M2GL005-1VF256 IGLOO2 FPGA, 6060 LEs, 161 I/O, 256-FBGA | Microchip
MPN: M2GL005-1VF256 ✓ ActiveM2GL005-1VF256 Overview
A field-programmable gate array is a reconfigurable digital integrated circuit whose logic fabric, interconnect and I/O blocks are defined after manufacture by a bitstream downloaded from flash. The IGLOO2 family from Microsemi/Microchip is a low-density, non-volatile flash FPGA line positioned between mask-programmable ASICs and larger, higher-cost FPGAs, giving designers a fast path to volume production without a foundry mask set.
Key characteristics of this device include 6,060 logic cells, 161 user I/O, a 1.2 V core operating voltage, and on-chip non-volatile configuration memory so the design is retained without an external configuration PROM. Because the configuration is stored in flash, the part powers up directly into the user's logic with no wait-state configuration sequence from an external master, which simplifies board design and reduces BOM cost.
The IGLOO2 architecture provides a mix of programmable logic and dedicated I/O resources, allowing parallel interface bridging, bus conversion, protocol translation and simple control-plane logic to be consolidated into a single device. The 256-ball FBGA package with 0.8 mm ball pitch keeps the footprint small enough for space-constrained industrial, communications and consumer-adjacent equipment, while offering more I/O than a quad flat pack would provide.
Typical applications include I/O expansion and level translation between legacy and modern systems, industrial sensor and instrument signal conditioning, secure connectivity and authentication front ends, communications infrastructure bridging, and general system-management supervision logic in industrial and commercial equipment.
When designing around this device, keep the 1.2 V core rail well filtered and decoupled, and place the 0.8 mm pitch BGA on a board whose escape-routing rules are checked against the IGLOO 2 packaging and pin description user guide before layout sign-off.
This page brings together the manufacturer device page, distributor availability data, package and pin references, drop-in alternatives in the same 256-ball footprint, and practical design notes that are not consolidated in a single manufacturer document.
Drop-in alternatives for M2GL005-1VF256 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with M2GL005-1VF256 (same form factor and footprint) — differing in Configuration Memory, Package, Device Type, Logic Elements.
M2GL005-VF256I
✅ Drop-InContact for price
View Datasheet →M2GL005-VFG256I
✅ Drop-In📋 Reference alternative (not in catalog)
M2GL005-1VF256I
✅ Drop-In📋 Reference alternative (not in catalog)
M2GL005-VFG256
✅ Drop-InContact for price
View Datasheet →M2GL005-1VF256 Maximum Ratings & Electrical Characteristics
| Manufacturer | Microchip Technology |
| Device Family | IGLOO 2 low-density FPGA |
| Logic Cells | 6,060 cells |
| User I/O | 161 I/O |
| Core Operating Voltage | 1.2 V |
| Maximum Supply Voltage | 1.26 V |
| Configuration Memory | On-chip non-volatile flash |
| Package | 256-ball FBGA (VF256) |
| Terminal Pitch | 0.8 mm |
| Terminal Count | 256 terminals |
| Package Shape | Square |
| Terminal Form | Ball |
| Product Type | FPGA - Field Programmable Gate Array |
| Lifecycle Status | In Production |
M2GL005-1VF256 square Pin Configuration Guide
Pin configuration for M2GL005-1VF256 (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M2GL005-1VF256.
Refer to the datasheet for full pin configuration.
Typical Applications
M2GL005-1VF256 is suitable for 6 applications: Industrial I/O Expansion and Signal Conditioning, Secure Connectivity and Authentication Front End, Communications Bridge and Protocol Converter, Instrumentation and Measurement Front Panels, Automotive and Transportation Control Support, Smart Sensor Nodes and IoT Gateways.
Industrial I/O Expansion and Signal Conditioning
The M2GL005-1VF256 fits industrial I/O expansion because 161 user I/O backed by a 6,060-cell flash-based fabric lets one device absorb slow logic, isolation breakpoints and legacy-to-modern level translation that would otherwise consume several microcontroller pins. Because configuration is retained in on-chip non-volatile flash, the module retains its I/O map through power cycles with no external configuration PROM, which reduces board cost in ruggedized equipment. With a 1.2 V core supplied from a regulated rail and a 256-ball FBGA footprint, the device fits compact control boards while keeping routing deterministic and timing-predictable.
Recommended
Secure Connectivity and Authentication Front End
For secure connectivity designs, the M2GL005-1VF256 can host protocol framing, challenge-response handling and key-loading logic adjacent to the physical link, shortening the path between a network engine and its security peripheral. The 6,060-cell IGLOO 2 fabric is large enough to run multiple concurrent state machines plus glue logic while leaving headroom for the flash-based configuration to hold several firmware variants. A narrow 1.2 V core supply (maximum 1.26 V) keeps local decoupling simple, and the 256-ball FBGA allows the device to sit close to the connector and PHY, which limits sensitive-trace length.
Recommended
Communications Bridge and Protocol Converter
The M2GL005-1VF256 is well suited to bridging tasks between dissimilar interfaces in communications equipment, because the IGLOO 2 fabric can run parallel-to-serial and serial-to-parallel converters alongside framing logic at deterministic latency. 161 I/O means multiple word-width buses can be terminated on a single device rather than cascading converters, and the non-volatile flash configuration removes the need for a supervisor to reload logic at every power cycle. In the field, the 1.2 V core and 256-ball FBGA keep the bridge close to the line drivers, which reduces stub length and helps preserve signal integrity on high-speed links.
Recommended
Instrumentation and Measurement Front Panels
Test and measurement front panels benefit from the M2GL005-1VF256 because 161 I/O allows dense button, rotary-switch and display multiplexing to be consolidated, while 6,060 logic cells can host timing counters and calibration tables in parallel with the UI logic. Configuration stored in flash means a single board SKU can present different front-panel personalities, reprogrammed through JTAG during production test. The 256-ball FBGA with 0.8 mm pitch supports compact instrument form factors, and the low 1.2 V core rail simplifies the power tree when the panel runs alongside higher-voltage analog sections.
Recommended
Automotive and Transportation Control Support
In transportation and industrial vehicle electronics, the M2GL005-1VF256 can implement subsystem logic such as switch debouncing, lamp and relay sequencing, CAN or LIN gateway handling and diagnostics aggregation with deterministic response. The IGLOO 2 architecture keeps the configuration in on-chip flash, so no external memory is needed for logic retention across brownout events in vehicle supply rails. With a 1.2 V core, supply sequencing is straightforward, and choosing the -VF256I industrial-grade ordering option of the same die and package gives a qualified-grade path without any footprint change.
Recommended
Smart Sensor Nodes and IoT Gateways
Smart sensor nodes use the M2GL005-1VF256 to aggregate multiple slow sensor channels, perform local thresholding and filtering, and format data for transmission, offloading a low-power MCU from repetitive digital housekeeping. The 161 I/O provides enough parallel inputs for banks of sensors and discrete lines while the 6,060-cell fabric handles protocol framing and local buffering. Since the design is retained in on-chip flash, battery-operated nodes wake to a known state instantly, and the 256-ball FBGA footprint is small enough for space-constrained IoT enclosures built around a single-cell Li-ion supply.
Recommended
Recommended Products Summary
Engineering reference data for M2GL005-1VF256 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M2GL005-VF256I | M2GL005-VFG256I | M2GL005-1VF256I | M2GL005-VFG256 |
|---|---|---|---|---|---|
| Package | FBGA-256 (VF256) | FBGA-256 (VF256) - same | FBGA-256 (VF256) - same | FBGA-256 (VF256) - same | FBGA-256 (VF256) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Device Family | IGLOO 2 low-density FPGA | IGLOO 2 low-density FPGA | IGLOO 2 low-density FPGA | IGLOO 2 low-density FPGA | IGLOO 2 low-density FPGA |
| Logic Cells | 6,060 cells | 6,060 cells | 6,060 cells | 6,060 cells | 6,060 cells |
| User I/O | 161 I/O | 161 I/O | 161 I/O | 161 I/O | 161 I/O |
| Core Supply Voltage | 1.2 V nominal, 1.26 V maximum | 1.2 V nominal, 1.26 V maximum | 1.2 V nominal, 1.26 V maximum | 1.2 V nominal, 1.26 V maximum | 1.2 V nominal, 1.26 V maximum |
| Terminal Count / Ball Pitch | 256 terminals, 0.8 mm pitch | 256 terminals, 0.8 mm pitch | 256 terminals, 0.8 mm pitch | 256 terminals, 0.8 mm pitch | 256 terminals, 0.8 mm pitch |
| Ordering Suffix / Grade | -1VF256 (standard grade ordering code) | -VF256I (industrial grade suffix) | -VFG256I (green/RoHS, industrial grade) | -1VF256I (industrial grade suffix) | -VFG256 (green/RoHS, commercial grade) |
| Configuration Memory | On-chip non-volatile flash | On-chip non-volatile flash | On-chip non-volatile flash | On-chip non-volatile flash | On-chip non-volatile flash |
Key Differentiators
- 161 user I/O on a 6,060-cell low-density fabric gives one of the highest I/O-to-logic ratios in the IGLOO 2 low-density line (vs M2GL005-VF256I)
- Non-volatile on-chip flash configuration removes the external configuration PROM and its associated BOM cost, board area and standby current (vs SRAM-configuration low-density competitors in similar packages)
- Direct drop-in path within the same 256-ball footprint across four ordering codes (vs M2GL005-TQG144)
- Green (RoHS) ordering option available in the identical footprint for regulated markets (vs M2GL005-VF256I)
Design Notes
The M2GL005-1VF256 uses a 256-ball FBGA with 0.8 mm ball pitch, which forces a disciplined escape strategy. Route the inner rows directly to the pad with a 0.2 mm (4 mil) trace and a 0.45 mm (18 mil) drill via placed as close to the pad as the fab permits, or use a microvia fan-out layer under the device. Keep the BGA land pattern and solder mask defined per the IGLOO 2 packaging and pin descriptions user guide, and confirm the fabricator's via-in-pad capability before committing to a dense escape.
The 1.2 V core supply has a maximum of 1.26 V, leaving roughly 5 percent headroom above nominal. Place the core bypass capacitors on the same side of the board as the device and close to the supply balls, and separate the 1.2 V core rail from the I/O supplies so switching activity on the banks does not couple into the core. Estimated example only: with a 1.2 V rail and 100 mA of core current, the regulator's own dissipation would be small, so total board-level thermal budgeting should focus on I/O bank current rather than core current.
Do not assume the -1VF256, -VF256I, -VFG256I and -VFG256 ordering codes are electrically identical without checking the temperature-grade marking in the ordering information. The M2GL005-TQG144 in a 144-pin TQFP is a different footprint and cannot be substituted on an existing 256-ball layout. Also note that because configuration lives in on-chip flash, JTAG re-programming is the mechanism for field upgrades; design access to the JTAG pins (TCK, TDI, TDO, TMS) so firmware updates remain possible after production.
With 161 user I/O available, designers often fan the entire fabric out to a single connector or header. Keep high-fanout, potentially noisy I/O away from the core and configuration supply balls, and add a solid ground plane reference under the device so I/O return currents have a short path. Where an I/O bank drives long or slow lines, reserve series damping footprints at the driver side, since the IGLOO 2 I/O standards differ in drive strength and slew rate and the bank configuration must match the connected circuit.
Compliance Information
The manufacturer lists the M2GL005 family as In Production. A green (RoHS) ordering variant exists as M2GL005-VFG256 and M2GL005-VFG256I in the same package, but the compliance status of the specific -1VF256 ordering code is not stated on the manufacturer product page shown, so all compliance fields are left as unknown rather than assumed.
