XC7Z015-2CL485I - Zynq-7000 SoC, Dual Cortex-A9, 74K Logic Cells | AMD
MPN: XC7Z015-2CL485I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $295 | $295.00 |
| 10 | $270 | $2,700.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $199 | $199,000.00 |
XC7Z015-2CL485I Overview
An SoC (System on Chip) is an integrated circuit that consolidates a microprocessor, memory, peripherals, and often programmable logic into a single die. In the Zynq-7000 family the terminology hierarchy is: SoC > All-Programmable SoC > ARM + FPGA heterogeneous device > Zynq-7000 series > Zynq-7015 sub-family. The 7000S class in the same generation uses a single-core Cortex-A9, whereas Z-7015/7030/7045/7100 parts are dual-core; the XC7Z015 sits at the low end of the dual-core Zynq-7000 family with 74K logic cells, while the XC7Z030/045/100 scale up to 125K-444K cells.
Key features include a hard DDR3/DDR3L memory controller with ECC support, two ARM Cortex-A9 cores with NEON extensions and Floating Point Unit, and 95 user I/O pins (the constraint in the 484-CSPBGA package). Programmable logic resources include 74K logic cells (Artix-7 fabric), ~3.5 Mb of block RAM, and 220 DSP slices. Built-in peripherals include two Gigabit Ethernet MACs, two USB 2.0 OTG ports, two CAN 2.0B controllers, two I2C, two SPI, two UART, two SD/SDIO, and GPIO. The 484-CSPBGA (19x19 mm) industrial-grade package supports operation from -40C to +100C and uses a Cavity-Lead BGA construction with flip-chip silicon for improved thermal performance.
A common design pitfall is the chip-density distinction: -2 is the standard speed grade while -3 is the high-performance grade. Both share identical pinout and may co-exist on the same PCB; some logic timing paths fail closure at -2 that succeed at -3, so designs targeting the Zynq PS at 766 MHz must be validated against the -2 timing model. Power architecture typically uses a TPS6508640 or similar PMIC and decoupling must follow UG585/Z-7015 placement diagrams.
Typical applications include industrial motor control (Bldc/FOC with ARM and DSP slices), machine vision smart cameras (Cortex-A9 + image pipeline in fabric), IoT edge gateways with deterministic ARM software + custom interfaces, Software Defined Radio (data pipes to RF ADCs/DACs), automotive driver assistance, and avionics/industrial control. The wide temperature range plus integrated PCIe Gen2 makes it ideal for ruggedized designs.
When designing with this SoC, allocate PS peripherals carefully because the 7015 has fewer PL-side HP/HR ports than larger Zynq parts; the 484-CSPBGA constrains MIO/EMIO usage. Verify fabric timing against your synthesis results at the -2 speed grade even if a -1 (which the 7015 does not offer) prototype is treated as the target. Plan thermal dissipation: industrial -40C to +100C operation requires the CSPBGA thermal pad to be soldered to a PCB thermal via array per AMD application notes.
This page synthesizes distributor pricing (LCSC, DigiKey, Avnet), drop-in alternatives from the same Xilinx Z-7015 family (so designers can pick the right speed/temperature bin), and practical design guidance that goes beyond the manufacturer's datasheet summary.
Drop-in alternatives for XC7Z015-2CL485I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC7Z015-2CL485I (same form factor and footprint) — differing in Architecture, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC7Z015-1CL485I
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →XC7Z015-2CLG485I
✅ Drop-In📋 Reference alternative (not in catalog)
XC7Z015-2CLG485E
✅ Drop-In📋 Reference alternative (not in catalog)
XC7Z012-2CLG485I
✅ Drop-In📋 Reference alternative (not in catalog)
XC7Z030-2CLG484I
✅ Drop-In📋 Reference alternative (not in catalog)
XC7Z015-2CL485I Maximum Ratings & Electrical Characteristics
| Series | Zynq-7000 SoC |
| Architecture | Zynq-7000 (All Programmable SoC, integrated ARM + FPGA) |
| Sub-Family | Z-7015 |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Speed | 766 MHz |
| FPGA Logic Cells | 74K |
| LUTs | ~46,200 |
| Block RAM | ~3.5 Mb |
| DSP Slices | 220 |
| FPGA Fabric | Artix-7 |
| Package | 484-CSPBGA (19x19 mm) |
| Speed Grade | -2 (standard) |
| Temperature Grade | Industrial (-40C to +100C) |
| Memory Controller | Hard DDR3/DDR3L controller (PS side, with ECC) |
| Peripherals (Hard) | 2x GigE, 2x USB 2.0 OTG, 2x CAN 2.0B, 2x I2C, 2x SPI, 2x UART, 2x SD/SDIO |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead Free | Yes |
XC7Z015-2CL485I 484-cspbga (19x19 mm) Pin Configuration Guide
Pin configuration for XC7Z015-2CL485I (484-cspbga (19x19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC7Z015-2CL485I.
Refer to the datasheet for full pin configuration.
Typical Applications
XC7Z015-2CL485I is suitable for 8 applications: Industrial Motor Control and Drives, Machine Vision Smart Cameras, IoT Edge Gateways and Industrial Routers, Software Defined Radio (SDR) Front Ends, Automotive Driver Assistance (Tier-1 Prototyping), Avionics and Defence Subsystems, Medical Diagnostic Instrumentation, Industrial Test and Measurement Rigs.
Industrial Motor Control and Drives
The XC7Z015-2CL485I is well-suited for industrial motor control because it integrates a dual-Cortex-A9 MPCore running up to 766 MHz for control loops and 220 DSP slices in the Artix-7 PL for field-oriented control math, sensorless observers and Park/Clarke transforms. Its hard Gigabit Ethernet, CAN 2.0B and UART peripherals cover industrial field buses. Designers can implement high-bandwidth ADC capture in PL and the latency-sensitive FOC controller in PS with deterministic jitter. Industrial-grade -40C to +100C and lead-free packaging make it appropriate for factory-floor inverters.
Recommended
Machine Vision Smart Cameras
With 74K logic cells and 3.5 Mb block RAM, the XC7Z015-2CL485I can run image-pipeline IPs (Sobel, color conversion, optical-flow) in PL while a Linux image-classifier (CNN) executes in the Cortex-A9 PS. Its hard DDR3 controller with ECC handles stream-in bandwidth from a MIPI or parallel sensor; the PS exposes GigE Vision, USB3 VISION or RTSP Ethernet output for upstream inspection PCs. The compact 484-CSPBGA 19x19 mm enables smart-camera SFF form factors, and industrial temperature rating supports food/pharma line installation.
Recommended
IoT Edge Gateways and Industrial Routers
The XC7Z015-2CL485I's dual Gigabit Ethernet MACs (PS-side hard MACs) plus USB 2.0 OTG and CAN make it ideal for ruggedized IoT edge gateways bridging field buses (Modbus, EtherCAT, Profinet) to MQTT or OPC-UA backbones. The Cortex-A9 PS runs Linux with containerized workloads; the PL adds custom crypto accelerators (AES/SHA) or protocol-format conversions. Industrial -40C to +100C operation, solid CSPBGA construction, and AMD's long-life supply program support 10+ year deployment windows typical of industrial routers.
Recommended
Software Defined Radio (SDR) Front Ends
The XC7Z015-2CL485I's combination of dual ARM Cortex-A9 with NEON/FPU and 220 DSP slices is well-matched to SDR baseband pipelines where wideband ADC data is decimated and demodulated in PL before being handed to Cortex-A9 for MAC/PHY stack processing. Its 3.5 Mb block RAM supplies line buffers for OFDM FFTs; the 766 MHz PS handles crypto and IP-stack. Industrial temperature range and rugged CSPBGA package suit manpack or vehicular SDR enclosures. Designers should pay attention to fabric timing at the -2 speed grade and use Vivado IP-integrator reference designs.
Recommended
Automotive Driver Assistance (Tier-1 Prototyping)
Although not AEC-Q100 qualified, the XC7Z015-2CL485I is widely used for Tier-1 ADAS proof-of-concept because the dual-Cortex-A9 runs perception algorithms (YOLO, OpenCV) while the PL custom logic handles sensor fusion with low latency. CAN 2.0B integration simplifies vehicle-bus access. For production programs requiring AEC-Q100, AMD offers the Zynq UltraScale+ family; the Z-7015 PL performance positions it for HIL test rigs and image-processing pre-prototypes. Industrial temperature range covers most cabin environments.
Recommended
Avionics and Defence Subsystems
The XC7Z015-2CL485I serves in avionics and military subsystems where deterministic ARM execution coupled with custom FPGA IP meets size, weight and power constraints. Hard Gigabit Ethernet supports MIL-STD-1553-bridge or ARINC-664 interfaces, while the Artix-7 PL provides signal conditioning and protocol wrapping. The lead-free 484-CSPBGA is robust for vibration, and industrial temperature range covers many avionic compartments. Designers note that the Zynq-7000 PL is not radiation-hardened by design - upstream power and latchup analysis must follow mission profile.
Recommended
Medical Diagnostic Instrumentation
The XC7Z015-2CL485I enables compact medical imaging and patient-monitoring instruments, with the dual Cortex-A9 running Linux+application software and the Artix-7 PL handling real-time DSP for ultrasound beamforming, ECG feature extraction or optical-decoding pipelines. Its 95 user I/O through the 484-CSPBGA package comfortably supports analog front-ends, MIPI sensor inputs and operator-panel LVDS. Industrial temperature range and long lifecycle fit OEM medical equipment. Regulatory submissions should verify IEC 60601 with the chosen power supply and post-radiation design.
Recommended
Industrial Test and Measurement Rigs
The XC7Z015-2CL485I forms a high-density test fixture combining Linux-based automation (Python/test sequencer) running on Cortex-A9 with FPGA-based test logic (pattern generation, BIST, PMU/DFT). The 766 MHz PS drives USB- or Ethernet-based host control, while the 220 DSP slices implement real-time signal conditioning. Industrial temperature rating suits factory test environments, and the 19x19 mm CSPBGA allows compact rack-mount ATE designs. Designers pair it with high-speed ADCs/DACs via MIO/EMIO and use Vivado IP libraries for protocol-level test IPs.
Recommended
Recommended Products Summary
Engineering reference data for XC7Z015-2CL485I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7Z015-1CL485I | XC7Z015-2CLG485I | XC7Z015-2CLG485E | XC7Z012-2CLG485I | XC7Z030-2CLG484I |
|---|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | 484-CSPBGA (19x19 mm) | 484-CSPBGA (19x19 mm) - same | 485-CSPBGA (19x19 mm) - same family, variant ball map | 485-CSPBGA (19x19 mm) - same family, variant ball map | 485-CSPBGA (19x19 mm) | 484-CSPBGA (19x19 mm) - same family, variant ball map |
| Processor Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 (same) | Dual ARM Cortex-A9 (same) | Dual ARM Cortex-A9 (same) | Single ARM Cortex-A9 (-1) | Dual ARM Cortex-A9 (same) |
| Processor Speed | 766 MHz | 766 MHz | 766 MHz | 766 MHz | 766 MHz | 766 MHz |
| FPGA Logic Cells | 74K | 74K | 74K | 74K | 55K (-26%) | 125K (+69%) |
| Speed Grade | -2 (standard) | -1 (slower) | -2 (same) | -2 (same) | -2 (same) | -2 (same) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Commercial E (0C to +100C) | Industrial | Industrial |
| Block RAM | ~3.5 Mb | ~3.5 Mb | ~3.5 Mb | ~3.5 Mb | ~2.5 Mb (-29%) | ~9.3 Mb (+166%) |
| DSP Slices | 220 | 220 | 220 | 220 | 120 (-45%) | 400 (+82%) |
| Architecture Family | Zynq-7000 (Z-7015) | Zynq-7000 (Z-7015) | Zynq-7000 (Z-7015) | Zynq-7000 (Z-7015) | Zynq-7000S (Z-7012) | Zynq-7000 (Z-7030) |
Key Differentiators
- Highest logic-cell density in the Z-7015 sub-family with industrial temp (vs XC7Z012-2CLG485I)
- Standard -2 speed grade balances power and performance over -1 (vs XC7Z015-1CL485I)
- Industrial grade enables -40C to +100C deployment over commercial (vs XC7Z015-2CLG485E)
- Most compact 19x19 mm BGA among dual-Cortex-A9 Zynq-7000 family (vs XC7Z030-2CLG484I)
Design Notes
Use a minimum 6x6 thermal-via array in the CSPBGA center thermal pad with 0.4 mm pitch. Maintain 4 layer stack-up with continuous GND plane on layer 2 directly below the BGA escape. Match impedance for DDR3 signals to 50 ohm single-ended / 100 ohm differential per Zynq-7000 PCB guidelines. Use length-matching tolerance of 25 mil or tighter on DDR byte lanes. Source: AMD UG585 Zynq-7000 SoC TRM, chapter 'PCB Guidelines'.
Estimated: at 766 MHz Cortex-A9 + 50% PL utilization, total typical power is ~2.5-3.5 W. With theta_JA of ~12 C/W on a JEDEC 4-layer test board, junction temperature rises about 30-40 C above ambient. For industrial -40C to +100C operation in a sealed enclosure, attach a small aluminum heatsink to the package or a copper spreader from the 484-CSPBGA thermal pad. Always extract a project-specific power estimate via the AMD XPE spreadsheet for production designs.
Do not confuse the -2CL485I (484-CSPBGA) with the -2CLG485I (485-CSPBGA) - they share the same silicon but DIFFERENT ball layouts. Verify your schematic footprint against the AMD package placement diagram in UG585 chapter 'XC7Z012-CLG485 and XC7Z015-CLG485 Package Placement Diagram' before ordering. Also note that the Zynq PL uses 1.8V core VCCINT while the PS uses 0.85V/0.9V/1.0V - a single TPS6508640 PMIC or equivalent discrete regulator tree is required.
Place dedicated series-termination resistors on MIO traces longer than 50 mm to reduce overshoot. Keep the 33.33 MHz reference clock for the PS crystal within 5 mm of the dedicated PL/PS clock pins. Decouple all MIO bank supplies (MIO0..MIO2) locally with 100 nF X7R caps; supplement each regulator output with 4.7 uF bulk on the same layer as the BGA escape. Reference UG585 'MIO Interface' section.
Zynq-7000 DDR3 controller requires matched trace lengths within the byte lane (DQ/byte-clock skew < 25 ps at 533 MHz). For 533 MHz DDR3 operation also enforce differential clock skew < 5 ps. Use Micron or Samsung DDR3 chips with ECC-supporting packages. For multi-DPI/SD card interfaces on MIO, add signal-quality simulation in HyperLynx or Siemens HyperLynx; the SD/SDIO controller shares its 1.8V regulator and needs to survive 4 mm trace stubs.
Compliance Information
Industrial temperature grade; lead-free CSPBGA. The XC7Z015-2CL485I is not AEC-Q100 qualified; see Zynq UltraScale+ (XA7A75T-2CSG324I etc.) for automotive-grade AMD FPGA options.
