RTAX2000SL-CQ256V - 2M-Gate Rad-Tolerant FPGA | Microchip
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Drop-in alternatives for RTAX2000SL-CQ256V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX2000SL-1CQ256V
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View Datasheet →RTAX2000S-1CQ256PROTO
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RTAX2000SL-CQ256V Maximum Ratings & Electrical Characteristics
| System Gates | 2,000,000 |
| Configurable Logic Blocks (CLBs) | 21,504 |
| Logic Cells | 32,256 |
| Family | RTAX-S/SL Radiation-Tolerant FPGA |
| Technology | CMOS antifuse, nonvolatile, one-time programmable |
| Total Ionizing Dose (Functional) | 300 krad (Si) |
| Total Ionizing Dose (Parametric) | 200 krad (Si) |
| SEU Rate | < 1E-10 errors per bit-day |
| Embedded Memory | Up to 540 kbits with optional EDAC protection |
| Maximum User I/Os (family max) | 684 |
| Configuration | Live-at-power-up, no external configuration PROM |
| Package | CQ256, 256-pin ceramic quad flat pack (hermetic) |
| Mounting Type | Surface Mount |
RTAX2000SL-CQ256V cq256, 256-pin ceramic quad flat pack (hermetic) Pin Configuration Guide
Complete pinout information for RTAX2000SL-CQ256V (cq256, 256-pin ceramic quad flat pack (hermetic) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX2000SL-CQ256V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX2000SL-CQ256V is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Bus Control and Telemetry, Earth Observation Instrument Control, Deep-Space and MEO Mission Logic, Radiation-Tolerant Glue Logic and Bridging, Prototyping and Flight Development Flow.
Satellite Payload Data Processing
The RTAX2000SL-CQ256V processes high-rate instrument data on satellite payloads, where its 2,000,000 gates and 21,504 CLBs implement framer, formatter, and compression functions while the 540 kbit embedded memory with EDAC buffers telemetry streams. Its 300 krad functional TID tolerance exceeds typical LEO mission requirements with margin, and the SEU rate below 1E-10 errors per bit-day keeps payload logic soft-error-free over multi-year missions. Because the antifuse configuration is live at power-up, payload logic is operational before the first telemetry frame, avoiding the configuration-readout vulnerability of SRAM FPGAs in orbit.
Recommended
Spacecraft Bus Control and Telemetry
Spacecraft bus controllers use the RTAX2000SL-CQ256V to implement command decoders, telemetry encoders, and housekeeping logic between the onboard computer and subsystems. The true single-chip form factor reduces board count and mass, and live-at-power-up operation means watchdog and power-sequencing logic is active the instant spacecraft power is applied. The CMOS process delivers low static power, valuable on power-limited smallsat buses, while the hermetic CQ256 ceramic package withstands launch vibration and thermal cycling in vacuum with established reliability heritage across many flight programs.
Recommended
Earth Observation Instrument Control
Earth-observation instruments such as multispectral and SAR imagers demand deterministic timing and error-resistant data paths; the RTAX2000SL-CQ256V provides 32,256 logic cells for sensor timing generators, CCD driver sequencing, and channel-alignment FIFOs using its embedded SRAM with optional EDAC protection. Its parametric tolerance of 200 krad suits the moderate-radiation environment of polar sun-synchronous orbits, and the OTP antifuse guarantees that instrument timing logic cannot be corrupted by configuration upsets. Design flows typically prototype on RTAX2000SL-1CQ256PROTO hardware before committing the flight device.
Recommended
Deep-Space and MEO Mission Logic
MEO and interplanetary missions accumulate substantially higher total ionizing dose than LEO, and the RTAX2000SL-CQ256V is specified for exactly this regime: 300 krad functional and 200 krad parametric TID tolerance, with SEU below 1E-10 errors per bit-day. Navigation, command handling, and fault-management logic implemented in its 21,504 CLBs remains stable through multi-year Jovian or solar-probe trajectories where SRAM FPGAs would require costly scrubbing infrastructure. The hermetic ceramic CQ256 package additionally protects the die against the outgassing and moisture concerns irrelevant on Earth but critical in vacuum.
Recommended
Radiation-Tolerant Glue Logic and Bridging
Many spacecraft use rad-hard processors or SoCs whose interfaces must bridge to legacy payload and memory standards; the RTAX2000SL-CQ256V implements these bridges - PCI/SpaceWire framing, memory controllers, bus arbitration - using its 684-I/O-capable family architecture and embedded FIFO memory. Live-at-power-up antifuse configuration means bridge logic never misses boot-time initialization from the processor, and the OTP fabric eliminates configuration-storage single points of failure. Compared to discrete rad-hard logic families, a single RTAX2000SL consolidates dozens of packages, cutting board area, mass, and assembly cost.
Recommended
Prototyping and Flight Development Flow
The standard RTAX-S development flow prototypes the design on footprint-compatible devices before programming the one-time-programmable flight part. Engineers implement the design in Microchip Libero, verify timing at the -1 speed grade, then map the EDIF netlist through the pinout converter onto RTAX2000S-1CQ256PROTO or the Aldec flash-based ProASIC3E adaptor board for in-system validation. This preserves the exact CQ256 footprint and I/O assignment, so the verified netlist programs directly into RTAX2000SL-CQ256V flight devices with no board respin, reducing schedule risk inherent to OTP space silicon.
Recommended
Recommended Products Summary
Engineering reference data for RTAX2000SL-CQ256V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX2000SL-1CQ256V | RTAX2000S-1CQ256PROTO | RTAX2000SL-1CQ256PROTO |
|---|---|---|---|---|
| Package | CQ256 ceramic QFP (256 pins, hermetic) | CQ256 ceramic QFP - same | CQ256 ceramic QFP - same | CQ256 ceramic QFP - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 2,000,000 | 2,000,000 | 2,000,000 | 2,000,000 |
| Logic Cells | 32,256 | 32,256 | 32,256 | 32,256 |
| Speed Grade | Standard (no suffix) | -1 (faster) | -1 (faster) | -1 (faster) |
| TID Tolerance | 300 krad functional / 200 krad parametric (SL) | 300 krad functional / 200 krad parametric | [DATA_NEEDED] | 300 krad functional / 200 krad parametric (SL) |
| Programming Technology | Antifuse OTP, live-at-power-up | Antifuse OTP, live-at-power-up | Prototyping flow for antifuse devices | Prototyping flow for antifuse devices |
| Embedded Memory | Up to 540 kbits with optional EDAC | Up to 540 kbits with optional EDAC | Up to 540 kbits | Up to 540 kbits with optional EDAC |
Key Differentiators
- OTP antifuse live-at-power-up configuration (vs RTAX2000S-1CQ256PROTO)
- Higher speed-grade timing margin available in same footprint (vs RTAX2000SL-1CQ256V)
- Enhanced total-dose SL die versus standard S die (vs RTAX2000S-1CQ256PROTO)
Design Notes
RTAX2000SL antifuse devices are one-time programmable: a single programming error or late ECO consumes a flight part. Always close static timing at the target speed grade in Libero, run full simulation, and validate on the RTAX2000S-1CQ256PROTO or the Aldec flash-based adaptor board before releasing the flight lot. Order flight devices with schedule margin of at least one design iteration, since a respin requires new silicon rather than a re-flash.
The CQ256 ceramic QFP uses fine-pitch perimeter leads; design the land pattern per the Microchip package drawing and verify with the Libero I/O assignment report, since pin functions are user-assignable per bank. Follow datasheet guidance on power/ground pin pair assignments and decouple each VCCI/VCCA pin bank with low-ESR ceramics close to the package. Because live-at-power-up behavior is a key feature, ensure power ramps are monotonic so boot logic and watchdog circuits initialize correctly on the first cycle.
For flight designs, perform IBIS-based signal-integrity analysis on the CQ256 perimeter-ring package at your target clock rates; drive strengths and slew settings are programmable per I/O, so match termination to trace impedance on backplanes and flexible harnesses common in spacecraft electronics. Enable EDAC on embedded memory blocks used for telemetry buffering to meet the sub-1E-10 errors/bit-day system SEU budget. Simulate single-event functional interrupt recovery paths in your design before flight review.
Compliance Information
Space-flight ceramic-packaged device; qualification follows space/QML flows per Microchip DLA documentation rather than AEC-Q100. RoHS/REACH status must be confirmed with Microchip for the specific date code and screening level.
