EP20K100FC324-3 - APEX 20K 100K Gates FPGA 324-FBGA | Intel
MPN: EP20K100FC324-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $73.53 | $73.53 |
| 10 | $67.5 | $675.00 |
| 100 | $58.2 | $5,820.00 |
| 500 | $49.75 | $24,875.00 |
| 1,000 | $42.1 | $42,100.00 |
Drop-in alternatives for EP20K100FC324-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP20K100FC324-2
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View Datasheet →EP20K100FC324-2V
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View Datasheet →EP20K100FC324-1
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View Datasheet →EP20K100FC324-1V
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View Datasheet →EP20K100EFC324-2X
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View Datasheet →EP20K100EFC324-1N
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View Datasheet →EP20K100FC324-3 Maximum Ratings & Electrical Characteristics
| Series | APEX 20K |
| Family | APEX 20K (non-KE) |
| System Gates | 100,000 |
| Logic Elements | 4,160 |
| Maximum Logic Blocks | 26 |
| Embedded Memory (RAM bits) | 53,248 |
| User I/O Pins | 252 |
| Total RAM bits | 53,248 |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| Maximum Internal Frequency | 167 MHz |
| Propagation Delay | 1.6 ns |
| Speed Grade | -3 (slowest) |
| Package | 324-pin FBGA (Fine-pitch BGA) |
| Package Body Size | 45 x 45 mm |
| Ball Pitch | 1.27 mm |
| Operating Temperature | 0 °C to 85 °C (Commercial) |
| Programming Interface | IEEE 1149.1 JTAG |
| Mounting Type | Surface Mount |
EP20K100FC324-3 45 x 45 mm Pin Configuration Guide
Complete pinout information for EP20K100FC324-3 (45 x 45 mm package) with 252 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K100FC324-3.
Refer to the datasheet for full pin configuration.
Estimated pin count: 252 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K100FC324-3 is suitable for 6 applications: Telecommunications Backplane Glue Logic, Industrial Control and Machine Automation, PCI Bus Bridge and Protocol Conversion, Embedded DSP Pre- and Post-Processing, Legacy Avionics and Military Signal Processing, Image and Video Pipeline Pre-Processing.
Telecommunications Backplane Glue Logic
The EP20K100FC324-3 fits telecommunications backplane glue logic because its 4,160 logic elements and 53,248 bits of embedded RAM provide enough capacity to bridge between legacy telecom buses (e.g. H.110, MVIP) and modern packet fabrics. The 252 user I/Os support multiple parallel bus interfaces simultaneously, while multi-voltage I/O compatibility (1.8 V, 2.5 V, 3.3 V, 5 V) eliminates external level shifters. Compared with discrete 74-series glue logic the FPGA reduces board area by an order of magnitude and allows late-stage protocol changes without PCB rework. Designers can hit 167 MHz internal fMAX comfortably at the -3 grade for typical 16-bit/32-bit bus multiplexing tasks.
Recommended
Industrial Control and Machine Automation
The EP20K100FC324-3 is well suited to industrial control and machine automation because its 324-FBGA package and 252 I/Os can absorb the discrete logic normally implemented in 74-series TTL/CMOS glue around microcontrollers and DSPs. The commercial 0-85 °C temperature range covers most factory-floor environments, and the embedded memory blocks can be configured as dual-port RAM for inter-task message passing between the FPGA fabric and a host processor. The -3 speed grade is sufficient for encoder decoding, PWM generation and deterministic state-machine control loops running at kHz-to-MHz rates. Industrial designers can also leverage the JTAG port for in-system firmware updates without removing the board from the machine.
Recommended
PCI Bus Bridge and Protocol Conversion
The EP20K100FC324-3 fits PCI bus bridge and protocol-conversion designs because its 4,160 logic elements are sufficient to implement a 32-bit/33 MHz PCI target or master interface plus custom peripheral logic in a single device. The 252 user I/Os handle PCI's 49-pin bus plus address/data/control pins for legacy ISA, VME or proprietary backplanes simultaneously. Embedded memory can buffer DMA descriptors and command queues, while the JTAG port supports pre-production boundary-scan and post-production in-system updates. The -3 grade is timing-feasible at 33 MHz PCI; engineers targeting 66 MHz PCI should select the -1 or -2 speed grade.
Recommended
Embedded DSP Pre- and Post-Processing
The EP20K100FC324-3 fits embedded DSP pre- and post-processing because the APEX 20K architecture's Embedded System Blocks (ESBs) can be configured as multipliers plus dual-port RAM, allowing distributed FIR/IIR filter implementations around a host DSP. The 53,248 RAM bits are sufficient to hold coefficient tables and line buffers for moderate-complexity audio or control DSP front-ends. The 252 user I/Os expose parallel host-processor buses (e.g. to TI TMS320 or Analog Devices SHARC), serial audio ports (I2S, TDM) and digital video buses. At 167 MHz internal fMAX the FPGA fabric can support audio sample rates up to 192 kHz with comfortable margin.
Recommended
Legacy Avionics and Military Signal Processing
The EP20K100FC324-3 fits legacy avionics and military signal-processing subsystems because the APEX 20K family was broadly adopted on MIL-STD-1553, ARINC 429 and similar avionics buses in the late 1990s and early 2000s, and qualified firmware/designs remain in service today. The commercial 0-85 °C temperature range suits equipment-bay installations; for harsher environments the -V suffix industrial variants (e.g. EP20K100FC324-2V) offer wider temperature coverage on the same FC324 footprint. The 252 user I/Os accept multiple ARINC/MIL-STD channels plus discrete discretes and analog monitoring signals. Franchised distributors such as Rochester Electronics support long-term continuity-of-supply for these long-life programs.
Recommended
Image and Video Pipeline Pre-Processing
The EP20K100FC324-3 fits image and video pipeline pre-processing because its embedded memory (53,248 RAM bits) can be configured as line buffers for progressive or interlaced video, while the 4,160 logic elements can implement color-space conversion, gamma correction, scaling and deinterlacing algorithms. The 252 user I/Os expose ITU-R BT.601/656 parallel video buses plus I2C camera configuration channels and synchronous DRAM interfaces. At 167 MHz internal fMAX the design can comfortably handle SDTV pixel rates (~27 MHz) and entry-level HDTV pixel rates. Engineers targeting full 1080p60 should migrate to APEX 20KE or Stratix families for additional logic and memory capacity.
Recommended
Recommended Products Summary
Engineering reference data for EP20K100FC324-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K100FC324-2 | EP20K100FC324-2X | EP20K100FC324-1 | EP20K100EFC324-2X | EP20K100EFC324-1N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-pin FBGA (45 x 45 mm) | 324-pin FBGA (45 x 45 mm) - same | 324-pin FBGA (45 x 45 mm) - same | 324-pin FBGA (45 x 45 mm) - same | 324-pin FBGA (45 x 45 mm) - same | 324-pin FBGA (45 x 45 mm) - same |
| Family | APEX 20K | APEX 20K | APEX 20K | APEX 20K | APEX 20KE | APEX 20KE |
| Speed Grade | -3 (slowest) | -2 (faster) | -2 + lead-free | -1 (fastest) | -2 (KE process) | -1 (KE process) |
| Logic Elements | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 (KE process) | 4,160 (KE process) |
| User I/Os | 252 | 252 | 252 | 252 | 252 | 252 |
| Embedded RAM | 53,248 bits | 53,248 bits | 53,248 bits | 53,248 bits | 53,248 bits | 53,248 bits |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 1.8 V (KE process) | 1.8 V (KE process) |
| Approx. Unit Price (qty 1) | $73.53 | Higher (~15-25 % premium over -3) | Higher (RoHS + -2 grade premium) | Highest (fastest speed grade premium) | Higher (KE family premium) | Highest (KE family + fastest grade) |
Key Differentiators
- Slowest commercial speed grade at the lowest unit price in the APEX 20K FC324 family (vs EP20K100FC324-2)
- Pin-compatible with all 324-FBGA APEX 20K/20KE FC324 family members (vs EP20K100EFC324-2X (APEX 20KE))
- Original 0.22 µm CMOS APEX 20K silicon (pre-20KE redesign) (vs EP20K100EFC324-2X (APEX 20KE at 0.15 µm))
Design Notes
The EP20K100FC324-3 is housed in a 324-pin FBGA package (45 x 45 mm body, 1.27 mm ball pitch) which has limited heat-dissipation capability compared with PQFP packages. For applications where the device is exercised continuously at high toggle rates (>100 MHz on many I/Os), provide at least a 4-layer PCB with a continuous ground plane directly beneath the BGA to spread heat. A junction-to-ambient thermal resistance (theta_JA) of approximately 15-20 °C/W on a 4-layer JEDEC test board is typical for large FBGA packages; de-rate by ~25 % for 2-layer boards. For high-utilization designs above 80 % logic element usage, add thermal vias under the central ground balls and consider a small heatsink or airflow.
When routing the 324-FBGA breakout, follow Altera's recommended escape pattern: dog-bone fan-out with via-in-pad for inner rows and micro-via or HDI stack-up for the four outer-most rows. Maintain at least 8 mil trace width and 8 mil trace clearance on the top layer to escape the 1.27 mm pitch balls. Use a 50 Ω controlled-impedance stack-up for clock and high-speed I/O traces, and place 0.1 µF + 10 µF decoupling capacitor pairs as close as possible to every power ball group (VCCINT, VCCIO, VCCP). All 252 user I/Os are divided into four I/O banks; tie all bank reference-voltage pins (VREF) to the corresponding supply rail.
Estimated: when migrating from the -3 speed grade to the -1 or -2 grade, the fMAX improvement is roughly 15-25 % (e.g. from 167 MHz to ~190-210 MHz) but is NOT a 1:1 ratio - verify your critical paths against the Quartus II timing analyzer for the target grade. Also note that the EP20K100 (non-KE) family uses a 2.5 V core, whereas the APEX 20KE family (E suffix) migrates to a 1.8 V core - do not assume these parts are interchangeable on an existing design without revalidating power sequencing and I/O bank reference voltages. Finally, the APEX 20K family is past its mainstream production window; for new high-volume designs, migrate to the Cyclone IV/V or MAX II/10 families.
Differential clock inputs (CLK0-CLK7) should be routed as 100 Ω differential pairs with length-matching within 25 mils; isolate these from high-speed single-ended I/O with a guard ground trace to avoid coupling. JTAG chain signals (TCK, TMS, TDI, TDO) must be routed cleanly and pulled up/down per the IEEE 1149.1 specification; do not share these pins with user I/O in the same bank to avoid boundary-scan interference. The nCONFIG, nSTATUS and CONF_DONE configuration pins must each have their own 10 kΩ pull-up and be observable by an external supervisor to detect configuration failure.
Compliance Information
APEX 20K family predates RoHS transition; RoHS/lead-free status of EP20K100FC324-3 base part is not specified in the verified web data - use the X-suffixed variant (EP20K100FC324-2X) for RoHS-compliant builds. AEC-Q100 is not applicable for commercial-grade FPGAs.
