K3KL9L90DM-MGCU - LPDDR5X 64Gb x32 8533Mbps FBGA | Samsung
MPN: K3KL9L90DM-MGCU ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $81.48 | $81.48 |
| 10 | $77.4 | $774.00 |
| 100 | $73.54 | $7,354.00 |
| 500 | $69.87 | $34,935.00 |
| 1,000 | $66.4 | $66,400.00 |
Drop-in alternatives for K3KL9L90DM-MGCU — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K3KL9L90CM-MGCT
✅ Drop-In✓ In Stock
$36.91 / Unit
View Datasheet →K3KL9L90DM-MGCU0UT
✅ Drop-In📋 Reference alternative (not in catalog)
K3KL8L80DM-MGCU
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →K3KL8L80DM-JGCT
✅ Drop-In✓ In Stock
$80.7 / Unit
View Datasheet →K3KL7L70EM-MGCU
✅ Drop-In✓ In Stock
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View Datasheet →K3KL9L90DM-MGCU Maximum Ratings & Electrical Characteristics
| Memory Type | LPDDR5X SDRAM |
| Total Density | 64 Gbit (8 GB) |
| Organization | x32 |
| Data Rate | 8533 Mbps per pin |
| Package | 315-ball FBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | -25C to +85C |
| Standard | JEDEC LPDDR5X (LPDDR5 family) |
| Channel Configuration | 32-bit channel |
| Speed Class Designator | LPDDR5X-8533 |
| Density per Die | 16 Gbit per channel density (per distributor data) |
| RoHS Status | Compliant |
| Manufacturer | Samsung Electronics |
K3KL9L90DM-MGCU 315-ball fbga Pin Configuration Guide
Complete pinout information for K3KL9L90DM-MGCU (315-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K3KL9L90DM-MGCU.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K3KL9L90DM-MGCU is suitable for 6 applications: Flagship Smartphone Main Memory, AI Edge Inference Accelerators, Automotive Infotainment and ADAS, High-Performance Embedded Computing Modules, Tablets and Portable Computing, Networking and 5G Infrastructure.
Flagship Smartphone Main Memory
The K3KL9L90DM-MGCU fits flagship smartphone main-memory designs because its 8533 Mbps data rate and 64 Gbit (8 GB) density deliver the bandwidth that modern application processors demand for on-device AI, gaming, and multi-camera pipelines. Soldered in a 315-ball FBGA directly beneath or beside the SoC, it offers the shortest possible trace lengths, which preserves signal integrity at LPDDR5X speeds and keeps the assembly profile low for thin form factors. The LPDDR5X protocol's dynamic voltage and frequency scaling lets the memory controller drop to low-power states during idle and voice-wakeup scenarios, materially extending battery life compared with fixed-speed operation. Integrators should confirm the host SoC PHY supports the 8533 Mbps training sequences and plan PMIC rails accordingly for the low-voltage I/O domain.
Recommended
AI Edge Inference Accelerators
On-device AI workloads are memory-bandwidth bound, and the K3KL9L90DM-MGCU's 8533 Mbps per-pin rate over a 32-bit channel supplies the throughput needed to stream large neural network weights and activation maps without starving the NPU. The 8 GB capacity accommodates quantized transformer and vision models directly in local memory, avoiding the latency and power cost of offloading to storage. Because the device operates from -25C to +85C, it suits industrial edge gateways and smart-camera enclosures with passive cooling. Designers should size the LPDDR5X power-delivery network for sustained bandwidth bursts during model execution and enable partial-array self-refresh in always-on wake-word and background-sensing modes to cut standby drain between inference events.
Recommended
Automotive Infotainment and ADAS
The K3KL9L90DM-MGCU serves automotive infotainment and ADAS perception domains that need high memory bandwidth for multi-camera sensor fusion, navigation rendering, and cockpit displays. Its -25C to +85C operating range covers typical cabin and ECU environments, and the FBGA-315 soldered-down format resists vibration better than socketed memory. The 8 GB density supports running perception stacks and map data simultaneously in RAM. Note that this commercial-grade part is not inherently AEC-Q100 qualified; automotive programs should request Samsung's automotive-qualified suffix or a formally qualified family member. Power architecture should include a dedicated LPDDR5X PMIC rail with proper sequencing and dynamic voltage scaling support to meet cold-crank and low-power standby requirements.
Recommended
High-Performance Embedded Computing Modules
System-on-module (SoM) vendors use LPDDR5X devices like the K3KL9L90DM-MGCU as soldered-down main memory on COM Express, SMARC, and proprietary high-performance modules. Compared with SODIMM-based DDR, the 315-ball FBGA package offers lower assembly height, better signal integrity at 8533 Mbps due to short controlled-impedance traces, and improved resistance to shock and vibration in industrial and aerospace deployments. The 8 GB capacity addresses virtualization and machine-learning workloads on embedded x86 and Arm hosts. Module designers should validate the LPDDR5X fly-by routing against the SoC vendor reference design and reserve thermal design margin, since sustained memory bandwidth under passive cooling raises local PCB temperatures near the DRAM stack.
Recommended
Tablets and Portable Computing
Tablets and thin portable computers benefit from the K3KL9L90DM-MGCU's balance of capacity and power efficiency: 8 GB of LPDDR5X supports desktop-class browsers, creative applications, and multitasking, while LPDDR5X low-voltage signaling preserves battery runtime. The device's dynamic frequency scaling allows the OS to step memory speed with workload demand, reducing average power in mixed-use scenarios. The FBGA package's compact footprint fits the tight Z-height budgets of slim industrial designs, and soldered memory eliminates connector cost and contact-reliability concerns. Firmware teams should implement LPDDR5X self-refresh and deep power-down entry promptly during screen-off states, as idle DRAM power is a measurable share of total standby consumption in portable products.
Recommended
Networking and 5G Infrastructure
5G small cells, edge routers, and network appliances increasingly deploy LPDDR5X like the K3KL9L90DM-MGCU for packet buffering, cryptography contexts, and control-plane data structures. The 8533 Mbps data rate provides headroom for line-rate forwarding table access and deep packet inspection, while the -25C to +85C rating suits outdoor enclosures and sealed radio units with limited forced airflow. The soldered FBGA-315 format withstands thermal cycling better than DIMM sockets in base-station environments. Designers should implement robust LPDDR5X training and periodic retraining in firmware to tolerate temperature swings, and qualify the part's long-term availability with Samsung, as networking programs typically demand multi-year supply commitments with change-notification coverage.
Recommended
Recommended Products Summary
Engineering reference data for K3KL9L90DM-MGCU — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K3KL9L90CM-MGCT | K3KL9L90DM-MGCU0UT | K3KL8L80DM-MGCU | K3KL7L70EM-MGCU |
|---|---|---|---|---|---|
| Package | 315-ball FBGA | 315-ball FBGA - same | 315-ball FBGA - same | 315-ball FBGA - same | 315-ball FBGA - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Density | 64 Gbit (8 GB) | 64 Gbit (8 GB) | 64 Gbit (8 GB) | 32 Gbit (4 GB) | [DATA_NEEDED] |
| Organization | x32 | x32 | x32 | x32 | x32 |
| Data Rate | 8533 Mbps | 8533 Mbps | 8533 Mbps | [DATA_NEEDED] | [DATA_NEEDED] (lower speed grade) |
| Operating Temperature | -25C to +85C | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Memory Standard | LPDDR5X | LPDDR5X | LPDDR5X | LPDDR5X | LPDDR5X |
| Qty-1 Price (as of 2026-09-04) | $81.48 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Top LPDDR5X speed grade bandwidth (vs K3KL7L70EM-MGCU)
- Double the memory capacity in the same footprint (vs K3KL8L80DM-MGCU)
- Supply-chain flexibility within one vendor family (vs K3KL9L90CM-MGCT)
Design Notes
At 8533 Mbps, LPDDR5X signal integrity dominates design success. Route DQ/DQS byte lanes with matched intra-byte skew per the SoC vendor's LPDDR5X layout guide, maintain controlled single-ended impedance (typically about 40 ohm per JEDEC LPDDR5X practice; confirm with your stackup), and keep all memory nets on a continuous reference plane with no splits beneath high-speed regions. Run full SI simulation with eye-mask compliance at the highest speed grade, and budget for write-leveling and read-training margins across the -25C to +85C temperature range.
Plan the LPDDR5X power delivery with dedicated core and VDDQ rails from the host PMIC, supporting dynamic voltage scaling during speed transitions. Size the VDDQ rail decoupling with a mix of bulk and high-frequency ceramics placed close to the DRAM balls, and follow the PMIC vendor's sequencing requirements for LPDDR5X rail order. Estimated: at high-bandwidth sustained operation, LPDDR5X power scales roughly with data rate, so thermal dissipation in the FBGA area should be modeled with your SoC's reference power numbers rather than assumed negligible.
Samsung LPDDR5X ordering suffixes encode speed, temperature, and package-finish details; do not assume that similarly named K3KL9L90 family parts are identical - verify the suffix decode in the Samsung ordering-information table before substituting (for example, MGCU vs MGCT vs GCU0UT codings). Also confirm the host memory controller's supported speed grades before design-in, and treat LPDDR availability through distribution as RFQ-driven since stock fluctuates with DRAM market cycles.
Compliance Information
RoHS compliance stated in JLCPCB and LCSC listings. Other declarations (REACH, halogen-free, conflict minerals) should be obtained via official Samsung compliance certificates through the distributor.
