K3LKCKC0BM-MGCP - 64Gb LPDDR5 6400Mbps DRAM | Samsung
MPN: K3LKCKC0BM-MGCP ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $57.72 | $57.72 |
| 10 | $54.83 | $548.30 |
| 100 | $51.95 | $5,195.00 |
| 500 | $49.06 | $24,530.00 |
| 1,000 | $46.18 | $46,180.00 |
Drop-in alternatives for K3LKCKC0BM-MGCP — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K3LKBKB0BM-MGCP
✅ Drop-In✓ In Stock
$46.62 / Unit
View Datasheet →K3KL9L90CM-MGCT
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$36.91 / Unit
View Datasheet →K3KL8L80CM-MGCT
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →K3LKJKJ0CM-MUCP
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →K3LK8K80CM-MFCP
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →K3LK2K20CM-JFCP
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →K3LKCKC0BM-MGCP Maximum Ratings & Electrical Characteristics
| Memory Type | LPDDR5 SDRAM (DRAM) |
| Memory Size | 64 Gbit |
| Memory Organization | 2G x32 |
| Data Rate | 6400 Mbps |
| Interface | Parallel |
| Technology | CMOS |
| Supply Voltages | 500 mV, 900 mV, 1.05 V, 1.8 V |
| Operating Temperature | -25 C to +85 C |
| Package | FBGA-315 (PBGA315) |
| Mounting Type | Surface Mount |
| Volatile / Non-Volatile | Volatile |
| RoHS Status | Compliant |
K3LKCKC0BM-MGCP fbga-315 (pbga315) Pin Configuration Guide
Complete pinout information for K3LKCKC0BM-MGCP (fbga-315 (pbga315) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K3LKCKC0BM-MGCP.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K3LKCKC0BM-MGCP is suitable for 6 applications: Flagship Smartphone Main Memory, AI Edge Computing Modules, 5G Networking Equipment Buffers, Automotive Infotainment Compute, Tablets and Notebook-Class Mobile Computing, Industrial Vision and Machine Learning Gateways.
Flagship Smartphone Main Memory
The K3LKCKC0BM-MGCP fits flagship smartphone main memory because its 64 Gbit density provides 8 GB per package and its LPDDR5 interface sustains 6400 Mbps per pin, delivering the aggregate bandwidth that modern application processors demand for multitasking, gaming, and computational photography. Its multi-rail power architecture (500 mV core, 900 mV/1.05 V VDDQ, 1.8 V interface) aligns with mobile PMIC designs, and deep power-down modes minimize standby drain on the battery. In a typical design, one or two FBGA-315 packages sit directly beneath or beside the SoC with length-matched LPDDR5 traces, trading slightly higher cost than LPDDR4X for roughly 50% more bandwidth per pin and lower operating voltage, which reduces total memory subsystem power during heavy use.
Recommended
AI Edge Computing Modules
Edge AI accelerators and smart-camera SoCs need high-bandwidth, low-power DRAM to feed neural network inference workloads, and the K3LKCKC0BM-MGCP delivers exactly that profile: 64 Gbit of LPDDR5 running at 6400 Mbps provides the streaming bandwidth for activation and weight transfers, while the 2G x32 organization simplifies 32-bit-wide controller mapping. The -25 C to +85 C range suits enclosed edge hardware, and the FBGA-315 package fits compact SOM and module form factors. Compared with DDR4 SODIMM-class memory, LPDDR5 cuts I/O power substantially at equivalent bandwidth; the trade-off is soldered-down memory that is not field-upgradable, so density selection at design time is permanent. Pair with a PMIC providing the 500 mV and 1.05 V rails with correct sequencing.
Recommended
5G Networking Equipment Buffers
5G baseband units, small-cell radios, and network processing cards require DRAM with high sustained bandwidth for packet buffering, and the K3LKCKC0BM-MGCP's 6400 Mbps LPDDR5 interface provides the per-pin throughput needed at low latency. Its 64 Gbit capacity accommodates deep buffer pools for burst traffic absorption, while the parallel x32 organization maps cleanly onto network processor memory controllers. The industrial-leaning -25 C to +85 C temperature rating supports outdoor enclosures with passive cooling. Designers should budget for strict signal integrity: 6400 Mbps signaling over backplane-adjacent traces requires solid reference planes and ODT tuning per the Samsung datasheet. Compared with GDDR alternatives, LPDDR5 offers better power efficiency for always-on network hardware, at the cost of lower peak bandwidth than GDDR6.
Recommended
Automotive Infotainment Compute
Automotive IVI head units and digital cockpit SoCs run map rendering, media, and voice workloads that benefit from the K3LKCKC0BM-MGCP's 64 Gbit density and 6400 Mbps bandwidth. The -25 C to +85 C operating range covers most cabin electronics environments, though designers must confirm whether their platform requires an AEC-Q100-qualified LPDDR5 variant, since this standard-grade part is not automotive-certified per available data. The soldered FBGA-315 package withstands vibration better than socketed DIMMs, and LPDDR5's low operating voltage reduces thermal load in sealed enclosures. Power sequencing of the 500 mV, 1.05 V, and 1.8 V rails must follow the LPDDR5 specification during the vehicle's cold-crank and sleep-wake cycles to avoid controller lock-up, making the PMIC choice a critical companion decision.
Recommended
Tablets and Notebook-Class Mobile Computing
Premium tablets and thin-and-light notebook designs increasingly adopt LPDDR5 soldered memory, and the K3LKCKC0BM-MGCP's 8 GB-per-package density allows a single package to replace multiple lower-density parts, simplifying PCB layout and reducing the BOM. At 6400 Mbps, memory bandwidth supports integrated graphics and productivity workloads, while LPDDR5's per-bank refresh and fine-grained power-down states cut idle power - a direct battery-life win versus LPDDR4X designs of equivalent capacity. The 2G x32 organization supports 32-bit and 64-bit bus configurations depending on how many packages are populated. The key design trade-off is non-upgradability: capacity must be finalized at design time, so product planners should size memory against projected OS and application growth over the product's multi-year service life.
Recommended
Industrial Vision and Machine Learning Gateways
Industrial machine-vision gateways and smart-factory edge servers process multiple camera streams with on-device inference, and the K3LKCKC0BM-MGCP supplies the 64 Gbit working set plus 6400 Mbps bandwidth these pipelines require. The -25 C to +85 C rating suits control cabinets near machinery, and the FBGA-315 soldered package resists shock and vibration in Factory 4.0 environments. Its multi-rail LPDDR5 power architecture pairs naturally with industrial PMICs that already generate 1.05 V and 1.8 V rails; the 500 mV core rail typically requires a dedicated high-efficiency buck converter. Compared with conventional DDR4 UDIMMs, LPDDR5 saves board space and power but requires the memory to be designed in permanently - acceptable for fixed-function industrial gateways with long, unchanged production runs.
Recommended
Recommended Products Summary
Engineering reference data for K3LKCKC0BM-MGCP — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K3LKBKB0BM-MGCP | K3KL9L90CM-MGCT | K3LKJKJ0CM-MUCP |
|---|---|---|---|---|
| Package | FBGA-315 (PBGA315) | FBGA-315 - same package | FBGA-315 - same family | FBGA-315 - same family |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Memory Size | 64 Gbit | 32 Gbit | [DATA_NEEDED] | [DATA_NEEDED] |
| Memory Technology | LPDDR5 SDRAM | LPDDR5 SDRAM | LPDDR5 SDRAM | LPDDR5 SDRAM |
| Data Rate | 6400 Mbps | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Organization | 2G x32 | x32 | [DATA_NEEDED] | [DATA_NEEDED] |
| Operating Temperature | -25 C to +85 C | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Lifecycle Status | Active | Active | Active | Active |
Key Differentiators
- Maximum density in the family comparison set (vs K3LKBKB0BM-MGCP)
- High bandwidth LPDDR5 interface (vs K4AAG165WM-BCWE (DDR4 alternative))
- Trade-off: no cross-brand drop-in (vs Micron / SK Hynix LPDDR5 64 Gbit)
Design Notes
At 6400 Mbps, LPDDR5 address/command and data lines must be length-matched within the tolerance stated in the Samsung datasheet, routed over continuous reference planes with controlled single-ended and differential impedance. Minimize via stubs, keep the DRAM within the SoC's specified trace-length budget, and simulate both signal integrity and power integrity (PDN impedance) before fabrication. Use on-die termination (ODT) settings recommended in the LPDDR5 specification rather than discrete termination resistors.
The K3LKCKC0BM-MGCP requires four rails: 500 mV (core), 900 mV and 1.05 V (VDDQ domains), and 1.8 V (interface). Provide dedicated low-ESR ceramic decoupling at each FBGA ball group per the Samsung reference layout, and ensure the PMIC supports the LPDDR5 power-state transitions (deep sleep, self-refresh) with correct rail sequencing. Estimated: a single package drawing several hundred milliwatts at full bandwidth warrants a dedicated buck converter for the VDDQ rails rather than sharing with other logic.
Do not assume cross-vendor LPDDR5 packages are pin-to-pin drop-in: ball maps differ between Samsung, Micron, and SK Hynix even at identical density and speed. Also, this part is rated -25 C to +85 C and is not shown as AEC-Q100 qualified in available data - do not deploy in automotive safety paths without qualification confirmation. Finally, soldered-down LPDDR5 cannot be field-upgraded, so validate memory init/training firmware against the exact -MGCP speed bin.
Compliance Information
RoHS compliance stated in JLCPCB part listing. No REACH, halogen-free, or conflict-minerals statements found in provided data. No AEC-Q100 qualification indicated in available data.
