MT41K64M16TW-107 - 1Gbit DDR3L SDRAM 1866MT/s | Micron Technology
MPN: MT41K64M16TW-107 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.03 | $4.03 |
| 10 | $3.75 | $37.50 |
| 100 | $3.42 | $342.00 |
| 500 | $3.18 | $1,590.00 |
| 1,000 | $2.95 | $2,950.00 |
Drop-in alternatives for MT41K64M16TW-107 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
MT41K64M16TW-107 IT:J
β Drop-Inπ Reference alternative (not in catalog)
MT41K64M16TW-107 AIT:J
β Drop-Inπ Reference alternative (not in catalog)
MT41K64M16TW-107:J
β Drop-Inπ Reference alternative (not in catalog)
K4B4G1646E-BYK000
β Drop-Inβ In Stock
$0.5619 / Unit
View Datasheet βMT41K64M16TW-107 Maximum Ratings & Electrical Characteristics
| Memory Type | DDR3L SDRAM |
| Memory Size | 1 Gbit |
| Organization | 64M x 16 |
| Interface | Parallel |
| Clock Frequency | 933 MHz |
| Data Rate | 1866 MT/s (DDR3-1866 speed grade -107) |
| Access Time | 20 ns |
| Supply Voltage | 1.35 V (1.283 V to 1.45 V) |
| Technology | CMOS DRAM |
| Operating Temperature | 0C to +95C |
| Package | 96-FBGA (8 x 14 mm) |
| Mounting Type | Surface Mount |
| Refresh | Self refresh / auto refresh |
| RoHS Status | Compliant (lead-free, halogen-free suffix J) |
| Base Part Number | MT41K64M16 |
| Supply Voltage - DDR3 Compatible Mode | 1.5 V (refer to DDR3 datasheet specifications) |
MT41K64M16TW-107 96-fbga (8 x 14 mm) Pin Configuration Guide
Complete pinout information for MT41K64M16TW-107 (96-fbga (8 x 14 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MT41K64M16TW-107.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
MT41K64M16TW-107 is suitable for 6 applications: FPGA Companion Memory, Embedded Industrial Controllers, Networking Equipment, Consumer and Set-Top Platforms, Automotive Infotainment and Telematics, Test and Measurement Instrumentation.
FPGA Companion Memory
The MT41K64M16TW-107 is a natural main-memory companion for FPGAs with hard or soft DDR3 memory controllers. Its x16 organization matches common FPGA memory-controller data widths, and its 1866 MT/s (-107) speed grade exceeds typical FPGA controller limits, providing timing margin at conservative controller frequencies. A single 96-ball FBGA device delivers 128 MB of working memory from one 1.35 V rail, minimizing BOM complexity. Place the memory close to the FPGA, length-match the fly-by command/address bus, and use on-die termination (ODT) to relax board-level termination requirements; verify controller training support for DDR3L levels before design freeze.
Recommended
Embedded Industrial Controllers
Industrial PLCs, HMIs, and motor controllers require reliable working memory that survives wide ambient conditions. The industrial variant MT41K64M16TW-107 IT:J, drop-in identical to this part, covers -40C to +95C. With 1 Gbit density organized 64M x 16, one device supplies code execution and data buffers for RTOS-based controllers without the cost of multi-chip configurations. Its 1.35 V operation reduces memory subsystem power and heat inside sealed enclosures compared with 1.5 V DDR3. Design consideration: provide power-good supervision of the 1.35 V rail and use the RESET# pin to guarantee a defined state after brownout events in electrically noisy factory environments.
Recommended
Networking Equipment
Switches, routers, and network interface cards use DDR3L as packet buffer and lookup-table memory. The MT41K64M16TW-107's 1866 MT/s data rate and x16 bus provide 3.7 GB/s peak bandwidth per device, sufficient for line-rate buffering in access-tier designs. The 96-ball FBGA package supports the short, impedance-controlled routing typical of networking boards. Multiple devices can share a controller channel in a fly-by topology with ODT. For networking designs, prioritize the IT grade for extended ambient, and confirm the network processor's DDR3L training algorithm supports Micron die revisions - a common integration pitfall in NPU-based designs.
Recommended
Consumer and Set-Top Platforms
Set-top boxes, smart TVs, and digital media players use single 1 Gbit DDR3L devices for application memory. The MT41K64M16TW-107's 1.35 V operation lowers total platform power versus 1.5 V DDR3, directly improving energy-star compliance and thermal design in sealed enclosures. Its low commodity-market pricing at volume (approximately $2.95 at 1,000 units as of 2026-09-02) fits cost-sensitive consumer BOMs. The commercial 0C to +95C grade is sufficient for indoor consumer environments, keeping cost minimal. The x16 organization matches the memory interface of common set-top SoCs, often requiring just one memory chip per system.
Recommended
Automotive Infotainment and Telematics
For automotive infotainment head units, telematics control units, and instrument clusters, the automotive variant MT41K64M16TW-107 AIT:J provides the same 1 Gbit 64Mx16 DDR3L functionality with automotive temperature qualification. According to Xecor comparison data, the AIT and IT variants exhibit identical performance profiles, meaning a design validated on the standard part migrates to the automotive grade without hardware change. DDR3L buffering supports navigation, media playback, and display pipelines. Design consideration: automotive environments demand power-supply brownout handling and defined RESET# behavior per OEM wake/sleep profiles - validate memory-state retention strategy across ignition cycles.
Recommended
Test and Measurement Instrumentation
Oscilloscopes, logic analyzers, and signal generators use DDR3L SDRAM as deep capture memory and waveform storage. The MT41K64M16TW-107's 1866 MT/s rate supports sustained streaming of ADC samples into buffer memory, while its 128 MB capacity provides useful capture depth in compact instruments. The deterministic, JEDEC-standard DDR3 interface simplifies FPGA-based memory controller implementations common in T&M architectures. IT-grade parts extend reliability in bench environments with variable temperature. When designing capture paths, budget for refresh-induced bandwidth loss (a few percent) and use the DM pin to mask fill data during idle segments.
Recommended
Recommended Products Summary
Engineering reference data for MT41K64M16TW-107 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MT41K64M16TW-107 IT:J | MT41K64M16TW-107 AIT:J | MT41K64M16TW-107:J | K4B4G1646E-BYK000 |
|---|---|---|---|---|---|
| Package | 96-FBGA (8x14 mm) | 96-FBGA (8x14) - same | 96-FBGA (8x14) - same | 96-FBGA (8x14) - same | 96-FBGA (8x14) - same footprint, verify ball map |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Samsung Electronics |
| Density / Organization | 1 Gbit / 64M x 16 | 1 Gbit / 64M x 16 | 1 Gbit / 64M x 16 | 1 Gbit / 64M x 16 | [DATA_NEEDED] |
| Speed Grade | 1866 MT/s (-107, 933 MHz, 20 ns) | 1866 MT/s (-107) | 1866 MT/s (-107) | 1866 MT/s (-107) | [DATA_NEEDED] |
| Supply Voltage | 1.35 V (1.283-1.45 V) | 1.35 V DDR3L | 1.35 V DDR3L | 1.35 V DDR3L | 1.35 V DDR3L |
| Operating Temperature | 0C to +95C | -40C to +95C | Automotive grade range | 0C to +95C | [DATA_NEEDED] |
| RoHS / Lead-Free | Compliant (J suffix) | Compliant (J suffix) | Compliant (J suffix) | Compliant (J suffix) | Compliant |
| Price (Qty 1, as of 2026-09-02) | $4.03 | [DATA_NEEDED] | [DATA_NEEDED] | $4.03 (Mouser) | [DATA_NEEDED] |
Key Differentiators
- Extended industrial temperature option in identical footprint (vs MT41K64M16TW-107 IT:J)
- Automotive-grade migration path on same silicon (vs MT41K64M16TW-107 AIT:J)
- High speed grade at 1 Gbit density (vs K4B4G1646E-BYK000)
Design Notes
DDR3L uses fly-by routing for the command/address/control bus with on-die termination (ODT) on the DRAM side. Keep CK/CK# as a tightly coupled differential pair, length-match CA signals to the clock within datasheet skew limits, and route each DQS/DQS# pair with its associated DQ byte lane matched in length. The 96-ball FBGA (8 x 14 mm) permits fan-out on standard via-in-pad or dog-bone patterns; maintain solid VDD/VSS reference planes beneath the memory to control impedance on the 1866 MT/s data lines.
Supply the device from a regulated 1.35 V rail within the 1.283 V to 1.45 V window. DDR3L peak currents occur during simultaneous read/write bursts, so place bulk capacitance near the device and multiple 100 nF ceramics on each VDD/VDDQ ball group. If the memory controller supports it, 1.5 V compatible mode is possible per Micron product data (refer to the DDR3 1.5V datasheet specifications in that mode). Estimated: at typical 1 Gbit DDR3L idle power levels of a few hundred milliwatts, thermal management is rarely needed - the FBGA package needs no heatsink.
Three frequent integration errors: (1) omitting the RESET# pull-down, leaving the DRAM in an undefined state at power-up - DDR3 requires RESET# low during power ramp; (2) selecting a memory-controller training algorithm not validated for the Micron die revision - confirm with the controller vendor; (3) substituting cross-brand DDR3L without verifying the exact ball map - JEDEC x16 96-ball maps are broadly standardized but not universally identical. Always verify against the Micron datasheet package section before swapping brands.
Compliance Information
The 'J' suffix in Micron part numbering (MT41K64M16TW-107:J) denotes lead-free, RoHS-compliant, halogen-free packaging per distributor listings. REACH and conflict-minerals declarations require Micron's official compliance certificate. Automotive-grade qualification applies to the -AIT:J variant, not this standard part.
