EP1SGX25FF1020CS - Stratix GX FPGA, 25660 LE, 1020-BGA | Intel
MPN: EP1SGX25FF1020CS ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
Drop-in alternatives for EP1SGX25FF1020CS — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1SGX25FF1020C7N
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View Datasheet →EP1SGX25FF1020CS Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Logic Array Blocks (LABs) | 2566 |
| User I/Os | 607 |
| Process Node | 130 nm |
| Core Voltage | 1.5 V |
| Package | 1020-ball FC-FBGA |
| Mounting Type | Surface Mount |
| Embedded Transceivers | Yes (Stratix GX feature) |
| Operating Temperature Grade | Commercial (0C to +85C, 'C' suffix) |
| Speed Grade | 'S' suffix per Altera nomenclature |
| Configuration | Serial / JTAG (per Stratix GX family) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Lifecycle | Obsolete (legacy Stratix GX family) |
EP1SGX25FF1020CS 1020-ball fc-fbga Pin Configuration Guide
Complete pinout information for EP1SGX25FF1020CS (1020-ball fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25FF1020CS.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25FF1020CS is suitable for 6 applications: Gigabit Ethernet Line Card, PCI Express Endpoint Card, Serial RapidIO Backplane Aggregation, Telecom Framer / Mapper ASIC Prototyping, Industrial Image Processing Pipeline, ASIC Emulation Platform.
Gigabit Ethernet Line Card
The EP1SGX25FF1020CS is well suited to gigabit Ethernet line-card designs because its embedded Stratix GX transceivers natively support 1.25 Gbps serial rates required by 1000BASE-X and SGMII. The 25,660 logic elements provide ample parallel fabric for MAC-layer processing, while the 607 user I/Os expose sufficient parallel bandwidth for switch-fabric hand-off. Placed on a line-card PCB with external PHY or clock-cleanup devices, the part implements complete L2 switching pipelines. Unlike later Stratix II/IV/10 GX families, the original Stratix GX trades higher power for design maturity and ample legacy IP cores.
Recommended
PCI Express Endpoint Card
The EP1SGX25FF1020CS supports PCI Express x4/x8 endpoint implementations because the Stratix GX embedded transceivers cover the 2.5 Gbps PCIe Gen1 signaling rate with required electrical compliance. The 25,660 logic-element fabric is sufficient for endpoint controller state machines, DMA engines, and application-layer payload handling. Designers pair the device with an external 100 MHz reference clock and PCIe edge connector per the card-electromechanical specification. Compared with newer Gen2/Gen3-capable FPGAs, this part is preferred only for legacy-validated endpoint designs.
Recommended
Serial RapidIO Backplane Aggregation
The EP1SGX25FF1020CS can aggregate multiple Serial RapidIO (sRIO) lanes because the Stratix GX transceivers operate at the 1.25/2.5/3.125 Gbps rates specified by the sRIO physical layer. The 25,660 LE fabric holds the logical-layer transport engine, while the 607 user I/Os route parallel payload to the host processor or switch ASIC. Placed between the backplane connector and the host CPU, the FPGA concentrates multiple sRIO lanes into a single high-bandwidth port. The 130 nm process node gives stable timing closure for legacy sRIO silicon IP cores.
Recommended
Telecom Framer / Mapper ASIC Prototyping
Telecom OEMs use the EP1SGX25FF1020CS to prototype framers and mappers because the Stratix GX transceivers implement OC-48/STM-16 (2.488 Gbps) and OTU1 rates directly. The 25,660 LE logic capacity models the framer state machine, while 607 user I/Os expose backplane tributaries. Verification teams often run production bitstreams on this part before tape-out of the equivalent ASIC, shortening time-to-market. The 130 nm process node gives deterministic timing suitable for SONET/SDH jitter budgets.
Recommended
Industrial Image Processing Pipeline
The EP1SGX25FF1020CS supports high-throughput image processing because its 25,660 logic elements implement parallel pixel pipelines and the 607 user I/Os accept multi-channel camera-link or LVDS inputs. Industrial vision systems use the FPGA to perform Bayer demosaicing, color-space conversion, and real-time object detection at line rates. The part's commercial temperature grade (0C to +85C from the 'C' suffix) suits factory-floor deployments. The Stratix GX transceivers can additionally drive CoaXPress or GigE Vision serial outputs for downstream recorders.
Recommended
ASIC Emulation Platform
Logic-emulation vendors deploy the EP1SGX25FF1020CS because the 25,660 logic elements model a meaningful slice of an ASIC design while preserving pin compatibility with the 1020-ball FC-FBGA for multi-FPGA partitioning. The Stratix GX transceivers enable high-speed chip-to-chip links between FPGAs in the emulator, replicating ASIC timing paths. Commercial temperature grade is acceptable for emulation racks in climate-controlled rooms. The 130 nm process node is mature and well-characterized for stable emulation behavior.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25FF1020CS — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25FF1020C7N | EP1SGX25FF1020C6N | EP1SGX25FF1020C5N | EP1SGX25FF1020C6ES | EP1SGX25FF1020 |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Logic Array Blocks (LABs) | 2566 | 2566 | 2566 | 2566 | 2566 | 2566 |
| User I/Os | 607 | 607 | 607 | 607 | 607 | 607 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | CS (commercial, specific bin) | C7 (faster) | C6 | C5 (slower) | C6 + enhanced screening | Base (no specific speed bin) |
| Embedded Transceivers | Yes (Stratix GX) | Yes (same) | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
| Lifecycle | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Original Stratix GX silicon with embedded multi-gigabit transceivers (vs EP1S25F1020C7 (base Stratix, no transceivers))
- Largest LE density in the Stratix GX family (vs EP1SGX10CF672C7 (smaller Stratix GX))
- Mature legacy IP ecosystem (vs Stratix II GX (EP2SGX) newer family)
Design Notes
The EP1SGX25FF1020CS is a 130 nm Stratix GX part with substantial static and dynamic power. In a typical telecom line-card design with all transceivers active, junction temperature can approach 100C without airflow. Use a thermal pad or heatsink attached to the FC-FBGA top side, and verify junction temperature against the commercial 0C to +85C operating window (industrial variants C7N/C6N are recommended for harsher environments).
The 1020-ball FC-FBGA requires a high-layer-count PCB stack-up (typically 8-12 layers) with microvia or stacked-via technology to fan out the 1.0 mm ball pitch. Match the impedance of transceiver differential pairs to 100 ohm differential with controlled-length tuning for multi-gigabit rates. Provide a continuous ground reference plane under the BGA to minimize return-path discontinuities.
Do not assume that any EP1SGX25FF1020 speed-grade variant is timing-compatible with another without re-running the Quartus fitter. Although all listed alternatives share the same silicon and ball-map, the 'CS' speed grade is a specific commercial-temp bin and may differ in Fmax from C5/C6/C7. Re-validate timing closure after substitution, especially on transceiver-side paths.
Decouple the EP1SGX25FF1020CS core supply (VCCINT at 1.5 V) with bulk tantalum plus 0.1 uF and 0.01 uF ceramic capacitors placed as close as possible to each power pin group. Transceiver supplies (VCCA, VCCP) require separate analog/digital filtering. A sequenced power-up controller is recommended to avoid latch-up during VCCINT/VCCIO ramp.
Compliance Information
RoHS and lead-free per Altera/Intel product page for legacy Stratix GX family. AEC-Q100 not applicable for FPGAs; halogen-free and conflict-minerals status not explicitly stated in the verified data.
