EPF81188AQC208-2 - FLEX 8000 FPGA 12K Gates 148 I/O 5V | Intel / Altera
MPN: EPF81188AQC208-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $24.75 | $12,375.00 |
| 1,000 | $21.5 | $21,500.00 |
Drop-in alternatives for EPF81188AQC208-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPF81188AQC208-3
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View Datasheet →EPF81188AQC208-4
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View Datasheet →EPF81188AQC208-2 Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Logic Elements / Cells | 1008 |
| Total Usable Gates | 12,000 |
| Number of LABs | 126 |
| Number of I/O Pins | 148 |
| Number of Registers | 282 to 1500 |
| Maximum Operating Frequency | 125 MHz |
| Core Supply Voltage | 5 V |
| I/O Supply Voltage | 3.3 V or 5.0 V (MultiVolt) |
| Configuration Method | Serial or Parallel SRAM, loaded at power-up via EPC1/EPC1064/EPC1213/EPC1441 |
| Package | 208-BFQFP (PQFP, plastic quad flat pack) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (industrial / commercial grade) |
| Process Technology | CMOS, 0.42 um SRAM configuration cell |
| PCI Compliance | Compliant with PCI Local Bus Specification (PCI SIG) |
| Embedded Array Blocks (EABs) | Yes (used for RAM/ROM functions) |
| In-Circuit Reconfigurability | Yes (via external configuration device) |
EPF81188AQC208-2 208-bfqfp (pqfp, plastic quad flat pack) Pin Configuration Guide
Complete pinout information for EPF81188AQC208-2 (208-bfqfp (pqfp, plastic quad flat pack) package) with 148 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF81188AQC208-2.
Refer to the datasheet for full pin configuration.
Estimated pin count: 148 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF81188AQC208-2 is suitable for 6 applications: PCI Bus Interface Controller, Industrial Control and Instrumentation Logic, Telecommunications Glue Logic, Legacy 5 V Microprocessor System Integration, High-Speed Parallel DSP Co-Processor, Glue Logic Replacement for Discrete TTL.
PCI Bus Interface Controller
The EPF81188AQC208-2 is fully compliant with the PCI Local Bus Specification, making it a direct fit for 33 MHz PCI target and master designs in legacy industrial backplanes. With 148 user I/Os, the device can implement both the 32-bit PCI bus interface (AD[31:0], C/BE[3:0], FRAME#, IRDY#, TRDY#) and a substantial amount of application glue logic on a single chip. Its 125 MHz internal performance comfortably exceeds PCI's 33 MHz clock requirement with timing margin to spare, eliminating the need for external wait-state logic. Designers benefit from the device's 5 V tolerant MultiVolt I/O banks, which interface directly with 5 V PCI slots without level shifters.
Recommended
Industrial Control and Instrumentation Logic
In factory automation and process control systems, the EPF81188AQC208-2 serves as flexible glue logic between microcontrollers, sensor arrays, and actuator drivers. The 12,000 usable gates and 1,008 logic cells are sufficient to implement encoder quadrature decoders, PID controllers, and multi-axis stepper sequencers on a single device, replacing dozens of 74-series TTL chips. The -40C to +85C industrial temperature range ensures reliable operation in cabinet environments with elevated ambient temperatures. Its 5 V core supply simplifies integration with legacy 5 V PLC I/O subsystems without requiring additional voltage rails.
Recommended
Telecommunications Glue Logic
The EPF81188AQC208-2 is well suited as interface and protocol-conversion glue logic in T1/E1, ISDN, and early-generation telecom equipment where FLEX 8000 was a de facto standard. The device's 125 MHz performance supports HDLC framing, channel-associated signalling, and timeslot assignment functions at line rates up to 8.192 Mbps. Its 148 I/Os comfortably address the wide parallel buses typical of telecom backplane interfaces. The PCI compliance enables the FPGA to act as a co-processor on PCI-based telecom cards alongside a host CPU, sharing bus arbitration without external glue.
Recommended
Legacy 5 V Microprocessor System Integration
Designers using Intel 80x86, Motorola 68k, or other 5 V microprocessors frequently deploy the EPF81188AQC208-2 as a system integration hub, offloading address decoding, wait-state generation, and peripheral chip-select logic. With 12,000 gates and 148 I/Os, the device can replace multiple PAL/GAL devices and discrete TTL address decoders, simplifying board layout while adding programmable flexibility. The MultiVolt I/O banks allow direct connection to 5 V processor buses and 3.3 V peripherals on the same FPGA. The SRAM-based configuration also enables field upgrades via JTAG without swapping ROMs.
Recommended
High-Speed Parallel DSP Co-Processor
The EPF81188AQC208-2 functions as a parallel DSP co-processor in signal-processing pipelines, accelerating FIR filters, FFT butterflies, and custom arithmetic functions that exceed the throughput of general-purpose DSP chips. The FLEX 8000 embedded array blocks (EABs) provide distributed RAM for coefficient storage and data buffers, while the 125 MHz internal performance enables real-time processing of audio and baseband signals. The 148 I/Os permit parallel data paths up to 32 bits wide, doubling the throughput of typical serial DSP links. Designers benefit from the PCI compliance for direct plug-in to DSP accelerator cards.
Recommended
Glue Logic Replacement for Discrete TTL
Engineers retrofitting legacy boards with the EPF81188AQC208-2 consolidate dozens of 74-series TTL chips (counters, decoders, multiplexers, latches) into a single programmable device, reducing board area and improving reliability. The 12,000 usable gates and 1,008 logic cells provide capacity equivalent to approximately 50 to 80 standard TTL packages, depending on logic complexity. The 148 I/Os accommodate the high pin count of dense TTL-based designs. Designers can iterate on logic revisions without board respins by simply reprogramming the SRAM configuration via JTAG.
Recommended
Recommended Products Summary
Engineering reference data for EPF81188AQC208-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF81188AQC208-3 | EPF81188AQC208-4 | EPF81188AGC232-2 |
|---|---|---|---|---|
| Package | 208-BFQFP (PQFP) | 208-BFQFP - same | 208-BFQFP - same | 232-BGA - different |
| Brand | Intel / Altera | Intel / Altera - same | Intel / Altera - same | Intel / Altera - same |
| Family | FLEX 8000 | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same |
| Logic Cells | 1008 | 1008 | 1008 | 1008 |
| Usable Gates | 12,000 | 12,000 | 12,000 | 12,000 |
| User I/O Count | 148 | 148 | 148 | [DATA_NEEDED] |
| Maximum Internal Frequency | 125 MHz (speed grade -2) | ~125-150 MHz (speed grade -3) | ~150+ MHz (speed grade -4) | 125 MHz (speed grade -2) |
| Core Supply Voltage | 5 V | 5 V | 5 V | 5 V |
| MultiVolt I/O Support | 3.3 V / 5.0 V | 3.3 V / 5.0 V | 3.3 V / 5.0 V | 3.3 V / 5.0 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- 148 user I/Os in a 208-pin BFQFP package (vs EPF81188AQC240 (240-pin QFP))
- PCI Local Bus Specification compliance built in (vs Discrete TTL/CMOS PCI interface logic)
- MultiVolt I/O banks support mixed 3.3 V and 5.0 V systems (vs Older 5 V-only FPGAs (e.g., MAX 7000 series))
Design Notes
The EPF81188AQC208-2 requires a stable 5 V core supply (VCCINT) plus one or more 3.3 V or 5.0 V I/O bank supplies (VCCIO). Decouple each VCC pin with a 0.1 uF ceramic capacitor placed within 5 mm of the pin, plus a bulk 10 to 47 uF electrolytic or tantalum capacitor near the package. During configuration, the FPGA draws inrush currents up to approximately 200 mA, so size the 5 V regulator with adequate transient headroom and use a low-ESR bulk capacitor on the VCCINT rail.
The 208-BFQFP package has 0.5 mm pitch gull-wing leads and benefits from standard surface-mount soldering profiles (peak 220 to 245 C for lead-based or 245 to 260 C for lead-free paste). Provide a continuous ground plane on the layer beneath the device to control return paths and minimize inductance on VCCIO switching transients. Route high-speed signals (clocks, PCI bus) first with controlled impedance, and keep JTAG signals (TCK, TMS, TDI, TDO) away from switching I/O to avoid configuration noise coupling.
Configuration data is stored in CMOS SRAM, so the FPGA loses its configuration every time power drops below the minimum VCCINT threshold. Always pair the device with an Altera EPC configuration PROM (EPC1, EPC1064, EPC1213, or EPC1441) on every design; do not assume the bitstream persists across power cycles. Ensure the nCONFIG, nSTATUS, and CONF_DONE pins are properly pulled up and monitored by the host so that reconfiguration errors are detected and recovered. Also note that the part is obsolete, so second-source the configuration PROM and consider a long-term stocking plan.
Compliance Information
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status not stated in the FLEX 8000 datasheet snippets available in the Verified Web Data. The EPF81188AQC208-2 is a mature obsolete part originally released before modern compliance mandates; RoHS-compliant variants typically carry an 'N' suffix. AEC-Q100 is not applicable because this is a commercial/industrial-grade FPGA, not an automotive-qualified part.
