RTAX2000S-1LG624V - 2M-Gate Rad-Tolerant Antifuse FPGA | Microchip
MPN: RTAX2000S-1LG624V ✓ Active| Qty | Unit Price | Extended |
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Drop-in alternatives for RTAX2000S-1LG624V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX2000SL-1LG624V
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View Datasheet →RTAX2000S-1CG624V
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
RTAX2000S-1LG624V Maximum Ratings & Electrical Characteristics
| Equivalent System Gates | 2,000,000 gates |
| Configurable Logic Blocks (CLBs) | 21,504 |
| User I/Os (maximum, family) | Up to 684 |
| Embedded Memory | Up to 540 kbits SRAM with optional EDAC protection |
| Total Ionizing Dose (TID), functional | 300 krad (Si) |
| Total Ionizing Dose (TID), parametric | 200 krad (Si) |
| SEU Immunity | Less than 1E-10 errors per bit-day |
| Programming Technology | One-time programmable antifuse, nonvolatile |
| Configuration | Single-chip, live at power-up (no boot device required) |
| Process Technology | Digital CMOS |
| Speed Grade | -1 |
| Package | CG624, 624-pin ceramic column grid array |
| Package Temperature Suffix | V (space/military screening variant) |
| Family Lineage | RTAX-S/SL, based on commercial Axcelerator family |
| Mounting Type | Surface Mount |
RTAX2000S-1LG624V v (space/military screening variant) Pin Configuration Guide
Complete pinout information for RTAX2000S-1LG624V (v (space/military screening variant) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX2000S-1LG624V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX2000S-1LG624V is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Bus Controller and Avionics, Telemetry and Telecommand Interfaces, Radiation-Tolerant Glue Logic Consolidation, Deep-Space Instrument Front Ends, Processor Interfacing and High-Speed Bridges.
Satellite Payload Data Processing
The RTAX2000S-1LG624V fits payload data formatting and processing chains where 2,000,000 gates and 21,504 CLBs absorb framer, codec, and packetization logic on a single radiation-tolerant chip. Its up to 540 kbits of embedded SRAM with optional EDAC buffers telemetry streams without external memory, and the less-than-1E-10 errors per bit-day SEU rate protects multi-year LEO missions. Placed between ADCs or payload sensors and the downlink modulator, the antifuse fabric is live at power-up - no configuration boot window during which the payload is exposed. The -1 speed grade sustains the synchronous throughput of CCSDS-class pipelines, while 684 possible user I/Os in the CG624 package accommodate wide parallel data buses that would force multi-chip solutions on smaller devices.
Recommended
Spacecraft Bus Controller and Avionics
Spacecraft bus avionics - attitude control interfaces, mode management, and housekeeping aggregation - benefit from the RTAX2000S-1LG624V's true single-chip, live-at-power-up operation, which removes the configuration PROM and its latch-up/upset exposure from the reliability chain. With TID tolerance of 300 krad (Si) functional, the device survives multi-year bus missions without shielding derating. Its segmentable clock resources and chip-wide highway routing let designers partition bus interfaces, watchdog logic, and MIL-STD-1553 or SpaceWire glue functions within one die, while the ceramic CG624 package withstands launch vibration and thermal cycling. Antifuse programming also prevents configuration corruption, a critical property for safety-critical avionics that must be operational from separation event onward.
Recommended
Telemetry and Telecommand Interfaces
Telemetry/telecommand subsystems demand deterministic, always-on logic from the instant of power application - exactly what the antifuse RTAX2000S-1LG624V provides without any configuration delay. Embedded FIFO control logic on its SRAM blocks absorbs burst-rate differences between the command decoder and the spacecraft data bus, and optional EDAC protects the 540 kbit memory from accumulated upsets. The -1 speed grade supports standard TM/TC symbol rates with wide timing margin, reducing closure risk in flight designs. Because up to 684 user I/Os are available in the CG624 footprint, designers can terminate redundant command chains and cross-strapped telemetry outputs directly on the FPGA, cutting board-level relay and buffer count in the RF-adjacent section of the communications front end.
Recommended
Radiation-Tolerant Glue Logic Consolidation
Legacy spacecraft designs accumulate FIFOs, address decoders, bus bridges, and reset controllers across dozens of ASICs and PALs; consolidating them into the RTAX2000S-1LG624V replaces that inventory with one 2,000,000-gate, 21,504-CLB device, improving reliability by shrinking parts count. The antifuse fabric retains its configuration permanently, behaving like a mask-programmed ASIC from a radiation standpoint, while 540 kbits of on-chip SRAM with EDAC replace external FIFO memories. In the CG624 package, wide legacy buses (VME-like 32-bit backplanes, parallel memory interfaces) terminate natively within the 684-I/O capability. This consolidation approach is well established in space programs migrating discrete glue logic into RTAX-S devices ahead of flight software-defined upgrades.
Recommended
Deep-Space Instrument Front Ends
Instruments beyond Earth orbit face higher TID environments than LEO; the RTAX2000S-1LG624V's 300 krad (Si) functional / 200 krad (Si) parametric tolerance, combined with a sub-1E-10 errors per bit-day SEU rate, addresses mission profiles approaching inner-planet and deep-space trajectories when paired with appropriate spot shielding. Embedded memory with EDAC safeguards acquisition buffers in imaging and spectrometer chains, and the single-chip antifuse form factor eliminates configuration-memory upsets entirely - valuable when a reboot is hours or days away. Designers typically pipeline ADC data straight into CLB-based DSP filters using the -1 speed grade for timing headroom at reduced clock rates, trading frequency margin for additional radiation margin throughout the mission's life.
Recommended
Processor Interfacing and High-Speed Bridges
Space-qualified processors such as LEON-class cores need glueless bridges to DDR memories, SpaceWire routers, and peripheral buses; reference designs like the Aeroflex Gaisler RT-SPW router for the RTAX2000S/SL in CG624 demonstrate this device in exactly that role. The 21,504 CLBs host router logic, memory controllers with EDAC, and bus arbiters concurrently, while chip-wide highway routing maintains timing across the die for the -1 speed grade. Careful connection of the CG624 special pins documented in the datasheet and in Gaisler's table 81 is essential to programming and JTAG reliability. Because the FPGA is live at power-up, processor boot logic implemented inside the RTAX2000S-1LG624V is available at reset release without configuration latency.
Recommended
Recommended Products Summary
Engineering reference data for RTAX2000S-1LG624V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX2000SL-1LG624V | RTAX2000SL-CGS624E | RTAX250SL-LG624B | RTAX2000S-1CG624V |
|---|---|---|---|---|---|
| Package | CG624 (624-pin ceramic column grid array) | CG624 - same footprint | CGS624E - same 624-pin pattern, screened suffix | LG624 - same footprint, smaller die | CG624 - same footprint |
| Brand | Microchip Technology (Actel/Microsemi lineage) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 2,000,000 | 2,000,000 | 2,000,000 | 250,000 | 2,000,000 |
| CLBs | 21,504 | 21,504 | 21,504 | [DATA_NEEDED] | 21,504 |
| TID (functional) | 300 krad (Si) | 300 krad (Si) | 300 krad (Si) | 300 krad (Si) | 300 krad (Si) |
| SEU Rate | Less than 1E-10 errors per bit-day | Improved vs RTAX2000S (SL hardening) | Improved vs RTAX2000S (SL hardening) | Improved vs RTAX2000S (SL hardening) | Less than 1E-10 errors per bit-day |
| Embedded Memory | Up to 540 kbits with optional EDAC | Up to 540 kbits with optional EDAC | Up to 540 kbits with optional EDAC | Reduced (250k-gate die) | Up to 540 kbits with optional EDAC |
| Speed Grade | -1 | -1 | Standard (no -1 suffix) | Standard (no -1 suffix) | -1 |
| Technology | CMOS antifuse, nonvolatile, live at power-up | CMOS antifuse, nonvolatile, live at power-up | CMOS antifuse, nonvolatile, live at power-up | CMOS antifuse, nonvolatile, live at power-up | CMOS antifuse, nonvolatile, live at power-up |
Key Differentiators
- Highest SEU-hardened memory variant (vs RTAX2000S-1CG624V)
- Full 2M-gate density in same footprint (vs RTAX250SL-LG624B)
- Single-chip live-at-power-up antifuse (vs SRAM FPGAs (e.g., Virtex-class))
Design Notes
Connect the CG624 special pins exactly per the RTAX-S/SL datasheet pin table before releasing layout. Programming pins, JTAG, and charge-pump supply pins are dedicated and must not be repurposed; the Aeroflex Gaisler RT-SPW router user manual (table 81) publishes a verified CG624 connection example for the RTAX2000S/SL. Missing or miswired special pins are a leading cause of failed antifuse programming on flight lots.
Antifuse devices are one-time programmable - never program flight units during debug. Use the RTAX2000S-1LG624PROTO or the Aldec ACT-H3Ki-CG624 adaptor (flash-based ProASIC3E A3PE3000, capacity matched to RTAX2000S) for design iteration, then program flight devices only after timing closure and verification sign-off. Budget spare devices for the programming yield of your lot.
Estimated: supply current depends strongly on toggle rate and I/O loading; derive rail currents from Libero SoC power analysis at your design's activity factors rather than family maximums, and add margin for radiation-induced parameter drift within the 200 krad parametric TID envelope. Consult the manufacturer datasheet power tables for the -1 speed grade baseline figures.
Note from the manufacturer datasheet: RTAX2000S/SL and RTAX2000D/DL are NOT pin compatible in the CQ352 package type, and RTAX4000D/DL package overhang differs from RTAX4000S/SL. If your program may migrate densities or to the D (DSP-enhanced) variants, freeze the package choice early - a CQ352 design cannot simply swap RTAX2000S for RTAX2000D without layout rework.
Compliance Information
Space-grade ceramic-packaged device; qualification follows space-flow (QML-class V lineage per Microchip DLA cross-reference program) rather than AEC-Q100. Specific RoHS/REACH declarations were not present in the verified web data and must be requested from Microchip for the exact ordering code.