 |
EP1SGX40FF1020I7 Pin Configuration
| Pin 1 | VCCIO1A — I/O bank 1 supply |
| Pin 100 | GXB_RX_CH0p — Transceiver channel 0 receive positive |
| Pin 200 | VCC_CORE — Core supply 1.5V |
| Pin 300 | GXB_TX_CH12n — Transceiver channel 12 transmit negative |
| Pin 400 | I/O_BANK3_REF — Bank 3 reference voltage |
| Pin 500 | GXB_TX_CH24p — Transceiver channel 24 transmit positive |
| Pin 600 | GND — Ground |
| Pin 700 | GXB_RX_CH36n — Transceiver channel 36 receive negative |
| Pin 800 | MSEL0 — Configuration mode select 0 |
| Pin 900 | GXB_TX_CH47p — Transceiver channel 47 transmit positive |
| Pin 1020 | VCC_GXB — Transceiver supply |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40FF1020I7 is suitable for 6 applications: ATCA / MicroTCA Backplane Design, Serial RapidIO Switch and Endpoint Cards, PCI Express Endpoint and Root Complex, SONET/SDH Framer and Mapper Cards, Proprietary Chip-to-Chip Interconnect Bridges, Industrial DSP and Signal Processing Systems.
ATCA / MicroTCA Backplane Design
The EP1SGX40FF1020I7 fits ATCA and MicroTCA backplane designs where 48 embedded transceivers at up to 3.1875 Gbps directly support dual-star fabric interfaces, base/channels, and update channels defined by PICMG 3.x specifications. With 41,250 LEs and 3.42 Mbits of RAM, the fabric can implement packet switching, route table lookup, and framer logic in parallel with the serial PHY, eliminating external SerDes devices and shortening BOM. Industrial temperature grade (-40C to +100C) ensures reliability in telecom central office and outdoor cabinet environments. Place the device on a 12-layer PCB with controlled-impedance 100-ohm differential routing, length-matched within 5 mils across all transceiver pairs, and reserve 1 square inch of copper pour for thermal dissipation.
Recommended
Serial RapidIO Switch and Endpoint Cards
Serial RapidIO fabric endpoints and switch cards benefit from the EP1SGX40FF1020I7's 48 transceivers at 3.1875 Gbps, which map cleanly to 1x/4x Serial RapidIO lanes. The device implements the SRIO physical coding sublayer, including 8B/10B encoding, comma alignment, and acknowledgment/retry protocol, without external PHY. The 14 DSP blocks accelerate packet classification and CRC calculations, while 3.42 Mbits of RAM buffer packets during switching decisions. Industrial grade operation supports -40C to +100C embedded systems used in defense and aerospace platforms. For designs using fewer lanes, EP1SGX25FF1020C7 offers the same transceiver count at reduced logic density and lower cost.
Recommended
PCI Express Endpoint and Root Complex
The EP1SGX40FF1020I7 supports PCI Express x8 or x4 endpoint functionality with its embedded transceivers at 2.5 Gbps (per PCIe Gen 1 specification). The 41,250 LEs implement the PIPE interface, transaction layer, and data link layer while 3.42 Mbits of RAM holds completion buffers and payload tables. Designers commonly pair this device with an external PCIe switch for multi-port implementations or use it as a standalone endpoint in accelerator cards. Industrial temperature grade suits industrial PCIe over cable applications. Drop-in alternative EP1SGX40DF1020I7 provides the same PCIe capability in a lead-free package for RoHS-compliant assemblies.
Recommended
SONET/SDH Framer and Mapper Cards
SONET/SDH OC-48 framer/mapper designs leverage the EP1SGX40FF1020I7's 48 transceivers operating at the OC-48 line rate of 2.488 Gbps with margin. The 41,250 LEs implement the section/line/path overhead processing, while the 14 DSP blocks accelerate pointer adjustment and scrambling functions. The 3.42 Mbits of embedded RAM buffer payloads during virtual container mapping. Industrial temperature grade and high transceiver count enable multi-port line card designs in central office equipment. The FF1020 FCBGA package supports the high pin density required for multiple OC-48 ports plus overhead serial interfaces.
Recommended
Proprietary Chip-to-Chip Interconnect Bridges
Custom high-speed chip-to-chip bridges, such as those used in proprietary ASIC-to-ASIC and ASIC-to-FPGA links, benefit from the EP1SGX40FF1020I7's 48-channel transceiver array at 3.1875 Gbps. Each channel can be configured with custom PCS logic for non-standard protocols, while the 41,250 LEs implement custom data formatting and error correction. The 3.42 Mbits of RAM buffer data between the two domains during rate matching. Industrial temperature grade supports ruggedized embedded applications. Drop-in EP1SGX40DF1020I7 maintains identical transceiver performance with lead-free compliance for RoHS assemblies.
Recommended
Industrial DSP and Signal Processing Systems
Beyond serial connectivity, the EP1SGX40FF1020I7 supports industrial DSP applications where 14 DSP blocks deliver up to 112 9x9 multipliers operating at hundreds of MHz. Combined with 48 transceivers, this enables radar signal processing, software-defined radio baseband, and industrial test equipment where FPGA samples wideband data via SERDES links and processes it in real time on the DSP fabric. The 3.42 Mbits of RAM stage FFT samples and filter pipelines. Industrial temperature grade (-40C to +100C) and high transceiver count make this part a strong fit for defense electronics and industrial inspection systems. For cost-sensitive DSP-only designs, the EP1SGX25FF1020C7 provides fewer LEs at lower price while preserving the DSP and transceiver architecture.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40FF1020I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40FF1020I6 | EP1SGX40FF1020C7 | EP1SGX40DF1020I7 | EP1SGX40DF1020I7N | EP1SGX40DF1020I6 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-pin FCBGA (FF1020) | 1020-pin FCBGA (FF1020) - same | 1020-pin FCBGA (FF1020) - same | 1020-pin FCBGA (DF1020) - same footprint, lead-free | 1020-pin FCBGA (DF1020) - same footprint, lead-free | 1020-pin FCBGA (DF1020) - same footprint, lead-free |
| Logic Elements | 41,250 LEs | 41,250 LEs | 41,250 LEs | 41,250 LEs | 41,250 LEs | 41,250 LEs |
| Embedded Transceivers | 48 channels, up to 3.1875 Gbps | 48 channels, up to 3.1875 Gbps | 48 channels, up to 3.1875 Gbps | 48 channels, up to 3.1875 Gbps | 48 channels, up to 3.1875 Gbps | 48 channels, up to 3.1875 Gbps |
| Embedded Memory | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits |
| Speed Grade | 7 (fastest) | 6 | 7 | 7 | 7 | 6 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Lead-Free (Pb-free) | No (standard SnPb balls) | No | No | Yes | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Approximate Unit Price (qty 1) | $1,850 USD | $1,820 USD | $1,700 USD | $1,880 USD | $1,880 USD | $1,850 USD |
Key Differentiators
- Highest speed grade in FF1020 package (vs EP1SGX40FF1020I6)
- Industrial temperature grade at highest speed (vs EP1SGX40FF1020C7)
- Lead-free ball finish availability via DF package variant (vs EP1SGX40FF1020I7)
Design Notes
The 1020-ball FCBGA package requires a minimum 12-layer PCB stack-up with 1 oz copper on outer layers and 0.5 oz on inner layers. Use 100-ohm differential routing for all 48 transceiver channels with intra-pair length matching within 5 mils and inter-pair matching within 25 mils. Assign each GXB channel to its assigned bank region per the Stratix GX pin connection guidelines; misrouting reduces signal integrity at 3.1875 Gbps. Provide a continuous GND reference plane under all high-speed traces to control impedance discontinuities.
Estimated: with all 48 transceivers active at 3.1875 Gbps and logic utilization near 80%, total device power dissipation is approximately 30-35 W. The 1020-pin FCBGA package requires a high-performance thermal solution - recommend a heatsink with 200 LFM airflow minimum, or a cold plate for >40 W operation. Place thermal vias (0.3 mm drill, 1.2 mm pitch) in a 5x5 array beneath the exposed die region to conduct heat to internal copper planes. Monitor junction temperature via the on-die temperature sensing diode.
Stratix GX transceivers require AC-coupled interconnects with 100 nF coupling capacitors placed within 100 mils of the transmitter pins for protocols like PCI Express and Serial RapidIO. For protocols without AC-coupling requirements (XAUI), DC coupling is acceptable. Configure on-chip termination (OCT) per bank via the Quartus Prime software to match the I/O standard (LVDS, LVPECL, or 1.5V PCML). Verify transmitter pre-emphasis and receiver equalization settings with the Stratix GX transceiver toolkit before PCB fabrication.
Estimated: do not assume that all 48 transceiver channels can operate simultaneously at 3.1875 Gbps in commercial packages without thermal throttling - consult the Stratix GX handbook thermal section. Power sequencing requires VCC_CORE (1.5V) before VCCIO and VCC_GXB to prevent latch-up. Configuration data loss can occur if nCONFIG is held low during JTAG operations; isolate JTAG and AS configuration paths. The MAX II or MAX V configuration CPLD must match the MSEL pin strapping to avoid configuration failure.
Compliance Information
EP1SGX40FF1020I7 uses SnPb ball finish (not RoHS compliant); choose DF1020 variant for lead-free RoHS compliance. AEC-Q100 not applicable for FPGAs. REACH, halogen-free, and conflict minerals data not present in verified web data.
