10AS048K3F35I2SG - Arria 10 SX SoC FPGA 480K LE | Altera
MPN: 10AS048K3F35I2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2650 | $26,500.00 |
| 100 | $2400 | $240,000.00 |
| 500 | $2180 | $1,090,000.00 |
| 1,000 | $1995 | $1,995,000.00 |
Drop-in alternatives for 10AS048K3F35I2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS048K3F35I2LG
✅ Drop-In✓ In Stock
$3850 / Unit
View Datasheet →10AS048K3F35E2SG
✅ Drop-In✓ In Stock
$2720 / Unit
View Datasheet →10AS048K3F35E2LG
✅ Drop-In✓ In Stock
$3495 / Unit
View Datasheet →10AS048K2F35I2SG
✅ Drop-In✓ In Stock
$3450 / Unit
View Datasheet →10AS048K2F35I2LG
✅ Drop-In✓ In Stock
$2650 / Unit
View Datasheet →10AS048K3F35I2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Logic Elements | 480,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Package | 1152-pin FCBGA (35x35 mm) |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed Grade | 3 |
| Transceiver Data Rate | 1.5 Gbps (max, per distributor listing) |
| Memory Type | DDR3/DDR4 with ECC (HPS + FPGA fabric) |
| Architecture | SoC (HPS + programmable logic) |
| Mounting Type | Surface Mount (FCBGA) |
| RoHS Status | Compliant |
| Device Series | 10AS048 (F35) |
| Hard Processor System | Yes (dual ARM Cortex-A9) |
10AS048K3F35I2SG 1152-pin fcbga (35x35 mm) Pin Configuration Guide
Complete pinout information for 10AS048K3F35I2SG (1152-pin fcbga (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048K3F35I2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048K3F35I2SG is suitable for 7 applications: Industrial Motor Control and Drives, Software-Defined Radio Baseband, Broadcast Video Processing, Medical Imaging Acceleration, High-Speed Data Acquisition, Automotive ADAS Prototyping, 5G Small Cell Baseband.
Industrial Motor Control and Drives
The 10AS048K3F35I2SG suits industrial motor control where deterministic FPGA fabric handles PWM generation, encoder decoding, and field-oriented control loops at microsecond latency, while the dual ARM Cortex-A9 HPS runs Linux for supervisory control, EtherCAT master, and HMI networking. The 480K logic elements support multi-axis servo control with high-resolution PWM and sigma-delta demodulation. Industrial temperature rating (-40C to +100C) suits factory-floor cabinets without active cooling.
Recommended
Software-Defined Radio Baseband
The 10AS048K3F35I2SG serves as the baseband processor in software-defined radio platforms where the FPGA fabric implements DDC/DUC, channelization, and protocol-specific modulation while the HPS runs a Linux SDR stack (such as GNU Radio) for higher-layer packet processing. The 1.5 Gbps transceivers interface with RF front-ends and ADC/DAC JESD204B/C links. The HPS-DDR controller feeds the radio's circular buffers at line rate, leveraging 480K LE for multi-channel wideband capture.
Recommended
Broadcast Video Processing
The 10AS048K3F35I2SG handles real-time broadcast video workloads such as 4K/UHD upconversion, HDR tone-mapping, and multi-stream transcoding where FPGA fabric accelerates motion-adaptive deinterlacing and scaling, while the HPS runs a Linux media stack for codec orchestration. The 1152-pin FCBGA I/O budget supports multiple SDI/HDMI inputs and outputs with frame-buffer DDR. K3 speed grade supports multi-format switching without timing closure issues at 4K line rate.
Recommended
Medical Imaging Acceleration
In ultrasound and endoscopy systems, the 10AS048K3F35I2SG's FPGA fabric performs beamforming, Doppler processing, and image reconstruction at sub-frame latency, while the Cortex-A9 HPS handles patient interface, DICOM networking, and image display. Industrial temperature rating suits portable cart systems. The 480K LE comfortably fits beamformed 64-channel beamforming pipelines plus JPEG2000 or H.264 compression, enabling compact medical imaging designs.
Recommended
High-Speed Data Acquisition
The 10AS048K3F35I2SG is well matched to multi-channel data acquisition systems where the FPGA fabric digitizes streams from JESD204B ADCs, applies FIR filtering and decimation, and pre-processes data before forwarding to the HPS over the coherent interconnect. The HPS runs embedded analytics or streams data over 10 Gigabit Ethernet via the integrated transceivers. The 1.5 Gbps transceiver data rate supports direct ADC link to FPGA fabric at high channel count.
Recommended
Automotive ADAS Prototyping
For ADAS sensor fusion prototyping, the 10AS048K3F35I2SG fuses camera, radar, and LiDAR streams where FPGA fabric handles low-latency object detection and sensor synchronization while the Cortex-A9 HPS runs a Linux robotics stack for higher-level path planning. Industrial temperature rating suits in-cabin and outdoor-mounted prototype vehicles. The 1152-pin FCBGA supports multiple GMSL/FPD-Link camera inputs and CAN-FD vehicle network interfaces.
Recommended
5G Small Cell Baseband
The 10AS048K3F35I2SG's 480K LE and 1.5 Gbps transceivers support 5G small-cell baseband where the FPGA fabric implements the PHY layer (LDPC, polar coding, FFT/iFFT) while the HPS runs the higher MAC and RRC layers in a real-time Linux environment. Industrial temperature rating suits outdoor small-cell enclosures. The HPS-DDR bandwidth supports sub-6 GHz carrier aggregation without external processing chips.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048K3F35I2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048K3F35I2LG | 10AS048K3F35E2SG | 10AS048K3F35E2LG | 10AS048K2F35I2SG | 10AS048K2F35I2LG |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1152-pin FCBGA (35x35 mm) | 1152-pin FCBGA (35x35 mm) - same | 1152-pin FCBGA (35x35 mm) - same | 1152-pin FCBGA (35x35 mm) - same | 1152-pin FCBGA (35x35 mm) - same | 1152-pin FCBGA (35x35 mm) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| Speed Grade | 3 (K3) | 3 (K3) | 3 (K3) | 3 (K3) | 2 (K2) - lower Fmax, lower power | 2 (K2) - lower Fmax, lower power |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| HPS Cores | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Lead Finish | Leaded (SnPb) | Lead-free (RoHS) | Leaded (SnPb) | Lead-free (RoHS) | Leaded (SnPb) | Lead-free (RoHS) |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
| Typical Unit Price (qty 1) | USD 2,850 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Industrial temperature grade for harsh-environment deployment (vs 10AS048K3F35E2SG)
- Highest speed grade for timing-critical designs (vs 10AS048K2F35I2SG)
- Same-package variant for supply continuity (vs 10AS048K3F35I2LG)
Design Notes
The 1152-pin FCBGA (35x35 mm) requires a high-density PCB with microvia stack-ups and matched-length routing for transceivers and DDR memory. Estimated: plan for at least 8 to 12 PCB layers with buried capacitance to handle simultaneous switching noise. Decoupling must follow the Altera reference design with bulk, mid-frequency, and high-frequency capacitors placed as close to the BGA balls as possible.
The Arria 10 SX requires multiple power rails (0.9V core, HPS rails, transceiver analog, DDR termination) that must be sequenced per the Intel/Altera reference design to avoid latch-up during FPGA configuration and HPS boot-up. Estimated: use a dedicated power management IC (PMIC) such as the Intel-recommended Enpirion or comparable multi-rail PMIC. In-rush current at configuration can exceed 10A on the core rail if decoupling is insufficient.
Estimated: at full utilization of the 480K logic elements plus active HPS and transceivers, junction temperature can rise 30-50C above ambient with the standard FCBGA theta_JA. Industrial designs must include thermal vias under the BGA and a heatsink or thermal interface material in enclosures without forced airflow. Validate thermal performance against the device's junction-to-ambient and junction-to-case thermal metrics from the datasheet.
Configuration failures are common when the MSEL pins are not correctly set for the desired configuration scheme (AS, PS, JTAG, FPP). Verify MSEL settings against the Arria 10 pin connection guidelines. The HPS boot from QSPI or SD requires boot ROM configuration via the Quartus Programming File Generator - leaving this unset results in a non-booting HPS even when FPGA fabric configures correctly.
DDR3/DDR4 trace lengths to the HPS memory controller must be matched within +/- 25 mil across byte lanes and the address/command bus, with proper fly-by routing for clock. Transceiver channels require length-matched differential pairs (within +/- 5 mil) and continuous reference planes. Estimated: leave 4 routing layers dedicated to DDR and transceiver routing with the rest of the layers for signal integrity.
Compliance Information
RoHS compliant per Altera/Intel product page. 'I' industrial temperature range per part numbering. Not AEC-Q100 qualified (choose automotive-qualified variants where required). Lead finish encoded in 'SG' suffix (leaded); choose 'LG' for lead-free.
