RTAX250SL-CQ352V - 250k-Gate Rad-Tolerant FPGA | Actel
MPN: RTAX250SL-CQ352V β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for RTAX250SL-CQ352V β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
RTAX250SL-1CQ352V
β Drop-Inπ Reference alternative (not in catalog)
RTAX250SL-1CQ352PROTO
β Drop-Inπ Reference alternative (not in catalog)
RTAX250S-CQ352
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
RTAX1000SL-CQ352V
β Drop-Inβ In Stock
Contact for price
View Datasheet βRTAX250S-1CQ352
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
RTAX250SL-CQ352V Maximum Ratings & Electrical Characteristics
| Family | RTAX-S/SL Radiation-Tolerant FPGAs |
| Equivalent System Gates | 250000 gates |
| Logic Cells | 4224 |
| Configurable Logic Blocks (CLBs) | 2816 |
| Process Technology | CMOS |
| Core Supply Voltage (Nominal) | 1.5 V |
| Core Supply Voltage Range | 1.425 V to 1.575 V |
| Number of Inputs | 198 |
| Number of Outputs | 198 |
| Total Terminals | 352 |
| Package | CQFP-352 (CQ352) ceramic |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Combinatorial Delay (max) | 0.93 ns |
| Operation | Live at power-up |
| Mounting Type | Surface Mount |
| Application Domain | Space-flight systems |
RTAX250SL-CQ352V cqfp-352 (cq352) ceramic Pin Configuration Guide
Complete pinout information for RTAX250SL-CQ352V (cqfp-352 (cq352) ceramic package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX250SL-CQ352V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX250SL-CQ352V is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Telemetry and Command (TM/TC) Interface, On-Board Memory Controller with EDAC, Scientific Instrument Control and Timing, Launch Vehicle Avionics and Flight Termination Logic, Design Prototyping and Flight-Design Migration.
Satellite Payload Data Processing
The RTAX250SL-CQ352V fits satellite payload processing because its 250,000 equivalent gates and 4224 logic cells provide enough fabric for on-board compression, format conversion, and sensor data framing, while its radiation-tolerant CMOS construction survives the total ionizing dose accumulated over multi-year LEO and GEO missions. Its embedded SRAM blocks with built-in FIFO control logic buffer high-rate payload streams without external memory in many designs. In the processing chain, the FPGA sits between payload sensors and downlink electronics, implemented in the 352-terminal ceramic CQFP package that withstands launch vibration and thermal cycling. Because the device operates live at power-up, payload boot logic is available immediately after spacecraft power application, removing the need for a separate configuration device or configuration-watchdog circuitry.
Recommended
Spacecraft Telemetry and Command (TM/TC) Interface
The RTAX250SL-CQ352V suits TM/TC interfaces because its 198 inputs and 198 outputs accommodate redundant command decoders, telemetry formatters, and UART/CAN-style protocol engines in a single rad-tolerant chip. The live-at-power-up behavior guarantees that command decode logic is functional the instant the spacecraft power bus is energized - critical during launch-sequence and safe-mode operations when no configuration controller is available. Low static power of the SL variant conserves power during eclipse operations when solar arrays provide no energy. Implemented on the 1.5V core with ceramic CQFP-352 packaging, the device meets the hermeticity and reliability expectations of spacecraft avionics boxes, and its Axcelerator-derived fabric runs CCSDS-compliant framing logic at adequate clock rates for classic TM/TC data rates.
Recommended
On-Board Memory Controller with EDAC
The RTAX250SL-CQ352V is a strong fit for on-board memory controllers because its embedded SRAM blocks include built-in FIFO control logic, and the remaining fabric implements EDAC (error detection and correction) engines such as Hamming or Reed-Solomon codecs that mitigate single-event upsets in external spacecraft memories. The 250k-gate capacity comfortably hosts address generation, refresh control, scrubbing state machines, and bus interfaces simultaneously. Placed between the spacecraft processor and mass-memory devices, the FPGA scrubs memory continuously in the background, with the scrub rate set by a design parameter balanced against power and bus availability. The ceramic CQFP-352 package supports the assembly and inspection flows specified in space-grade manufacturing, and its 1.5V core keeps controller power within typical avionics budgets.
Recommended
Scientific Instrument Control and Timing
Scientific instruments on research satellites require precise, low-jitter timing and deterministic control sequences - requirements the RTAX250SL-CQ352V meets with its segmentable clock resources and chip-wide highway routing, which distribute timing across the 250k-gate fabric with predictable skew. The Axcelerator-based architecture, with a maximum combinatorial delay around 0.93 ns in the -1 speed grade variant, supports detector readout sequencing, exposure control, and high-resolution time-tagging in the same rad-tolerant chip. Instruments orbiting through the South Atlantic Anomaly benefit directly from the RTAX-S/SL radiation tolerance, maintaining timing integrity through single-event transient events. The 198 user I/O on the CQFP-352 package interface CCD/CMOS detectors, ADCs, and cryo-valve drivers within a single hermetic component.
Recommended
Launch Vehicle Avionics and Flight Termination Logic
The RTAX250SL-CQ352V fits launch-vehicle avionics because one-time flight configuration combined with live-at-power-up operation eliminates configuration-readup vulnerabilities during the seconds of highest vibration and acceleration, a known weakness of SRAM FPGAs requiring external configuration storage. Its 250k gates implement redundant voting logic, safe-and-arm interfacing, and bus protocol bridges, while the ceramic CQFP-352 package withstands the mechanical shock and thermal profile of ascent. The 1.425V-1.575V core tolerance accommodates the supply droop typical of distributed vehicle power during engine transients. Because radiation-tolerant rather than fully rad-hard, the device suits guided missions and expendable launchers where mission duration is short but environmental severity is extreme, complementing Microchip's broader space-flight product line.
Recommended
Design Prototyping and Flight-Design Migration
The RTAX250SL-CQ352V anchors a prototyping-to-flight migration flow endorsed by the manufacturer: engineers develop on footprint-compatible prototyping hardware - such as the RTAX250SL-1CQ352PROTO in the identical 352-terminal package - using the EDIF netlist and pinout converter methodology described in the RTAX-S/SL datasheet, then drop in the flight device without PCB redesign. This flow lets teams validate timing, I/O behavior, and thermal performance on commercial-test equipment before committing scarce flight units. The 250k-gate density is large enough for representative algorithm implementations yet small enough for rapid place-and-route iterations. Because the RTAX family is based on the commercial Axcelerator architecture, simulation models and timing libraries are shared across prototyping and flight variants, reducing design-verification risk substantially.
Recommended
Recommended Products Summary
Engineering reference data for RTAX250SL-CQ352V β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX250SL-1CQ352V | RTAX250SL-1CQ352PROTO | RTAX1000SL-CQ352V | RTAX250S-CQ352 |
|---|---|---|---|---|---|
| Package | CQFP-352 (CQ352) ceramic | CQFP-352 - same | CQFP-352 - same | CQFP-352 - same | CQFP-352 - same |
| Brand | Actel (Microsemi / Microchip Technology) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 250000 | 250000 | 250000 | [DATA_NEEDED] | 250000 |
| Logic Cells | 4224 | 4224 | 4224 | [DATA_NEEDED] | 4224 |
| Core Supply Voltage | 1.5 V (1.425 V - 1.575 V) | 1.5 V (1.425 V - 1.575 V) | 1.5 V (1.425 V - 1.575 V) | 1.5 V | 1.5 V (1.425 V - 1.575 V) |
| Speed Grade / Combinatorial Delay | Standard grade | -1 grade, 0.93 ns max | -1 grade, 0.93 ns max | [DATA_NEEDED] | Standard grade |
| Power Variant | SL (low-power) | SL (low-power) | SL (low-power) | SL (low-power) | S (standard power) |
| Intended Use | Flight (space) | Flight (space) | Development / prototyping | Flight (space) | Flight (space) |
Key Differentiators
- Flight-grade silicon at standard speed grade pricing (vs RTAX250SL-1CQ352V)
- Lower static power than the standard RTAX-S variant (vs RTAX250S-CQ352)
- Footprint-identical prototyping path (vs RTAX250SL-1CQ352PROTO)
Design Notes
Supply the RTAX250SL-CQ352V core with a regulated 1.5V rail within the 1.425V-1.575V window specified by Microchip USA product data. Estimated: RTAX-S family static power scales with operating junction temperature, so a thermal analysis of the avionics enclosure should precede power budget sign-off. Use the Microchip Libero power calculator with post-layout netlist activity to estimate dynamic current; do not rely on worst-case spreadsheet numbers alone, as SL static power varies with temperature and process corner.
Follow the prototyping methodology from the manufacturer datasheet: validate the design on a footprint-compatible adaptor board (or the RTAX250SL-1CQ352PROTO unit) and migrate via the EDIF netlist and pinout converter before fabricating the flight PCB. Ceramic CQFP-352 leads require careful coplanarity handling during soldering; use the assembly profile recommended for ceramic column packages and avoid mechanical stress on leads during socket testing, which can cause latent lead fractures in flight hardware.
RTAX-S/SL flight devices are programmed for flight use - do not rely on in-flight reconfiguration. Complete full timing closure, SEU-mitigation analysis (triple modular redundancy on control logic where applicable), and board-level simulation before committing flight units. Verify that every user I/O on the 198-input/198-output complement meets the datasheet I/O standard and current-limiting requirements, and confirm lot traceability documentation with the distributor at time of order, a routine requirement for space-flight component acceptance.
Compliance Information
Compliance data not present in retrieved web data. Space-grade ceramic-hermetic packages may carry RoHS exemptions (e.g., lead in ceramic/terminals); confirm via Microchip Certificate of Conformance.
