RTAX250SL-1CQ352V - 250K-Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX250SL-1CQ352V ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for RTAX250SL-1CQ352V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX250SL-CQ352V
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View Datasheet →RTAX250SL-1CQ352E
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RTAX250S-1CQ352V
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$1395 / Unit
View Datasheet →RTAX1000SL-1CQ352V
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$810 / Unit
View Datasheet →RTAX2000SL-1CQ352V
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$2050 / Unit
View Datasheet →RTAX4000SL-1CQ352E
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View Datasheet →RTAX250SL-1CQ352V Maximum Ratings & Electrical Characteristics
| Logic Cells | 4224 |
| Configurable Logic Blocks (CLBs) | 2816 |
| Equivalent System Gates | 250,000 |
| User I/O Inputs | 198 |
| User I/O Outputs | 198 |
| Total Terminals | 352 |
| Package | 352-pin Ceramic CQFP (CQ352) |
| Core Supply Voltage | 1.5 V |
| Process Technology | 0.15 um CMOS |
| Maximum System Frequency | 649 MHz (family rating) |
| Technology Type | Anti-fuse, live-at-power-up |
| Radiation Tolerance | Radiation-tolerant (RTAX-SL class) |
| Family | RTAX-S/SL Radiation-Tolerant FPGAs |
| Embedded Memory | Embedded SRAM with built-in FIFO control |
| Programming Type | One-time programmable (OTP) anti-fuse |
| Screening Suffix | -V qualification/screening flow |
| Mounting Type | Surface Mount |
RTAX250SL-1CQ352V 352-pin ceramic cqfp (cq352) Pin Configuration Guide
Complete pinout information for RTAX250SL-1CQ352V (352-pin ceramic cqfp (cq352) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX250SL-1CQ352V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX250SL-1CQ352V is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Command and Telemetry Interfaces, Launch Vehicle Avionics, Radiation-Hardened Image Processing, Deep-Space Science Instrument Logic, Ground Prototyping of RTAX Flight Designs.
Satellite Payload Data Processing
The RTAX250SL-1CQ352V fits satellite payload data processing because its anti-fuse fabric is immune to configuration upsets, eliminating scrubbing hardware that SRAM-based space FPGAs require, and its live-at-power-up behavior guarantees payload logic is operational the instant the power bus energizes. With 250,000 equivalent gates, 2816 CLBs, and 198 user I/O in the hermetic 352-pin CQFP, it absorbs frame formatting, compression staging, and bus bridging around payload sensors. Embedded SRAM blocks with built-in FIFO control buffer sensor streams without external memories, reducing parts count and single-point failures. Designers typically place it between payload sensors and the spacecraft telemetry backbone, using the SL enhanced TID performance for long LEO or GEO missions.
Recommended
Spacecraft Command and Telemetry Interfaces
For command and telemetry, the RTAX250SL-1CQ352V implements MIL-STD-class serial protocols, UART bridging, and discrete I/O consolidation with deterministic latency because the anti-fuse routing is fixed at programming time. The 198-input/198-output user I/O capability covers the dozens of discrete status lines, redundant serial links, and clock distributions typical of a command/telemetry unit, all within one 352-terminal ceramic CQFP. Because RTAX devices are single-chip, no external configuration PROM is needed, removing a common failure point from the command chain. The SL TID enhancement supports multi-year GEO missions where cumulative dose is highest, and the -V screening flow matches typical spacecraft qualification requirements.
Recommended
Launch Vehicle Avionics
Launch-vehicle avionics demand logic that is fully functional within milliseconds of battery spin-up; the RTAX250SL-1CQ352V's live-at-power-up anti-fuse architecture meets this without configuration delay, a decisive advantage over SRAM FPGAs that need boot sequences. The device's 0.15 um CMOS 1.5V core keeps static power low during long pre-launch standby, while the 649 MHz family fabric rating accommodates flight-processor glue logic, telemetry encoders, and safety-critical voting circuits. Hermetic CQFP packaging withstands the vibration and thermal profiles of ascent, and the RTAX-SL radiation tolerance covers the Van Allen belt transits that many orbital-insertion trajectories require. Designs typically reserve margin on the 250K-gate budget for fault-tolerant triple-modular-redundancy structures.
Recommended
Radiation-Hardened Image Processing
Image-processing pipelines on Earth-observation satellites use the RTAX250SL-1CQ352V for front-end preprocessing: gain correction, decimation, and packetization of CCD/CMOS imager streams. Embedded SRAM FIFOs line-buffer pixel data locally, and the chip-wide highway routing supports wide internal datapaths needed for parallel pixel arithmetic. The 198 user I/O accommodates high-bit-depth imager interfaces plus the parallel output to mass-storage or downlink chains within the CQ352 footprint. Because anti-fuse configuration cannot flip in orbit, the image pipeline behaves identically on day one and year five, simplifying calibration assumptions. Designers pair it with the SL enhanced TID rating to survive total-dose accumulation across multi-year observation missions.
Recommended
Deep-Space Science Instrument Logic
Deep-space probes face heavy-ion flux and extreme total dose; the RTAX250SL-1CQ352V's SL-class radiation tolerance and OTP anti-fuse interconnect address both, since single events cannot corrupt the routing fabric. The single-chip form factor and low 1.5V core power suit power-constrained probes, where every milliwatt of the power budget is contested. Typical logic roles include instrument sequencer, ADC framing, science-data formatting, and autonomous fault-handling state machines. The 250K-gate capacity generally suffices for instrument control while larger datasets are buffered into the embedded SRAM FIFOs. The -V screening flow and hermetic 352-pin CQFP align with planetary-protection and mission-reliability screening conventions used by deep-space programs.
Recommended
Ground Prototyping of RTAX Flight Designs
Before committing one-time-programmable flight silicon, teams prototype RTAX250SL-1CQ352V designs on reprogrammable hardware: the Aldec/Microchip prototyping flow maps RTAX designs onto flash-based ProASIC3E devices (for example A3PE3000 family parts) through a prototype adaptor, preserving timing attributes close to flight units. This lets engineers iterate RTL, verify FIFO behavior of embedded SRAM blocks, and exercise testbenches without consuming scarce RTAX250SL units. The PROTO-packaged RTAX parts (non-hermetic ceramic) also offer datasheet-identical timing for in-circuit bring-up. After prototyping, the design flows through Libero SoC place-and-route unchanged to the RTAX250SL-1CQ352V flight device, preserving pin constraints on the CQ352 footprint.
Recommended
Recommended Products Summary
Engineering reference data for RTAX250SL-1CQ352V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX250SL-CQ352V | RTAX250S-1CQ352V | RTAX1000SL-1CQ352V | RTAX4000SL-1CQ352E |
|---|---|---|---|---|---|
| Brand | Microchip Technology (Actel/Microsemi heritage) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 352-pin Ceramic CQFP (CQ352) | 352-pin Ceramic CQFP (CQ352) - same | 352-pin Ceramic CQFP (CQ352) - same | 352-pin Ceramic CQFP (CQ352) - same | 352-pin Ceramic CQFP (CQ352) - same |
| Equivalent System Gates | 250,000 | 250,000 | 250,000 (RTAX-S base) | 1,000,000 | 4,000,000 |
| User I/O (per direction) | 198 in / 198 out | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | -1 | standard (verify grade) | -1 | -1 | -1 |
| Radiation Class | RTAX-SL (enhanced TID) | RTAX-SL | RTAX-S (base) | RTAX-SL | RTAX-SL |
| Screening Suffix | -V | -V | -V | -V | -E |
| Configuration | OTP anti-fuse, live-at-power-up | OTP anti-fuse | OTP anti-fuse | OTP anti-fuse | OTP anti-fuse |
Key Differentiators
- Enhanced TID radiation performance (SL class) (vs RTAX250S-1CQ352V)
- Configuration-upset-immune OTP anti-fuse fabric (vs SRAM-based space FPGAs (e.g., Xilinx QPro Virtex))
- Live-at-power-up operation with no external boot device (vs RTAX250SL-CQ352V (speed-grade trade))
Design Notes
Do not confuse screening and speed-grade suffixes when ordering. In RTAX250SL-1CQ352V, the -1 is the speed grade and the V is the qualification/screening flow; a suffix error on a space-grade order can render the lot unusable for flight and lead times are long. Confirm the exact MPN against your program parts list, verify traceability and screening certificates with the distributor, and pin the date-code requirements before releasing the purchase order. Substitutions between E and V screening flows require program-level approval.
Supply the 1.5V core with clean, sequenced rails per the Microchip RTAX-S/SL datasheet power-up requirements; because the device is live-at-power-up, inrush and rail sequencing must be characterized on the actual flight board. Estimate core current from Libero SoC SmartPower reports for your design rather than family averages - anti-fuse static current is low, but I/O bank switching dominates in wide telemetry interfaces. Provide solid decoupling at each VCC/VCCA bank and follow the datasheet guidelines for I/O bank pre-drive voltages during power ramp.
The hermetic ceramic CQFP-352 requires careful land-pattern and reflow control: large ceramic packages have a CTE mismatch with standard FR4, so follow the manufacturer-recommended land pattern and consider corner-leaded mechanical relief for high-vibration launch environments. Break out the 352 leads on at least two internal signal layers with dedicated return planes under each I/O bank. Because RTAX designs are one-time-programmable, use the Aldec/ProASIC3E prototyping adaptor or a PROTO-packaged RTAX part to validate the board before committing flight silicon.
Compliance Information
Hermetic ceramic CQFP space-grade packaging; compliance declarations (RoHS/REACH exemptions for aerospace) must be requested from Microchip for the specific screening lot. Not an automotive AEC-Q100 device.
