10AS048K3F35I2SG - Arria 10 SX SoC FPGA 480K LE | Altera
N.º da peça: 10AS048K3F35I2SG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2850 | $2.850,00 |
| 10 | $2650 | $26.500,00 |
| 100 | $2400 | $240.000,00 |
| 500 | $2180 | $1.090.000,00 |
| 1.000 | $1995 | $1.995.000,00 |
10AS048K3F35I2SG Visão geral
An SoC FPGA is a single silicon device that combines a general-purpose processor subsystem (typically ARM Cortex-A) with programmable FPGA fabric, on-chip memory controllers, and high-speed transceiver interfaces. The Arria 10 SX series targets mid-range applications that need deterministic real-time processing alongside software programmability. Within the broader hierarchy, this places the part in the category chain: SoC FPGA -> FPGA -> programmable logic -> semiconductor device. Compared with a discrete CPU + FPGA two-chip solution, an SoC FPGA reduces board area, lowers latency between the CPU and fabric, and simplifies the data path between the application processor and FPGA-accelerated functions.
Key features of the 10AS048K3F35I2SG include dual ARM Cortex-A9 MPCore cores with CoreSight debug, integrated DDR3/DDR4 memory controllers with ECC support, up to 24 transceivers capable of multi-gigabit serial links, on-chip hard memory controllers, and high-speed LVDS I/O. The 1152-pin FCBGA package provides extensive I/O count needed for memory channels, transceivers, and parallel interfaces in mid-range embedded designs.
The Arria 10 SX architecture combines a hard processor system (HPS) on the same die as the programmable logic, sharing a coherent interconnect. This architecture is widely used in industrial automation, software-defined radio, machine vision, and medical imaging, where ARM software control coordinates FPGA-accelerated DSP, image processing, or protocol bridging.
Typical applications for the 10AS048K3F35I2SG include motor control and industrial drives, broadcast video processing, software-defined networking, and high-speed data acquisition. The HPS runs Linux or RTOS while the FPGA fabric handles deterministic, parallel workloads such as signal processing, encryption, or image pipelines.
When designing with this device, pay close attention to PCB layout for the 1152-pin FCBGA: a multi-layer PCB with buried vias, microvia stack-ups, and matched-length traces for transceivers and DDR memory interfaces is mandatory. Power sequencing between the HPS and FPGA rails must follow the Intel/Altera reference design to avoid latch-up during bring-up.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Arria 10 SX family, and practical design notes not typically combined in the manufacturer datasheet.
Alternativas drop-in para 10AS048K3F35I2SG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10AS048K3F35I2SG (mesmo formato e footprint) — diferindo em Package, Logic Elements, Mounting Type, Family, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10AS048K3F35I2LG
✅ Drop-In✓ Em estoque
$3850 / unidade
Ver ficha técnica →10AS048K3F35E2SG
✅ Drop-In✓ Em estoque
$2720 / unidade
Ver ficha técnica →10AS048K3F35E2LG
✅ Drop-In✓ Em estoque
$3495 / unidade
Ver ficha técnica →10AS048K2F35I2SG
✅ Drop-In✓ Em estoque
$3450 / unidade
Ver ficha técnica →10AS048K2F35I2LG
✅ Drop-In✓ Em estoque
$2650 / unidade
Ver ficha técnica →10AS048K3F35I2SG Classificações máximas e características elétricas
| Family | Arria 10 SX |
| Logic Elements | 480,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Encapsulamento | 1152-pin FCBGA (35x35 mm) |
| Temperatura de operação | -40C to +100C (Industrial) |
| Speed Grade | 3 |
| Transceiver Data Rate | 1.5 Gbps (max, per distributor listing) |
| Tipo de memória | DDR3/DDR4 with ECC (HPS + FPGA fabric) |
| Architecture | SoC (HPS + programmable logic) |
| Tipo de montagem | Surface Mount (FCBGA) |
| Status RoHS | Compliant |
| Device Series | 10AS048 (F35) |
| Hard Processor System | Yes (dual ARM Cortex-A9) |
Guia de Configuração de Pinos do 10AS048K3F35I2SG 1152-pin fcbga (35x35 mm)
Configuração de pinos para 10AS048K3F35I2SG (pacote 1152-pin fcbga (35x35 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10AS048K3F35I2SG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10AS048K3F35I2SG é adequado para 7 aplicaçãos: Industrial Motor Control and Drives, Software-Defined Radio Baseband, Broadcast Video Processing, Medical Imaging Acceleration, High-Speed Data Acquisition, Automotive ADAS Prototyping, 5G Small Cell Baseband.
Industrial Motor Control and Drives
The 10AS048K3F35I2SG suits industrial motor control where deterministic FPGA fabric handles PWM generation, encoder decoding, and field-oriented control loops at microsecond latency, while the dual ARM Cortex-A9 HPS runs Linux for supervisory control, EtherCAT master, and HMI networking. The 480K logic elements support multi-axis servo control with high-resolution PWM and sigma-delta demodulation. Industrial temperature rating (-40C to +100C) suits factory-floor cabinets without active cooling.
Recomendado
Software-Defined Radio Baseband
The 10AS048K3F35I2SG serves as the baseband processor in software-defined radio platforms where the FPGA fabric implements DDC/DUC, channelization, and protocol-specific modulation while the HPS runs a Linux SDR stack (such as GNU Radio) for higher-layer packet processing. The 1.5 Gbps transceivers interface with RF front-ends and ADC/DAC JESD204B/C links. The HPS-DDR controller feeds the radio's circular buffers at line rate, leveraging 480K LE for multi-channel wideband capture.
Recomendado
Broadcast Video Processing
The 10AS048K3F35I2SG handles real-time broadcast video workloads such as 4K/UHD upconversion, HDR tone-mapping, and multi-stream transcoding where FPGA fabric accelerates motion-adaptive deinterlacing and scaling, while the HPS runs a Linux media stack for codec orchestration. The 1152-pin FCBGA I/O budget supports multiple SDI/HDMI inputs and outputs with frame-buffer DDR. K3 speed grade supports multi-format switching without timing closure issues at 4K line rate.
Recomendado
Medical Imaging Acceleration
In ultrasound and endoscopy systems, the 10AS048K3F35I2SG's FPGA fabric performs beamforming, Doppler processing, and image reconstruction at sub-frame latency, while the Cortex-A9 HPS handles patient interface, DICOM networking, and image display. Industrial temperature rating suits portable cart systems. The 480K LE comfortably fits beamformed 64-channel beamforming pipelines plus JPEG2000 or H.264 compression, enabling compact medical imaging designs.
Recomendado
High-Speed Data Acquisition
The 10AS048K3F35I2SG is well matched to multi-channel data acquisition systems where the FPGA fabric digitizes streams from JESD204B ADCs, applies FIR filtering and decimation, and pre-processes data before forwarding to the HPS over the coherent interconnect. The HPS runs embedded analytics or streams data over 10 Gigabit Ethernet via the integrated transceivers. The 1.5 Gbps transceiver data rate supports direct ADC link to FPGA fabric at high channel count.
Recomendado
Automotive ADAS Prototyping
For ADAS sensor fusion prototyping, the 10AS048K3F35I2SG fuses camera, radar, and LiDAR streams where FPGA fabric handles low-latency object detection and sensor synchronization while the Cortex-A9 HPS runs a Linux robotics stack for higher-level path planning. Industrial temperature rating suits in-cabin and outdoor-mounted prototype vehicles. The 1152-pin FCBGA supports multiple GMSL/FPD-Link camera inputs and CAN-FD vehicle network interfaces.
Recomendado
5G Small Cell Baseband
The 10AS048K3F35I2SG's 480K LE and 1.5 Gbps transceivers support 5G small-cell baseband where the FPGA fabric implements the PHY layer (LDPC, polar coding, FFT/iFFT) while the HPS runs the higher MAC and RRC layers in a real-time Linux environment. Industrial temperature rating suits outdoor small-cell enclosures. The HPS-DDR bandwidth supports sub-6 GHz carrier aggregation without external processing chips.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10AS048K3F35I2SG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10AS048K3F35I2LG | 10AS048K3F35E2SG | 10AS048K3F35E2LG | 10AS048K2F35I2SG | 10AS048K2F35I2LG |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1152-pin FCBGA (35x35 mm) | 1152-pin FCBGA (35x35 mm) - same | 1152-pin FCBGA (35x35 mm) - same | 1152-pin FCBGA (35x35 mm) - same | 1152-pin FCBGA (35x35 mm) - same | 1152-pin FCBGA (35x35 mm) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| Speed Grade | 3 (K3) | 3 (K3) | 3 (K3) | 3 (K3) | 2 (K2) - lower Fmax, lower power | 2 (K2) - lower Fmax, lower power |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| HPS Cores | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Lead Finish | Leaded (SnPb) | Lead-free (RoHS) | Leaded (SnPb) | Lead-free (RoHS) | Leaded (SnPb) | Lead-free (RoHS) |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- Industrial temperature grade for harsh-environment deployment (vs 10AS048K3F35E2SG)
- Highest speed grade for timing-critical designs (vs 10AS048K2F35I2SG)
- Same-package variant for supply continuity (vs 10AS048K3F35I2LG)
Notas de projeto
The 1152-pin FCBGA (35x35 mm) requires a high-density PCB with microvia stack-ups and matched-length routing for transceivers and DDR memory. Estimated: plan for at least 8 to 12 PCB layers with buried capacitance to handle simultaneous switching noise. Decoupling must follow the Altera reference design with bulk, mid-frequency, and high-frequency capacitors placed as close to the BGA balls as possible.
The Arria 10 SX requires multiple power rails (0.9V core, HPS rails, transceiver analog, DDR termination) that must be sequenced per the Intel/Altera reference design to avoid latch-up during FPGA configuration and HPS boot-up. Estimated: use a dedicated power management IC (PMIC) such as the Intel-recommended Enpirion or comparable multi-rail PMIC. In-rush current at configuration can exceed 10A on the core rail if decoupling is insufficient.
Estimated: at full utilization of the 480K logic elements plus active HPS and transceivers, junction temperature can rise 30-50C above ambient with the standard FCBGA theta_JA. Industrial designs must include thermal vias under the BGA and a heatsink or thermal interface material in enclosures without forced airflow. Validate thermal performance against the device's junction-to-ambient and junction-to-case thermal metrics from the datasheet.
Configuration failures are common when the MSEL pins are not correctly set for the desired configuration scheme (AS, PS, JTAG, FPP). Verify MSEL settings against the Arria 10 pin connection guidelines. The HPS boot from QSPI or SD requires boot ROM configuration via the Quartus Programming File Generator - leaving this unset results in a non-booting HPS even when FPGA fabric configures correctly.
DDR3/DDR4 trace lengths to the HPS memory controller must be matched within +/- 25 mil across byte lanes and the address/command bus, with proper fly-by routing for clock. Transceiver channels require length-matched differential pairs (within +/- 5 mil) and continuous reference planes. Estimated: leave 4 routing layers dedicated to DDR and transceiver routing with the rest of the layers for signal integrity.
Informações de conformidade
RoHS compliant per Altera/Intel product page. 'I' industrial temperature range per part numbering. Not AEC-Q100 qualified (choose automotive-qualified variants where required). Lead finish encoded in 'SG' suffix (leaded); choose 'LG' for lead-free.
