EPF8452ALC84-4N - FLEX 8000 FPGA, 84-LCC J-Lead | Intel
MPN: EPF8452ALC84-4N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $85.5 | $855.00 |
| 100 | $76 | $7,600.00 |
| 500 | $68.4 | $34,200.00 |
| 1,000 | $61.75 | $61,750.00 |
Drop-in alternatives for EPF8452ALC84-4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF8452ALC84-4
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View Datasheet →EPF8452ALC84-3
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View Datasheet →EPF8282ALC84-4N
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View Datasheet →EPF8452ALC84-4N Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Device | EPF8452A |
| Logic Elements / Macrocells | 336 macrocells / 42 LABs |
| Usable Gates | 16,000 |
| Maximum User I/Os | 68 |
| Supply Voltage | 5 V |
| Operating Temperature | 0 C to 70 C (Commercial) |
| Package | 84-LCC (J-Lead) |
| Package Pin Count | 84 |
| Mounting Type | Surface Mount (J-Lead) |
| Configuration | SRAM-based, in-circuit reconfigurable |
| Speed Grade | -4 |
| Configuration Devices Supported | EPC1, EPC1064, EPC1213, EPC1441 |
| MultiVolt I/O | 5 V / 3.3 V |
| JTAG Boundary Scan | Yes (per IEEE 1149.1) |
| Lead-Free / RoHS | See manufacturer product page |
EPF8452ALC84-4N 84 Pin Configuration Guide
Complete pinout information for EPF8452ALC84-4N (84 package) with 84 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF8452ALC84-4N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 84 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF8452ALC84-4N is suitable for 6 applications: Legacy Bus-Interface Glue Logic, Industrial Control Peripheral Controllers, ASIC Prototyping Before Tape-Out, Replacement of Multiple 74-Series TTL Packages, Communication Protocol Bridging, Test and Measurement Front-End Logic.
Legacy Bus-Interface Glue Logic
The EPF8452ALC84-4N is well suited to legacy bus-interface bridging between 5 V TTL peripherals and a 3.3 V processor bus where MultiVolt I/O eliminates external level shifters. Its 336 macrocells comfortably accommodate parallel-to-FIFO state machines, address decode and timing-assist logic for ISA, VME or PC/104 backplanes, while the 84-LCC J-Lead socket supports field upgrades on deployed boards. With 68 user I/Os available and ~16,000 usable gates, the device can replace multiple 74-series TTL packages, simplifying board layout and reducing cost per system. The -4 speed grade is adequate for low-bus-frequency industrial buses running below 25 MHz, where power consumption and deterministic timing matter more than raw clock rate. Use Altera MAX+PLUS II or Quartus to compile the design against the EPF8452A device pinout and configure the device from an EPC1064 or EPC1213 EPROM at power-up.
Recommended
Industrial Control Peripheral Controllers
Within an industrial PLC or motor-control board, the EPF8452ALC84-4N can host custom pulse-train, encoder-quadrature, PID-loop or PWM generation logic alongside a microcontroller. Its 16,000-gate density and 68 I/Os allow integration of counter chains, watchdog timers and parallel sensor conditioning that would otherwise require dedicated ASICs. The 84-LCC J-Lead package is rated for the 0 to 70 C commercial range; for harsher industrial cabinets, the EPF8282ALI84-4 (industrial temperature variant) shares the same footprint. Designers use the FLEX 8000 JTAG boundary-scan chain to validate interconnect on populated boards, simplifying production test. MultiVolt I/O interfaces directly to 5 V sensors and 3.3 V microcontroller peripherals without external translation.
Recommended
ASIC Prototyping Before Tape-Out
The EPF8452ALC84-4N is a classic vehicle for prototyping custom ASICs in the 8,000 to 16,000-gate density range. Designers can validate microarchitecture, datapath widths and control logic in silicon within days, then port the verified RTL to an ASIC vendor at significantly lower per-unit cost in volume. The 84-LCC J-Lead package is socketed, making it straightforward to swap revisions during development. The unlimited in-system reconfigurability of the SRAM-based FLEX 8000 means the same physical part can host successive design revisions with no rework. The -4 speed grade provides timing margins sufficient for verifying worst-case RTL timing before committing to silicon. Quartus and MAX+PLUS II both support full design compilation against the EPF8452ALC84-4N with timing simulation and functional simulation back-annotation.
Recommended
Replacement of Multiple 74-Series TTL Packages
On legacy boards originally designed around discrete 74LS, 74HC and 74F logic, the EPF8452ALC84-4N can absorb dozens of small-scale and medium-scale TTL functions into a single device, reducing board area, BOM count and overall power consumption. The 16,000-gate density typically equates to 50 to 100 packages of equivalent logic, while the 68 user I/Os comfortably match the pin count of a densely-packed TTL section. MultiVolt I/O supports mixed 5 V / 3.3 V environments, and JTAG boundary-scan testing replaces traditional bed-of-nails fixtures. The 84-LCC J-Lead socketed package allows drop-in modernization of existing assemblies without re-laying out the board. Choose the -3 grade where timing margins are tight; the -4 grade where power is constrained.
Recommended
Communication Protocol Bridging
The EPF8452ALC84-4N is used to bridge between mismatched serial and parallel communication protocols - for example, UART-to-parallel, SPI-to-I2C, or CAN-to-parallel conversions in embedded systems. The 336 macrocells comfortably accommodate full custom state-machine implementations of multiple concurrent protocol converters, while the 68 I/Os provide ample bus and signal capacity. MultiVolt I/O supports direct interface to 5 V transceivers and 3.3 V processors in the same design. The 84-LCC J-Lead package allows field upgrades when protocol revisions are needed. Designers benefit from Altera's megafunction library for UART, FIFO and CRC blocks, all of which can be instantiated and compiled directly into the EPF8452A logic. Configuration loading is handled by an EPC1064 or EPC1213 EPROM at power-up.
Recommended
Test and Measurement Front-End Logic
Inside a custom test or measurement instrument, the EPF8452ALC84-4N can host timing generators, pulse-train synthesizers, address decoders and result-capture FIFOs that interface to a host processor via parallel or serial links. The 16,000-gate density and 68 user I/Os accommodate multi-channel stimulus/response circuits, and MultiVolt I/O allows the FPGA to drive 5 V analog front-ends while talking to a 3.3 V controller. The -4 speed grade delivers timing accuracy sufficient for sub-microsecond pulse generation in instruments operating below 50 MHz. The 84-LCC J-Lead package enables socketed field upgrades as measurement standards evolve. JTAG boundary scan simplifies production self-test routines, and Quartus SignalTap-style logic analyzer integration accelerates in-system debug. Configure at power-up from an EPC1441 EPROM for fastest reload times during development iterations.
Recommended
Recommended Products Summary
Engineering reference data for EPF8452ALC84-4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8452ALC84-4 | EPF8452ALC84-3 | EPF8282ALC84-4N | EPF8282ALC84-4 | EPF8282ALI84-4 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 84-LCC (J-Lead) | 84-LCC (J-Lead) - same | 84-LCC (J-Lead) - same | 84-LCC (J-Lead) - same | 84-LCC (J-Lead) - same | 84-LCC (J-Lead) - same |
| Macrocells | 336 | 336 | 336 | 208 (-38%) | 208 (-38%) | 208 (-38%) |
| Usable Gates | 16,000 | 16,000 | 16,000 | 8,000 (-50%) | 8,000 (-50%) | 8,000 (-50%) |
| LABs | 42 | 42 | 42 | 26 (-38%) | 26 (-38%) | 26 (-38%) |
| Maximum User I/Os | 68 | 68 | 68 | 68 | 68 | 68 |
| Speed Grade | -4 | -4 | -3 (faster, +25%) | -4 | -4 | -4 |
| Operating Temperature | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) | -40 C to +85 C (Industrial) |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Lead-Free Finish (RoHS) | Yes | No (SnPb) | No (SnPb) | Yes | No (SnPb) | No (SnPb) |
| Reference Unit Price (qty 1, USD) | 95.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Lead-free terminal finish on the same FLEX 8000 die and footprint (vs EPF8452ALC84-4)
- Speed grade -4 trade-off vs same-die -3 alternative (vs EPF8452ALC84-3)
- Highest-density FLEX 8000 84-LCC commercial lead-free variant (vs EPF8282ALC84-4N)
Design Notes
The EPF8452ALC84-4N requires multiple VCC and GND pins distributed around the 84-LCC package. Place a 0.1 uF ceramic decoupling capacitor within 3 mm of every VCC pin and pair each with a 10 uF bulk tantalum or ceramic capacitor on the power plane. The SRAM configuration memory draws in-rush current at power-up; the VCC ramp must meet the FLEX 8000 datasheet minimum tR (typ. 2 ms to 100 ms) to avoid configuration failure. Use a supervisor or POR circuit to hold nCONFIG low until VCC stabilizes. The MultiVolt VCCIO pins should be tied to 3.3 V for 3.3 V I/O operation or 5 V for 5 V I/O - they cannot be left floating.
The 84-LCC J-Lead package has J-leads on all four sides with 1.27 mm (50 mil) pitch. Recommended land pattern follows JEDEC MS-018. To allow field upgrades on deployed boards, install the device in a 84-pin LCC socket (e.g., 3M Textool or similar). Place configuration EPROM (EPC1 / EPC1064 / EPC1213 / EPC1441) within 50 mm of the FPGA to keep DCLK rise times below 10 ns. Use a continuous ground plane under the device and route all 68 user I/O signals on inner layers to minimize crosstalk. Leave the four corner pins per JEDEC designation (N.C.) unconnected on the PCB unless the datasheet specifies otherwise.
Do not assume the EPF8452ALC84-4N is a direct replacement for the EPF8452ALC84-4 in a design that requires lead-free reflow: both share the same footprint, but the -4N has lead-free terminal finish while the -4 has SnPb finish. Do not mix 5 V and 3.3 V on the same I/O bank without verifying the VCCIO supply; MultiVolt I/O requires a single VCCIO per bank. Do not leave MSEL0/MSEL1 floating - they determine the configuration mode (EPC1, EPC1064, parallel, etc.) and an ambiguous state can lock the device into an unsupported mode. Finally, remember the SRAM-based FLEX 8000 loses its configuration when power is removed; a configuration EPROM is mandatory for stand-alone operation.
Compliance Information
Lead-free finish per 'N' suffix; RoHS and REACH compliance per Altera/Intel product page; AEC-Q100 not applicable (industrial-grade FPGA not automotive-qualified); halogen-free and conflict-minerals status not explicitly stated in the verified web data.
