EP20K1000CF672C7ES - APEX 20KC FPGA 1M Gates 672-FBGA | Altera
MPN: EP20K1000CF672C7ES ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118 | $11,800.00 |
| 500 | $102 | $51,000.00 |
| 1,000 | $89.5 | $89,500.00 |
Drop-in alternatives for EP20K1000CF672C7ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K1000CF672C7
✅ Drop-In✓ In Stock
$158 / Unit
View Datasheet →EP20K1000CF672I7
✅ Drop-In✓ In Stock
$160 / Unit
View Datasheet →EP20K600CF672C7
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K400CF672C7
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K1000CF672C7ES Maximum Ratings & Electrical Characteristics
| Family | APEX 20KC |
| Logic Elements | 38400 |
| System Gates | 1000000 |
| Maximum Operating Frequency | 375.94 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage | 1.8 V |
| Package | 672-pin FC-FBGA |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature Grade | Commercial |
| Speed Grade | -7 |
| Configuration Interface | JTAG (IEEE 1149.1), Passive Serial, Passive Parallel |
| Embedded Memory | Embedded System Blocks (ESB) - dual-port RAM/CAM |
| Number of PLLs | 4 |
| MultiVolt I/O Support | Yes (1.8 V, 2.5 V, 3.3 V) |
| RoHS Status | unknown |
EP20K1000CF672C7ES 672-pin fc-fbga Pin Configuration Guide
Complete pinout information for EP20K1000CF672C7ES (672-pin fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K1000CF672C7ES.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K1000CF672C7ES is suitable for 7 applications: Telecommunications Line Card Interface Bridging, ASIC Prototyping and Emulation, Image and Video Processing Pipelines, Industrial Control and Factory Automation, High-Performance DSP Co-Processing, Legacy Avionics and Military Subsystem Maintenance, High-Speed External Memory Controller Hub.
Telecommunications Line Card Interface Bridging
The EP20K1000CF672C7ES fits telecom line-card bridging applications because its 1M-gate density and 672-ball FC-FBGA package expose enough user I/O to run parallel UTOPIA/SPI-3 bus interfaces, framer connections, and packet-classification datapaths on a single device. The APEX 20KC MultiVolt I/O banks support 3.3 V LVTTL directly to legacy framer chips while the 1.8 V core keeps power below 3 W at 100 MHz system clock. Embedded system blocks provide dual-port packet buffering between PHY and NPU without external SRAM, saving board area. The -7 speed grade delivers the Fmax headroom needed for OC-48 (155 MHz) and OC-192 (155 MHz over 16-bit) glue-logic paths.
Recommended
ASIC Prototyping and Emulation
Engineers use the EP20K1000CF672C7ES for ASIC prototyping because 1M system gates are sufficient to partition and emulate mid-complexity ASICs with up to ~500K usable gates plus testbench logic. The 38400 logic elements provide granular LUT-level mapping for accurate timing emulation, while embedded system blocks model SRAM and CAM macros without external memory. The 672-ball FC-FBGA exposes dedicated JTAG, passive-serial, and passive-parallel configuration ports so the prototype can be reloaded in seconds when iterating RTL. Quartus II supports the APEX 20KC family directly, allowing bitstream generation from synthesizable Verilog or VHDL. Typical prototyping runs use the -7 speed grade to maximize timing margin versus the target ASIC.
Recommended
Image and Video Processing Pipelines
The EP20K1000CF672C7ES is well-suited to mid-resolution image and video processing because its 1M gates support multi-stage pixel pipelines (color-space conversion, filtering, scaling) plus line buffers in embedded system blocks. The 672-ball FC-FBGA exposes enough user I/O for parallel RGB/YCbCr video buses (16-24 bits per channel) and SDRAM/DDR-SDRAM external memory interfaces at LVCMOS/SSTL signaling. Running at -7 speed grade, registered design paths reach ~250 MHz, comfortably supporting VGA (25 MHz pixel clock) and SDTV (27 MHz) with margin. MultiVolt I/O banks let the FPGA talk to 3.3 V video ADCs and 2.5 V DDR memory on the same board without level shifters.
Recommended
Industrial Control and Factory Automation
Industrial control applications benefit from the EP20K1000CF672C7ES because the APEX 20KC architecture combines 1M gates of deterministic LUT logic with embedded memory for recipe and state-table storage, eliminating an external MCU in many glue-logic controllers. The 672-ball FC-FBGA supports dozens of LVCMOS 24 V-tolerant GPIO pairs via external buffers for sensor and actuator interfacing. For industrial environments, the EP20K1000CF672I7 industrial-temperature variant extends operation from -40C to +100C while preserving the same 672-ball footprint. The 1.8 V core supply and 0.15 µm process give stable long-term operation in control cabinets where ambient temperatures reach 70-85C.
Recommended
High-Performance DSP Co-Processing
The EP20K1000CF672C7ES serves as a DSP co-processor in mixed-signal systems where a host CPU offloads FFT, FIR, and matrix-multiply kernels. Although the APEX 20KC has fewer dedicated DSP blocks than modern families, the 1M-gate density allows large custom datapaths with 16-bit multipliers implemented in fabric, and embedded system blocks hold coefficient tables with single-cycle access. The 672-ball FC-FBGA supports high-throughput parallel host interfaces (16/32-bit LVCMOS) and DDR memory at 133 MHz. At -7 speed grade, 16x16 multiplies and accumulators pipeline at ~150 MHz, suitable for radar-baseband, software-defined radio IF, and ultrasound beamforming pre-processing.
Recommended
Legacy Avionics and Military Subsystem Maintenance
The EP20K1000CF672C7ES remains in service on legacy avionics, naval, and military subsystems where the original equipment manufacturer certified the part against environmental and EMI standards. Its 1M-gate density supports multi-protocol avionics databuses (MIL-STD-1553, ARINC 429, RS-485) and signal-conditioning glue logic in a single device. Because these systems have 20+ year service lives, sustainment programs continue to procure EP20K1000CF672C7ES from authorized distributors as the manufacturer has declared the part obsolete. The -7 speed grade's deterministic timing simplifies DO-254 design assurance evidence packages that were originally generated against the part.
Recommended
High-Speed External Memory Controller Hub
The EP20K1000CF672C7ES works as a memory controller hub between multiple SRAM, DDR SDRAM, and QDR SRAM banks in networking and signal-processing equipment. The 672-ball FC-FBGA exposes enough user I/O to run 64-72-bit DDR memory buses plus parity/ECC, while MultiVolt I/O banks at 2.5 V SSTL drive DDR-SDRAM directly without external level shifters. Embedded system blocks implement FIFO queues between clock domains, and 4 PLLs generate the multiple phase-shifted clocks required by DDR read/write timing. The -7 speed grade meets DDR-266/333 controller timing with margin, and the 1M-gate density leaves room for ECC logic and address translation.
Recommended
Recommended Products Summary
Engineering reference data for EP20K1000CF672C7ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K1000CF672C7 | EP20K1000CF672I7 | EP20K600CF672C7 | EP20K400CF672C7 |
|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 672-pin FC-FBGA | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same |
| Family | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC |
| System Gates | 1,000,000 | 1,000,000 (same die) | 1,000,000 (same die) | 600,000 (-40%) | 400,000 (-60%) |
| Logic Elements | 38400 | 38400 | 38400 | 23040 | 15360 |
| Operating Temperature Grade | Commercial (0C to +85C) | Commercial | Industrial (-40C to +100C) | Commercial | Commercial |
| Speed Grade | -7 | -7 | -7 | -7 | -7 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest-density APEX 20KC in 672-ball FC-FBGA package (vs EP20K600CF672C7)
- Commercial temperature grade with identical die to industrial variant (vs EP20K1000CF672I7)
- 672-ball FC-FBGA vs older 652-ball BGA package compatibility (vs EP20K1000CB652C7ES)
Design Notes
The APEX 20KC core runs from a 1.8 V supply with separate VCCIO banks that can be powered at 1.8 V, 2.5 V, or 3.3 V. Decoupling requires a minimum of eight 0.1 µF ceramic capacitors placed adjacent to the package BGA balls, plus four bulk 47 µF tantalum or polymer capacitors near the four corners of the package. Estimated worst-case core current for EP20K1000CF672C7ES at 100% toggle activity with -7 speed grade is approximately 1.5 A; use a switching regulator with 3 A peak capability or a low-dropout linear regulator fed from a 3.3 V intermediate rail to avoid exceeding the 1.8 V tolerance window. Power-on sequencing must satisfy VCCINT before VCCIO with no more than 200 mV of reverse drive to prevent I/O latch-up.
The 672-ball FC-FBGA package has a junction-to-ambient thermal resistance θJA of approximately 14 C/W with a 4-layer JEDEC test board (4s2p with thermal vias). For full 1M-gate utilization at maximum toggle activity, expect roughly 2.5 W-3 W dissipation and a junction temperature rise of 35-45 C above ambient. In an enclosed industrial enclosure with 55 C ambient, ensure junction temperature stays below 100 C for commercial-grade reliability, which leaves roughly 50 C of margin at the typical dissipation. Use thermal-via arrays under the central BGA balls and copper pours on inner PCB layers to spread heat; avoid placing the device adjacent to a high-power DC-DC converter.
The 672-ball FC-FBGA ball pitch is 1.27 mm (Fine-pitch Chip-scale BGA). PCB land pads require NSMD (non-solder mask defined) copper with a diameter of 0.5 mm ± 0.05 mm and an opening of 0.45 mm in the solder mask. Escape routing on a 4-layer stack-up needs microvia (0.1 mm) in pad or via-in-pad techniques to fan out from inner rows; through-hole vias cannot escape between balls on this pitch. Use ENIG or immersion-silver surface finish to avoid pad oxidation. Place 0.1 µF decoupling capacitors on the back side of the BGA, connected via microvias to the inner-row power balls. Keep signal traces 50 Ω controlled-impedance for LVCMOS 3.3 V outputs at 50 MHz or above.
Three pitfalls are common when integrating EP20K1000CF672C7ES: (1) using the part in a new design without verifying long-term availability - Altera has declared it obsolete, so plan an Altium/Quartus migration path to Stratix or Cyclone families; (2) failing to level-shift JTAG signals to 1.8 V when using 3.3 V host MCUs for in-system programming - use a 74LVC245 or equivalent between the host and the TCK/TMS/TDO/TDI pins; (3) leaving configuration mode pins floating during power-up, which selects an undefined configuration scheme - strap MSEL pins to logic high or low through 10 kΩ pull-ups/pull-downs to select passive-serial configuration from a configuration PROM such as EPC16 or EPCS4.
Clock distribution on the EP20K1000CF672C7ES uses 4 PLLs, each supporting frequencies from 1.5 MHz to 462 MHz (depending on speed grade). Place the primary clock oscillator within 25 mm of a dedicated CLK input pin and route the trace with 50 Ω controlled impedance over a continuous ground reference plane. Avoid routing clock traces across power-plane splits or near I/O banks that toggle at high frequency. For DDR memory interfaces using SSTL-2 I/O standards, length-match the data, address, and strobe signals within ±25 mil and place series 33 Ω damping resistors at the FPGA outputs to suppress reflections.
Compliance Information
RoHS and REACH compliance not explicitly stated in the verified web data; Altera (Intel PSG) datasheet family-level documentation should be consulted. AEC-Q100 not applicable - this is an FPGA, not an automotive-qualified IC. Lead-free process confirmed per package finish convention. Halogen-free status not stated in retrieved data.
