EP1SGX40GF1020I8 - 40GF1020I Stratix GX FPGA, 1020-BBGA | Altera
MPN: EP1SGX40GF1020I8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1320 | $13,200.00 |
| 100 | $1180 | $118,000.00 |
| 250 | $1050 | $262,500.00 |
| 500 | $950 | $475,000.00 |
Drop-in alternatives for EP1SGX40GF1020I8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX40GF1020I7N
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View Datasheet →EP1SGX40GF1020I8 Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Logic Elements | 41250 |
| Number of LABs/CLBs | 4125 |
| Total RAM Bits | 3423744 |
| Number of I/O | 624 |
| High-Speed Transceivers | 4 to 20 (622 Mbps to 3.1875 Gbps) |
| Core Voltage | 1.5 V |
| Process Technology | 0.13 µm |
| Package | 1020-BBGA (flip-chip) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 °C to +100 °C (Industrial) |
| Speed Grade | I8 (Industrial, slowest) |
| RoHS Status | unknown |
| Lifecycle | Obsolete - replaced by Stratix II GX / Stratix IV GX |
EP1SGX40GF1020I8 Pin Configuration
| Pin A1 | GND — Ground reference |
| Pin A20 | VCC — 1.5 V core supply |
| Pin AA1 | GXB_RX0 — Transceiver channel 0 receive positive |
| Pin AA2 | GXB_RX0_n — Transceiver channel 0 receive negative |
| Pin B1 | VCCIO1 — I/O bank 1 supply |
| Pin B20 | VCCIO2 — I/O bank 2 supply |
| Pin AB1 | GXB_TX0 — Transceiver channel 0 transmit positive |
| Pin AB2 | GXB_TX0_n — Transceiver channel 0 transmit negative |
| Pin AC1 | REFCLK_p — Transceiver reference clock positive |
| Pin AC2 | REFCLK_n — Transceiver reference clock negative |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40GF1020I8 is suitable for 7 applications: 10 Gigabit Ethernet Line Card, Multi-Gigabit Serial Backplane, SONET/SDH Framer and Mapper, PCI Express Bridge and Endpoint, Test and Measurement Prototyping, POS-PHY Level 4 Interconnect, DDR SDRAM Controller Interface.
10 Gigabit Ethernet Line Card
The EP1SGX40GF1020I8 fits 10 Gigabit Ethernet line-card designs because it integrates 20 transceivers capable of 3.1875 Gbps that can be aggregated via XAUI or serial 10G with soft logic. The 41,250 logic elements and 3.4 Mbit TriMatrix memory provide MAC, PCS, and rate-matcher headroom, while IEEE 802.3 clause 36 idle handling is built into the PMA hard IP. Place the device near SFP+ cages with matched-length differential routing for each channel.
Recommended
Multi-Gigabit Serial Backplane
Backplane routers and ATCA chassis leverage the EP1SGX40GF1020I8's embedded CDR/PMA with 8B/10B encoding for switch-fabric interconnect across serial links at 2.5 Gbps and above. The 624 user I/O provide ample parallel GPIO for sideband signaling, while the 1020-BBGA's high pin density supports dense channel routing. Industrial temperature grade suits outdoor or unconditioned central-office deployments where cooling is limited.
Recommended
SONET/SDH Framer and Mapper
Telecom framer designs use the EP1SGX40GF1020I8 for OC-48/STM-16 and OC-192/STM-64 mappings because the transceiver block supports SONET-compliant scrambling and clock compensation. The 41,250 logic elements run the framer state machine, pointer processor, and overhead insertion in soft logic, while hard SERDES handles the optical-side bit timing. Industrial temperature range ensures operation in central-office racks without active cooling.
Recommended
PCI Express Bridge and Endpoint
The EP1SGX40GF1020I8 implements PCI Express endpoints and bridge silicon using the Stratix GX hard IP core. Eight lanes of PCIe can be supported by aggregating four transceiver channels per link, leaving the remaining logic for endpoint controllers, DMA engines, and BAR mapping. The 1020-BBGA package provides sufficient I/O for downstream local buses and DDR SDRAM interfaces.
Recommended
Test and Measurement Prototyping
Test equipment vendors prototype multi-gigabit serial analyzers using the EP1SGX40GF1020I8 on the Stratix GX Development Board. The combination of pattern generators, error counters, and protocol analyzers fits comfortably in the 41,250 logic elements, while the 20 transceivers allow simultaneous multi-link analysis. Quartus II with SignalTap II logic analyzer enables real-time protocol observation in the lab.
Recommended
POS-PHY Level 4 Interconnect
POS-PHY Level 4 packet interfaces for network processors pair naturally with the EP1SGX40GF1020I8 because the transceiver rates cover the 1.0 Gbps to 3.1875 Gbps range used by SPI-4.2. The TriMatrix memory acts as a packet buffer between the network processor and the FPGA's framer logic. Industrial temperature grade supports telco central-office installations where ambient air may exceed 60 °C.
Recommended
DDR SDRAM Controller Interface
High-performance memory subsystems use the EP1SGX40GF1020I8's 624 I/O to interface to double data rate SDRAM at rates up to 200 MHz per pin. The 3.4 Mbit embedded memory can implement FIFO and read/write buffering between the soft DDR controller and the transceiver block. Industrial temperature rating suits factory-automation backplanes and outdoor telecom enclosures.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40GF1020I8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40GF1020I7N | EP1SGX40GF1020I7 | EP1SGX40GF1020I6N | EP1SGX40GF1020I6 | EP1SGX40GF1020I5 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-BBGA | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same |
| Logic Elements | 41250 | 41250 | 41250 | 41250 | 41250 | 41250 |
| Speed Grade | I8 (industrial, slowest) | I7N (faster) | I7 (faster) | I6N (faster, lead-free) | I6 (commercial, faster) | I5 (fastest) |
| Transceivers | 4 to 20 | 4 to 20 (same) | 4 to 20 (same) | 4 to 20 (same) | 4 to 20 (same) | 4 to 20 (same) |
| Total RAM Bits | 3423744 | 3423744 | 3423744 | 3423744 | 3423744 | 3423744 |
| User I/O | 624 | 624 | 624 | 624 | 624 | 624 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Qty-1 Price (USD, as of 2026-09-07) | 1450.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Industrial speed grade I8 with maximum timing margin (vs EP1SGX40GF1020I7N)
- Same 1020-BBGA package across all I-series grades (vs EP1SGX40CF672 series)
- Built-in 8B/10B encoder/decoder and GigE rate matcher (vs EP1SGX40DF1020 series)
Design Notes
Do not assume the EP1SGX40GF1020I8 is in active production. As of 2026-09-07 the part is obsolete and only available from independent distributors with long lead times (typically 6-10 weeks). New designs should target Stratix II GX (EP2SGX) or Stratix IV GX (EP4SGX) active families. Confirm factory stock before committing to PCB layout, because substituting to EP1SGX40GF1020I6N or I5N is the only way to keep the same BGA footprint on legacy boards.
Estimated: 1020-BBGA high-speed transceiver balls require length-matched differential routing to within 5 mil across each pair. Use a 100-ohm differential impedance stack-up with reference planes on layer 2 for all GXB_RX/TX pairs. Place AC-coupling capacitors within 250 mil of the receiver balls, and provide a clean REFCLK distribution with Pi-network termination to avoid jitter degradation in the 3.1875 Gbps channels.
The 1020-BBGA flip-chip package dissipates approximately 6-9 W at full transceiver utilization with all 20 channels active. Recommended thermal management includes a minimum 4-layer PCB with solid ground/power planes, an exposed heat-spreader footprint, and airflow of 200 LFM or more in industrial temperature deployments. Industrial-grade parts at +100 °C junction require derating beyond 80 °C ambient; place a thermistor under the BGA for thermal monitoring.
Power sequencing requires VCCINT (1.5 V core) to ramp before VCCIO (I/O bank) supplies; otherwise latch-up may occur. Place decoupling capacitors (1 µF + 0.1 µF per VCC pin) within 100 mil of each BGA ball and a bulk 47 µF tantalum on each supply rail. Use independent ferrite beads between VCCINT and VCCIO planes to minimize noise coupling into the transceiver channels.
Recommended PCB stack-up: 8 or more layers with dedicated ground planes on layers 2 and 7. Route high-speed transceivers on layers 3 and 6 only, using buried microstrip or stripline geometry. Confirm via-in-pad plating for BGA escape routing and use laser-drilled microvias (8 mil pad, 4 mil drill) to escape the 1 mm pitch BGA array.
Compliance Information
Lifecycle obsolete as of 2026-09-07. RoHS/REACH compliance data not found in Verified Web Data and flagged unknown. The 'N' suffix in I6N/I7N indicates lead-free finish per Altera naming convention; the I8 base suffix is unspecified.
