XC5VLX85-1FF676I - 82,944-Cell Virtex-5 LX FPGA | AMD
MPN: XC5VLX85-1FF676I ✓ ActiveXC5VLX85-1FF676I Overview
An FPGA is a programmable semiconductor whose logic fabric, interconnect network, and configurable I/O blocks can be adapted after manufacture. Within the device hierarchy, the XC5VLX85 is a Virtex-5 LX FPGA, while Virtex-5 LX is a high-performance FPGA family within the broader field-programmable logic category. The XC5VLX85-1FF676I combines 6,480 logic activity blocks with substantial embedded block RAM, making it suitable for parallel processing, signal processing, communications infrastructure, and industrial control systems.
Three principal characteristics define the device: 82,944 logic elements provide the configurable digital fabric; 3,538,944 bits of RAM support buffering, lookup tables, packet storage, and general-purpose on-chip memory; and 440 I/O positions enable high external connectivity. The 676-FCBGA package uses a 27 mm by 27 mm footprint and is intended for multilayer PCB designs with dense ball-grid routing and controlled power and ground distribution.
The -1 speed designation identifies the device’s performance grade within the XC5VLX85 family. The trailing I designation denotes the industrial temperature grade. The core voltage range is 0.95 V to 1.05 V, and the listed architecture includes 12,960 cells according to the Virtex-5 LX family description. Exact configuration counts, clock limits, auxiliary supply requirements, and package thermal details must be confirmed in the applicable Xilinx or AMD device documentation before a new design is released.
Typical applications include network packet processing, telecommunications line cards, industrial vision and control, high-speed data acquisition, embedded signal processing, and test-equipment control. The combination of substantial logic, block RAM, and 440 I/O is particularly useful where parallel datapaths and many external interfaces must coexist on one programmable device.
PCB implementation requires careful attention to ball-grid escape routing, layer transitions, decoupling, clock integrity, and power sequencing. Use the manufacturer’s pinout and package-mechanical documentation for every ball assignment, and validate the complete power distribution network against the selected I/O configuration and operating temperature.
This page consolidates the device’s confirmed electrical, logical, environmental, and packaging characteristics, then adds practical selection guidance, application context, and engineering considerations for teams planning Virtex-5 LX FPGA implementations.
Drop-in alternatives for XC5VLX85-1FF676I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC5VLX85-1FF676I (same form factor and footprint) — differing in Device Type, Programmable Logic Type, Speed Grade, Core Supply Voltage, Logic Cells.
XC5VLX85-2FF676I
✅ Drop-InContact for price
View Datasheet →XC5VLX85-1FF676C
✅ Drop-InContact for price
View Datasheet →XC5VLX85-2FFG676I
✅ Drop-In📋 Reference alternative (not in catalog)
XC5VLX85-3FF676I
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XC5VLX85-1FFG676I
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XC5VLX85-1FF676I Maximum Ratings & Electrical Characteristics
| Device Type | Virtex-5 LX Field Programmable Gate Array |
| Logic Elements | 82,944 elements |
| Cells | 12,960 cells |
| Logic Activity Blocks | 6,480 LABs/CLBs |
| Block RAM | 3,538,944 bits |
| User I/O | 440 I/O |
| Process Technology | 65 nm CMOS |
| Core Supply Voltage | 0.95 V to 1.05 V |
| Operating Junction Temperature | -40°C to +100°C |
| Package | 676-FCBGA, 27 mm × 27 mm |
| Device Family | Virtex-5 LX |
| Speed Grade | -1 |
| Temperature Grade | Industrial |
| Programmable Logic Type | FPGA |
| Mounting Type | Surface Mount |
| Manufacturer Pack Quantity | 1 unit |
| Moisture Sensitivity Level | MSL 4 (72 hours) |
| RoHS Status | unknown |
| REACH Status | unknown |
XC5VLX85-1FF676I 676-fcbga, 27 mm × 27 mm Pin Configuration Guide
Pin configuration for XC5VLX85-1FF676I (676-fcbga, 27 mm × 27 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC5VLX85-1FF676I.
Refer to the datasheet for full pin configuration.
Typical Applications
XC5VLX85-1FF676I is suitable for 6 applications: Network Packet Processing, Industrial Control and Automation, High-Speed Data Acquisition, Test and Measurement Equipment, Industrial Vision Processing, Communications Line-Card Equipment.
Network Packet Processing
The XC5VLX85-1FF676I fits network and telecommunications functions that combine parallel datapaths with high external connectivity. Its 82,944 logic elements can implement protocol engines, classification logic, queues, and control functions, while 3,538,944 bits of block RAM support packet buffering and lookup structures. The 440 available I/O positions also allow multiple low- and high-speed interfaces to coexist around the FPGA. Place the device in a multilayer PCB with short, impedance-controlled routes for high-speed interfaces. The -1 speed grade and -40°C to +100°C industrial junction range suit equipment expected to operate outside consumer-temperature environments.
Recommended
Industrial Control and Automation
The XC5VLX85-1FF676I can consolidate deterministic control, sequencing, data acquisition, and communications in industrial automation equipment. Its 82,944 logic elements provide substantial capacity for parallel machine-control logic, while the 440 I/O positions are useful for distributed digital interfaces, status signaling, and field-bus bridging. The industrial temperature designation supports designs operating across a -40°C to +100°C junction range. Designers should partition critical control paths from diagnostic functions and validate timing against the selected -1 speed grade. Separate power and ground planes, careful clock distribution, and a thermal path from the FCBGA package are essential for reliable operation.
Recommended
High-Speed Data Acquisition
The XC5VLX85-1FF676I is suitable for acquisition systems requiring simultaneous sampling, buffering, filtering, and data preparation in programmable logic. Its 82,944 logic elements can host parallel digital signal-processing pipelines, and 3,538,944 bits of block RAM can provide local buffering between acquisition and transmission stages. With 440 I/O, the device can connect multiple data buses, trigger signals, clocks, and status channels while maintaining a compact control architecture. Use the manufacturer timing constraints for every implemented I/O standard, and keep high-speed routes short with reference-controlled impedances. The -1 grade and industrial temperature range suit demanding instrumentation when timing margins are verified.
Recommended
Test and Measurement Equipment
The XC5VLX85-1FF676I can implement the timing, sequencing, pattern generation, and analysis functions required by modular test equipment. Its large programmable logic fabric supports concurrent test channels, while embedded block RAM supports waveform records, expected-result patterns, and communication buffering. The high count of 440 I/O provides flexibility for instrument control, trigger distribution, and data exchange across a mezzanine or backplane architecture. For sensitive analog measurements, keep FPGA-adjacent circuitry isolated from switching regulators and high-current loads. Confirm input threshold, output timing, and I/O-standard constraints against the appropriate Virtex-5 LX documentation before schematic release.
Recommended
Industrial Vision Processing
The XC5VLX85-1FF676I is appropriate for image-processing front ends that require parallel pixel pipelines, line buffers, feature extraction, and interface bridging within one FPGA. The 82,944 logic elements support multiple concurrent pipelines, and 3,538,944 bits of block RAM provide useful capacity for frame lines or tiled processing buffers. Its 440 I/O positions allow camera data, control signals, and external processing links to be integrated without relying on several discrete devices. Place memory-intensive logic according to the architecture’s recommended placement rules, maintain clock integrity across the device, and verify thermal performance with realistic image-processing activity. The industrial grade is advantageous for factory environments with elevated internal temperatures.
Recommended
Communications Line-Card Equipment
The XC5VLX85-1FF676I fits communications line cards where protocol termination, framing, aggregation, and system control must operate concurrently. Its 82,944 logic elements and 6,480 LABs or CLBs allow substantial parallel implementation, while 3,538,944 bits of block RAM support packet and message buffering. The 440 I/O positions provide room for multiple interfaces and backplane connections in a compact 676-FCBGA package. Designers should use separate clock regions for unrelated interface domains, apply the manufacturer’s sequence and decoupling recommendations, and validate signal integrity on every multilayer board variant. The -40°C to +100°C junction specification supports industrial telecommunications equipment where ambient and enclosure temperatures vary.
Recommended
Engineering reference data for XC5VLX85-1FF676I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC5VLX85-2FF676I | XC5VLX85-1FF676C | XC5VLX85-2FFG676I | XC5VLX85-3FF676I | XC5VLX85-1FFG676I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-FCBGA (27 mm × 27 mm) | 676-FCBGA (27 mm × 27 mm) | 676-FCBGA (27 mm × 27 mm) | 676-FCBGA (27 mm × 27 mm) | 676-FCBGA (27 mm × 27 mm) | 676-FCBGA (27 mm × 27 mm) |
| Device Family | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX |
| Logic Elements | 82,944 elements | 82,944 elements | 82,944 elements | 82,944 elements | 82,944 elements | 82,944 elements |
| Block RAM | 3,538,944 bits | 3,538,944 bits | 3,538,944 bits | 3,538,944 bits | 3,538,944 bits | 3,538,944 bits |
| User I/O | 440 I/O | 440 I/O | 440 I/O | 440 I/O | 440 I/O | 440 I/O |
| Speed Grade | -1 | -2 | -1 | -2 | -3 | -1 |
| Process Technology | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS |
Key Differentiators
- Industrial temperature rating supports a broader operating envelope (vs XC5VLX85-1FF676C)
- Matches the -1 performance class of the target (vs XC5VLX85-2FF676I)
- Combines high logic density with extensive external connectivity (vs XC5VLX85-3FF676I)
Design Notes
The 676-FCBGA package requires a multilayer board with a dense, uninterrupted escape-routing strategy. Follow the manufacturer package and PCB design guidance for ball assignments, via structures, and layer transitions. Keep high-speed interface traces short, provide reference planes beneath controlled-impedance routes, and avoid routing unrelated signals through the power and ground regions beneath the device. Because a 27 mm by 27 mm package has substantial pin connectivity, factory review of escape geometry is valuable before fabrication.
Build the power plan around the complete design rather than the nominal 0.95 V to 1.05 V core range alone. Account for auxiliary I/O supplies, configuration behavior, static and dynamic core current, and the activity of all 440 user I/O. Place local high-frequency decoupling directly at the appropriate package balls and use separate distribution branches where current and noise requirements differ. Validate the network against worst-case utilization and temperature using the manufacturer’s power-estimation and printed-circuit-board guidance.
Estimate junction temperature from total device dissipation, the package thermal model, board construction, airflow, and the temperature of the surrounding copper. The confirmed industrial rating spans -40°C to +100°C junction temperature, but that range does not guarantee margin across every board layout. Avoid creating a hot spot beneath the FCBGA, use the manufacturer’s thermal-via and copper recommendations, and test the populated assembly at the highest expected ambient temperature and representative logic activity.
Treat clock distribution as a dedicated layout constraint. Use the architecture’s recommended clocking resources, balance fanout with registers where appropriate, and keep sensitive or high-speed interfaces away from regions with heavy switching activity. Give configuration and startup control paths stable pull states and review every unused I/O against the device’s documented termination or default behavior. Complete static timing analysis with the selected speed grade rather than relying only on the nominal family-level clock figure.
Compliance Information
No specific RoHS, REACH, halogen-free, or conflict-minerals declarations were identified. AEC-Q100 is not applicable to this general-purpose Virtex-5 LX FPGA.
