RTAX250S-1CQ352V - 250K-Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX250S-1CQ352V ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1590 | $159,000.00 |
| 500 | $1480 | $740,000.00 |
| 1,000 | $1395 | $1,395,000.00 |
Drop-in alternatives for RTAX250S-1CQ352V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX250S-1CQ352EV
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RTAX250SL-CQ352V
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View Datasheet →RTAX2000S-1CQ352V
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View Datasheet →RTAX1000SL-CQ352V
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View Datasheet →RTAX4000SL-CQ352EV
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$10250 / Unit
View Datasheet →RTAX250S-1CQ352V Maximum Ratings & Electrical Characteristics
| Manufacturer | Microchip Technology (Microsemi/Actel) |
| Family | RTAX-S Radiation-Tolerant FPGAs |
| Equivalent Gate Count | 250,000 gates |
| Logic Cells | 4,224 |
| CLBs | 2,816 |
| Additional ASIC Gates | 30,000 |
| Core Supply Voltage (Nominal) | 1.5 V |
| Core Supply Voltage Range | 1.425 V to 1.575 V |
| Process Technology | CMOS |
| Speed Grade | -1 |
| Package | CQ352 (352-pin ceramic column quad flat package) |
| Programming Technology | Antifuse, one-time programmable, live at power-up |
| Target Environment | Radiation-tolerant, spaceflight |
| Mounting Type | Surface Mount |
| Configuration | Single-chip, no external configuration device required |
RTAX250S-1CQ352V cq352 (352-pin ceramic column quad flat package) Pin Configuration Guide
Complete pinout information for RTAX250S-1CQ352V (cq352 (352-pin ceramic column quad flat package) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX250S-1CQ352V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX250S-1CQ352V is suitable for 6 applications: Satellite On-Board Data Handling, Payload Control and Sequencing, Instrument Data Acquisition and Preprocessing, Spacecraft Bus Avionics, Launch Vehicle and Reentry Electronics, Deep-Space and Planetary Probe Electronics.
Satellite On-Board Data Handling
The RTAX250S-1CQ352V fits spacecraft on-board data handling (OBDH) units where 250,000 gates and 4,224 logic cells implement telemetry formatting, command decoding, memory controllers, and spacecraft-mode sequencers in a single device. Its antifuse, live-at-power-up architecture means logic is operational the instant spacecraft power is applied - essential for launch-vehicle separation events and safe-mode entry where no configuration boot delay is tolerable. The 1.5V nominal core supply keeps dynamic power low on limited solar-array and battery budgets, and the hermetic CQ352 ceramic package withstands the thermal cycling of LEO eclipses. Designers typically interface the FPGA to rad-tolerant memories and spacecraft buses, using the 30,000 ASIC gates for embedded FIFO and dual-port SRAM functions that offload glue logic.
Recommended
Payload Control and Sequencing
Payload controllers benefit from the RTAX250S-1CQ352V's combination of 250,000 equivalent gates and deterministic, single-chip startup. Payload sequencing logic - instrument power-up trees, safe/arm interlocks, and mode state machines - must be live before ground contact, which the antifuse architecture guarantees without any external configuration memory. The -1 speed grade provides adequate timing for sequencing clocks of tens of MHz while minimizing switching power, and the 1.425V to 1.575V supply window tolerates spacecraft point-of-load regulator drift. The 352-pin CQ352 ceramic package gives ample user I/O for interfacing instrument front-ends, and prototypes can be verified on commercial Axcelerator devices per Microchip application note AC170 before committing flight-lot antifuse units.
Recommended
Instrument Data Acquisition and Preprocessing
Scientific instruments on satellites and probes use the RTAX250S-1CQ352V to implement ADC interface glue logic, data framing, FIFO buffering, and DSP pre-processing pipelines. The 2,816 CLBs and embedded SRAM blocks handle line-scan or frame-based data streams, while the 30,000 ASIC gates provide dedicated memory functions that conserve logic cells. Low dynamic power at the 1.5V core helps meet instrument thermal budgets in tightly packaged optical benches. Because data paths benefit from the Axcelerator-derived carry chains and routing fabric, timing closure at moderate clock rates is straightforward with Microchip Designer tooling. The hermetic CQ352 package supports the stringent outgassing and moisture-resistance requirements of instruments operating in vacuum over multi-year missions.
Recommended
Spacecraft Bus Avionics
Bus avionics modules - reaction-wheel controllers, sun-sensor and star-tracker interfaces, and power-distribution supervision - use the RTAX250S-1CQ352V where a rad-tolerant, single-chip FPGA must survive the natural space radiation environment for mission duration. The RTAX-S family is Microchip's choice for space designers because it combines radiation tolerance with the reliability of antifuse interconnect, which cannot suffer radiation-induced configuration upsets the way SRAM fabrics can. The 250K-gate capacity consolidates multiple discrete glue-logic functions into one device, reducing part count and board area on the avionics card. Live-at-power-up operation supports autonomous fault recovery, and the CQ352 ceramic package meets standard spacecraft assembly and screening flows.
Recommended
Launch Vehicle and Reentry Electronics
Launch vehicles and reentry systems specify the RTAX250S-1CQ352V for flight-control logic, telemetry encoders, and ordnance sequencing where the electronic unit experiences extreme vibration, shock, and short mission durations with zero-failure requirements. The hermetic ceramic CQ352 package resists the mechanical stress of launch, and the antifuse configuration cannot corrupt under the radiation and single-event environments of ascent and space. With 250,000 gates, designers implement redundant voting logic, built-in test, and dual-string control channels within one device, supporting fault-tolerant architectures. The device's live-at-power-up behavior ensures sequencing logic is active from power application at the pad, and QML Class V-related flows available in the RTAX family support mission assurance documentation.
Recommended
Deep-Space and Planetary Probe Electronics
Planetary probes and deep-space spacecraft operate for years in high-radiation regimes far beyond LEO, making the RTAX250S-1CQ352V's radiation-tolerant antifuse fabric attractive for command and data handling, instrument control, and communication framing functions. The 1.5V core keeps total power low - a dominant constraint when solar flux is weak at outer planets - and the single-chip configuration removes the boot dependencies that complicate fault recovery after cruise-phase power cycles. The 250K-gate capacity supports protocol engines and image-data compression pre-processing. Mission designers typically prototype on commercial Axcelerator parts per AC170, then program flight-lot RTAX250S dies in CQ352 hermetic packages for integration into probe electronics suites.
Recommended
Recommended Products Summary
Engineering reference data for RTAX250S-1CQ352V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX250S-1CQ352EV | RTAX250SL-CQ352V | RTAX2000S-1CQ352V | RTAX1000SL-CQ352V | RTAX4000SL-CQ352EV |
|---|---|---|---|---|---|---|
| Package | CQ352 (352-pin ceramic) | CQ352 - same | CQ352 - same | CQ352 - same | CQ352 - same | CQ352 - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 250,000 | 250,000 | 250,000 (SL variant) | ~200,000 | ~100,000 | ~400,000 |
| Logic Cells | 4,224 | 4,224 | 4,224 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| CLBs | 2,816 | 2,816 | 2,816 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Grade | -1 | -1 | [DATA_NEEDED] | -1 | [DATA_NEEDED] | -1 |
| Core Voltage | 1.5 V nominal (1.425-1.575 V) | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal |
| Qualification Flow Suffix | V | E | V | V | V | E |
Key Differentiators
- True single-chip, live-at-power-up operation (vs RTAX2000S-1CQ352V)
- Largest capacity in the CQ352-compatible family (vs RTAX1000SL-CQ352V)
- Trade-off: no reprogrammability versus SRAM space FPGAs (vs RTAX250S-1CQ352EV)
Design Notes
The RTAX250S-1CQ352V is one-time programmable antifuse silicon - there is no reconfiguration path after programming. Follow Microchip application note AC170 and compile the flight design into a commercial Axcelerator device (e.g., AX250) or use an RTAX-S/SL PROTO device for full functional and timing verification before submitting flight-lot dies for programming. Errors discovered after antifuse programming cannot be patched and typically cost an entire die lot. Maintain rigorous source-control of the programming bitstream.
The core supply must be held within 1.425V to 1.575V at 1.5V nominal. Spacecraft point-of-load converters should be selected with tight load-line regulation across radiation-degraded lifetime operation. Estimated: at this capacity class, core dynamic current scales with switching activity; characterize with Microchip Designer power estimator using your utilization vectors before sizing the core rail. Add local 0.1uF ceramic decoupling per power pin group plus bulk capacitance at the board entry, and account for inrush when the live-at-power-up fabric initializes.
The CQ352 ceramic column package requires a 352-pad footprint matched to the column-grid land pattern specified in the RTAX-S/SL datasheet. Use symmetric pad geometry to avoid tombstoning during reflow of the heavy ceramic body, and inspect solder columns with X-ray after assembly since hidden joints are common under CQFP bodies. Route high-speed I/O on inner layers with adjacent ground references to control crosstalk across the dense 352-pin perimeter, and provide ESD protection on interfaces exposed during ground handling and integration.
Compliance Information
Space-grade ceramic package; compliance declarations are typically program-specific. Qualification references Mil Prf 38535 / QML Class Q and V per the Microchip DLA Cross Reference Guide; consult Microchip for formal RoHS/REACH statements on this military/space part.
