EP20K1000CF672C7GZ - APEX 20KC 1M Gates FPGA | Intel | 672-BGA
MPN: EP20K1000CF672C7GZ ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $220.5 | $2,205.00 |
| 100 | $196 | $19,600.00 |
| 500 | $178.25 | $89,125.00 |
| 1,000 | $162.4 | $162,400.00 |
Drop-in alternatives for EP20K1000CF672C7GZ — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP20K1000CF672C7
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View Datasheet →EP20K1000CB652C8ES
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View Datasheet →EP20K1000CB652I8
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View Datasheet →EP20K1000CF672C7GZ Maximum Ratings & Electrical Characteristics
| Family | APEX 20KC |
| Series | APEX-20KC® |
| Manufacturer | Intel (formerly Altera) |
| System Gates | 1,000,000 |
| Logic Elements / Cells | 38,400 |
| Total RAM Bits | 327,680 |
| Number of I/O | 508 |
| Number of LABs/CLBs | 2560 |
| Number of EABs | 160 |
| Number of Logic Elements per EAB | 2048 bits |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V |
| I/O Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Package / Case | 672-FBGA (672-BBGA) |
| Supplier Device Package | 672-FBGA (27x27 mm, 1.27 mm pitch) |
| Mounting Type | Surface Mount |
| Speed Grade | C7 (7 ns pin-to-pin delay, commercial) |
| Operating Temperature | 0°C to +85°C |
| RoHS Status | Compliant |
| Lead Free | Yes |
| Process Technology | 0.15 µm CMOS |
EP20K1000CF672C7GZ 672-fbga (27x27 mm, 1.27 mm pitch) Pin Configuration Guide
Complete pinout information for EP20K1000CF672C7GZ (672-fbga (27x27 mm, 1.27 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K1000CF672C7GZ.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K1000CF672C7GZ is suitable for 6 applications: Telecommunications Line Card, Network Switch and Router Fabric, DSP Co-Processor Engine, Video Processing and Image Pre-Processing, High-Density Glue Logic Replacement, Protocol Bridging and Legacy Industrial Systems.
Telecommunications Line Card
The EP20K1000CF672C7GZ fits telecommunications line card designs because of its 1,000,000 system gates and 38,400 logic elements that can implement multiple parallel channels of T1/E1 framers, HDLC controllers, and ATM segmentation/reassembly engines. The 327,680 bits of embedded SRAM, distributed across 160 EABs, provide buffer space for cell/packet FIFOs without external memory, reducing BOM and PCB area. With 508 user I/O pins, the FPGA can interface to multiple TDM buses and backplane connectors simultaneously. The LVDS I/O support enables high-speed backplane signaling for inter-card communication. MultiVolt I/O allows direct connection to 1.8 V framers, 2.5 V switch fabrics, and 3.3 V line interface units without external level shifters. Engineers should ensure that I/O planning reserves sufficient pins for clock distribution and that the Quartus II timing analyzer closes timing at 7 ns pin-to-pin delay.
Recommended
Network Switch and Router Fabric
In network switch and router fabric designs, the EP20K1000CF672C7GZ delivers the logic density and I/O count needed for packet classification, header parsing, and queuing engines. Its 1 million gates support thousands of TCAM-emulating lookups or hash-based classifiers, while 508 user I/O pins connect to multiple gigabit Ethernet PHYs and switch ASICs in parallel. The 327 Kb of embedded dual-port SRAM (provided by APEX 20KC's enhanced EABs) enables high-throughput packet buffering at line rate. MultiVolt I/O simplifies interface to 1.8 V ASICs and 3.3 V PHYs from different vendors. Engineers targeting gigabit speeds should verify LVDS I/O availability and route high-speed signals with impedance-controlled differential pairs on the PCB.
Recommended
DSP Co-Processor Engine
The EP20K1000CF672C7GZ serves as a DSP co-processor in systems requiring hardware-accelerated FFT, FIR filtering, or convolution operations. Its 38,400 logic elements and 160 EABs implement parallel multiplier-accumulator arrays that outperform general-purpose DSP processors on data-path-bound workloads. Embedded memory bits (327 Kb total) hold coefficient tables and intermediate accumulators with single-cycle access. The 508 I/O count provides ample bus width for connecting to host DSP processors via 64-bit or wider external memory buses. APEX 20KC's enhanced EABs support true dual-port operation, allowing simultaneous read/write for pipeline-stage buffering. Engineers should use the Quartus II DSP Builder block set to map algorithm IP and verify that timing closure is met at the 7 ns C7 speed grade.
Recommended
Video Processing and Image Pre-Processing
The EP20K1000CF672C7GZ fits video processing and image pre-processing pipelines because of its high logic density and embedded memory bandwidth. With 38,400 logic elements, the device can implement parallel pixel-processing paths for de-interlacing, scaling, color-space conversion, and edge detection. The 327,680 bits of embedded SRAM buffer scan-line data without external memory, reducing latency and PCB complexity. Its 508 user I/O pins connect to video decoders, encoders, and DDR memory interfaces simultaneously. LVDS I/O enables direct connection to high-speed LVDS-based image sensors and display panels. MultiVolt I/O allows direct interfacing to 1.8 V image sensors and 3.3 V display drivers. Engineers should validate that bandwidth requirements fit within the APEX 20KC's internal interconnect and clock tree resources.
Recommended
High-Density Glue Logic Replacement
The EP20K1000CF672C7GZ can replace dozens of discrete logic ICs (74-series gates, muxes, registers) by integrating the entire glue logic into a single programmable device. Its 38,400 logic elements absorb complex address decoding, bus arbitration, interrupt steering, and protocol adaptation functions that would otherwise consume significant PCB area and power. The 508 I/O pins map to legacy 5 V and 3.3 V TTL logic levels, simplifying interface to existing ASICs, microcontrollers, and memory devices. Embedded EABs implement small FIFOs and look-up tables needed for protocol bridging. Engineers benefit from reduced BOM count, lower assembly cost, and the ability to update logic via in-system reprogramming rather than board respins. Quartus II legacy device support enables design capture with industry-standard HDL.
Recommended
Protocol Bridging and Legacy Industrial Systems
The EP20K1000CF672C7GZ is widely deployed in legacy industrial systems that require protocol bridging between modern interfaces (Ethernet, USB, PCIe) and field-bus protocols (Modbus, PROFIBUS, CAN, DeviceNet). Its 1 million gates implement protocol stacks in hardware with deterministic latency, and the 508 user I/O pins simultaneously drive multiple isolated serial ports, opto-coupled inputs, and relay outputs. The 327 Kb of embedded SRAM acts as message buffer space for store-and-forward protocol conversion. Commercial 0°C to +85°C temperature range covers most factory-floor enclosures. Engineers should note that APEX 20K EABs can implement small protocol state machines, and the 672-FBGA package provides mechanical robustness for industrial vibration profiles when properly PCB-mounted with adequate corner staking.
Recommended
Recommended Products Summary
Engineering reference data for EP20K1000CF672C7GZ — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K1000CF672C7 | EP20K1000CF672C7ES | EP20K1000CB652C9ES | EP20K1000CB652I8 |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA (27x27 mm) | 672-FBGA (27x27 mm) | 672-FBGA (27x27 mm) | 672-FBGA (different pin map) | 672-FBGA (different pin map) |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Embedded RAM (bits) | 327,680 | 327,680 | 327,680 | 327,680 | 327,680 |
| User I/O Pins | 508 | 508 | 508 | 488 (652-ball BGA) | 488 (652-ball BGA) |
| Speed Grade | C7 (7 ns) | C7 (7 ns) | C7 (7 ns) | C9 (slower) | I8 (industrial) |
| Operating Temperature | 0°C to +85°C (Commercial) | 0°C to +85°C (Commercial) | 0°C to +85°C (Commercial, ES) | 0°C to +85°C (Commercial, ES) | -40°C to +85°C (Industrial) |
| Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- High I/O count in FineLine BGA (vs EP20K1000CB652I8)
- Faster speed grade available (vs EP20K1000CB652C9ES)
- Extended screening variant available (vs EP20K1000CF672C7)
Design Notes
The APEX 20KC requires careful power sequencing: VCCINT (1.71-1.89 V) must reach 90% of nominal before VCCIO (1.8/2.5/3.3 V) begins to ramp to avoid I/O latch-up. Use a power supply with PG (power-good) output tied to the enable pin of the VCCIO regulator. Decouple every VCCINT ball with a 0.1 µF X7R ceramic capacitor placed within 5 mm of the ball, and add bulk decoupling of 100 µF tantalum + 47 µF ceramic per voltage plane. Estimated: at full utilization (38,400 LEs toggling at 100 MHz, 508 I/O switching), the device may draw up to 2.5 A from VCCINT; verify with Quartus II PowerPlay early in the design cycle to size regulators correctly.
The 672-FBGA package uses 1.27 mm ball pitch on a 27 mm × 27 mm body, requiring 6-layer or 8-layer PCB stack-up with microvia or via-in-pad technology for reliable fanout. Use a controlled-impedance stack-up with 50 Ω single-ended and 100 Ω differential trace geometry for LVDS signals. All BGA balls benefit from soldermask-defined (SMD) pads for better process control. Recommended: escape-route the inner rows on inner signal layers with staggered microvias, and dedicate outer layers to differential pairs. Apply corner staking or underfill if the board will experience mechanical shock or vibration in industrial environments.
Common pitfalls when designing with the EP20K1000CF672C7GZ: (1) Do not exceed the maximum I/O count of 508 - plan pin assignments in the Quartus II Pin Planner before schematic capture. (2) The C7 speed grade has 7 ns pin-to-pin delay - register-rich designs close timing more easily; combinational-heavy paths may fail. (3) The part is obsolete as of 2026-09-07 - design new products on Cyclone IV/V or MAX 10, and use this part only for sustaining legacy designs. (4) Configuration via passive serial, JTAG, or Altera EPC devices - ensure the configuration mode matches the system requirements. (5) The 327 Kb embedded SRAM is shared with logic resources; over-allocation of EABs reduces available LE count.
Compliance Information
RoHS compliant and lead-free per distributor product listings (Y-IC, Besenchips, infinity-electron) as of 2026-09-07. REACH compliance inferred from RoHS declaration. AEC-Q100 not applicable (FPGA is not automotive-qualified). Halogen-free and conflict minerals status not explicitly stated in available distributor data - set to 'unknown'.
