NT5CC256M16CP-DINA - 4Gb DDR3L SDRAM 256Mx16 | Nanya
MPN: NT5CC256M16CP-DINA β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.8 | $78.00 |
| 100 | $7.1 | $710.00 |
| 500 | $6.5 | $3,250.00 |
| 1,000 | $5.9 | $5,900.00 |
Drop-in alternatives for NT5CC256M16CP-DINA β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
NT5CC256M16DP-DI
β Drop-Inπ Reference alternative (not in catalog)
NT5CC256M16CP-DII
β Drop-Inβ 99,999 In Stock
$2.3 / Unit
View Datasheet βMT41K256M16HA-125
β Drop-Inβ 99,999 In Stock
$5.6 / Unit
View Datasheet βK4B4G1646D-BYK0
β Drop-Inπ Reference alternative (not in catalog)
IS43TR16512B-125KBLI
β Drop-Inπ Reference alternative (not in catalog)
NT5CC256M16CP-DINA Maximum Ratings & Electrical Characteristics
| Memory Type | DDR3L SDRAM |
| Density | 4 Gb |
| Organization | 256M x 16 |
| Supply Voltage | 1.35 V (DDR3L), backward compatible to 1.5 V |
| Data Rate | 1600 Mbps (DDR3-1600) |
| CAS Latency | 11 |
| Burst Length | 8 |
| Package | TFBGA-96, 9 x 13 mm, 0.8 mm pitch |
| Operating Temperature Range | -40Β°C to +95Β°C (industrial), -40Β°C to +105Β°C (automotive) |
| RoHS | Compliant |
| Halogen Free | Yes |
| Process Technology | 70nm |
| Interface | CMOS |
| Access Time | 0.225 ns |
| Mounting Type | Surface Mount |
NT5CC256M16CP-DINA Pin Configuration
| Pin A1 | VDD β Power supply (1.35V) |
| Pin A2 | DQ0 β Data input/output 0 |
| Pin A3 | DQ1 β Data input/output 1 |
| Pin B1 | VSS β Ground |
| Pin B2 | DQ2 β Data input/output 2 |
| Pin B3 | DQ3 β Data input/output 3 |
| Pin C1 | VDDQ β I/O power supply |
| Pin C2 | DQ4 β Data input/output 4 |
| Pin C3 | DQ5 β Data input/output 5 |
| Pin D1 | VSSQ β I/O ground |
| Pin D2 | DQ6 β Data input/output 6 |
| Pin D3 | DQ7 β Data input/output 7 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
NT5CC256M16CP-DINA is suitable for 6 applications: Embedded Computing, Industrial Automation, Automotive Infotainment, Networking Equipment, Medical Devices, Test and Measurement.
Embedded Computing
The NT5CC256M16CP-DINA provides high-density, low-power memory for embedded processors in industrial PCs and single-board computers. Its 1.35V operation reduces power consumption, while the 1600 Mbps data rate supports fast data processing. The wide temperature range ensures reliable operation in harsh environments, making it ideal for embedded systems that require long-term stability.
Recommended
Industrial Automation
In industrial automation, the NT5CC256M16CP-DINA offers reliable memory for PLCs and robotics controllers. Its industrial temperature range (-40Β°C to +95Β°C) and high reliability make it suitable for factory floors. The 4Gb density supports complex control algorithms, while the low voltage reduces heat generation in sealed enclosures.
Recommended
Automotive Infotainment
The NT5CC256M16CP-DINA is designed for automotive infotainment systems, with an extended temperature range up to +105Β°C. Its 4Gb capacity supports navigation, multimedia, and connectivity features. The 1.35V operation is compatible with automotive power rails, and the TFBGA package withstands vibration and thermal cycling.
Recommended
Networking Equipment
For networking equipment like routers and switches, the NT5CC256M16CP-DINA provides high-bandwidth memory for packet buffering and routing tables. The 1600 Mbps data rate ensures low latency, while the low power consumption is critical for energy-efficient network devices. The industrial temperature range supports outdoor and telecom environments.
Recommended
Medical Devices
In medical devices, the NT5CC256M16CP-DINA offers reliable memory for imaging and monitoring equipment. Its high density supports large data buffers, and the low voltage reduces power consumption in portable devices. The wide temperature range ensures operation in clinical environments, and RoHS compliance meets medical regulations.
Recommended
Test and Measurement
The NT5CC256M16CP-DINA is used in test and measurement instruments for high-speed data acquisition. Its 1600 Mbps data rate enables fast sampling, while the 4Gb capacity stores large waveforms. The industrial temperature range supports benchtop and field instruments, and the TFBGA package offers compact integration.
Recommended
Recommended Products Summary
Engineering reference data for NT5CC256M16CP-DINA β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | NT5CC256M16DP-DI | MT41K256M16HA-125 | K4B4G1646D-BYK0 |
|---|---|---|---|---|
| Package | TFBGA-96 | TFBGA-96 | TFBGA-96 | TFBGA-96 |
| Brand | Nanya Technology | Nanya Technology | Micron Technology | Samsung Electronics |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | 1600 Mbps | 1600 Mbps | 1600 Mbps | 1600 Mbps |
| CAS Latency | 11 | 11 | 11 | 11 |
| Operating Temperature | -40Β°C to +105Β°C | -40Β°C to +95Β°C | 0Β°C to +95Β°C | 0Β°C to +95Β°C |
Key Differentiators
- Wide temperature range (vs MT41K256M16HA-125)
- Low voltage operation (vs K4B4G1646D-BYK0)
- Same-brand availability (vs IS43TR16512B-125KBLI)
Design Notes
Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin to minimize power supply noise. Use a solid ground plane and route DDR3L signals with controlled impedance (typically 50 ohms single-ended, 100 ohms differential) to ensure signal integrity at 1600 Mbps.
The NT5CC256M16CP-DINA operates up to +105Β°C in automotive applications. Ensure adequate airflow or heatsinking in high-temperature environments. The TFBGA package has a thermal resistance that should be considered; refer to the datasheet for thermal characteristics and derating guidelines.
Follow the layout guidelines in the Nanya datasheet for DDR3L routing. Keep address/control signals matched in length to data signals, and use on-die termination (ODT) settings to reduce reflections. Maintain proper spacing between differential pairs and avoid vias on high-speed signals where possible.
Compliance Information
RoHS compliant and halogen-free per datasheet. AEC-Q100 not applicable for memory components.
