10AS066K3F35E2SG - Arria 10 SX SoC FPGA 660K LE | Altera
N.º da peça: 10AS066K3F35E2SG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3812.9 | $3.812,90 |
| 10 | $3685.5 | $36.855,00 |
| 100 | $3420 | $342.000,00 |
| 500 | $3185 | $1.592.500,00 |
| 1.000 | $2950 | $2.950.000,00 |
10AS066K3F35E2SG Visão geral
An SoC FPGA is a heterogeneous computing device that combines a general-purpose applications processor subsystem (typically ARM Cortex-A) with a programmable FPGA fabric, allowing software tasks to run on the OS side while latency-critical DSP, packet, or sensor pipelines are accelerated in hardware. SoC FPGAs sit in the broader taxonomy of embedded processors (microcontroller -> microprocessor -> SoC -> SoC FPGA) and are commonly used in industrial machine vision, software-defined radio, radar, and high-end test & measurement equipment.
Key features of the 10AS066K3F35E2SG include 660K logic elements, embedded DSP blocks and M20K memory blocks, dual ARM Cortex-A9 cores with NEON media engine, CoreSight debug and trace, a wide range of high-speed transceivers supporting multi-gigabit serial protocols, and hard memory controllers for DDR3/DDR4. The SX variant emphasizes the embedded processor subsystem, distinguishing it from the GX (transceiver-focused) and GT (highest transceiver rate) family members. The integrated HPS enables Linux, VxWorks, or RTOS deployment while the FPGA fabric handles custom accelerators.
The device is fabricated on a 20 nm process and provides a rich set of hardened IP blocks (PCIe Gen2/Gen3 controllers, Ethernet MACs, memory controllers) that offload functions from soft logic, improving both performance-per-watt and design compile time. Designers typically use Quartus Prime for synthesis, place-and-route, and HPS software toolchain configuration, with Platform Designer for system integration.
Typical applications include industrial motor control and robotics, software-defined radio baseband, medical imaging accelerators, military/aerospace signal intelligence, broadcast video processing, and high-throughput test instrumentation. The dual ARM cores are well suited to network-stack termination, supervisory control, and user-interface hosting while the FPGA fabric runs deterministic data-path workloads.
When designing with this part, ensure the PCB layout supports the 1152-ball FCBGA escape routing (typically microvia/HDI stack-up), provide clean power rails for the HPS and FPGA core/supply domains (often requiring PMBus-controlled point-of-load regulators), and plan for thermal management: at full transceiver and DSP utilization, FCBGA junction temperatures can exceed 100 C without adequate airflow or heatsink attachment to the exposed die.
This page synthesizes distributor pricing, drop-in alternative ordering codes, and engineering design considerations not consolidated on the manufacturer product page alone.
Alternativas drop-in para 10AS066K3F35E2SG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10AS066K3F35E2SG (mesmo formato e footprint) — diferindo em Package, Speed Grade, Mounting Type, RoHS Status, Logic Elements.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10AS066K3F35E2LG
✅ Drop-In✓ Em estoque
$2310 / unidade
Ver ficha técnica →10AS066K2F35E2SG
✅ Drop-In✓ Em estoque
$2890 / unidade
Ver ficha técnica →10AS066K2F35E2LG
✅ Drop-In✓ Em estoque
$3360 / unidade
Ver ficha técnica →10AS066K2F35I2SG
✅ Drop-In✓ Em estoque
$5750 / unidade
Ver ficha técnica →10AS066K1F35E1HG
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →10AS066K3F35I2SG
✅ Drop-In✓ Em estoque
$3405 / unidade
Ver ficha técnica →10AS066K3F35E2SG Classificações máximas e características elétricas
| Family | Arria 10 SX SoC FPGA |
| Device | 10AS066 |
| Logic Elements | 660K |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Process Node | 20 nm |
| Encapsulamento | 1152-ball FCBGA (35x35 mm) |
| Maximum User I/O | 396 |
| Speed Grade | 3 |
| Operating Temperature Grade | E (Extended) |
| Status RoHS | Compliant |
| Tipo de montagem | Surface Mount (FCBGA) |
Guia de Configuração de Pinos do 10AS066K3F35E2SG 1152-ball fcbga (35x35 mm)
Configuração de pinos para 10AS066K3F35E2SG (pacote 1152-ball fcbga (35x35 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10AS066K3F35E2SG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10AS066K3F35E2SG é adequado para 6 aplicaçãos: Software Defined Radio Baseband, Industrial Motor Control and Robotics, Medical Imaging Accelerators, Broadcast Video Processing, Test and Measurement Instrumentation, Aerospace and Defense Signal Intelligence.
Software Defined Radio Baseband
The 10AS066K3F35E2SG fits SDR baseband processing because its dual ARM Cortex-A9 HPS can run a Linux/RTOS network stack and supervisory control while the 660K-logic-element FPGA fabric executes deterministic FFT, channelization, and demodulation pipelines in parallel. The integrated HPS eliminates the latency and board-area penalty of a separate companion processor, and at 1.5 GHz the A9 cores provide enough headroom for upper-MAC and protocol-handling tasks. Compared with a discrete CPU + FPGA approach, designers save a board, reduce pin count, and simplify clock-domain crossing. Verified to support typical 4G/5G PHY sub-framer workloads in production radio platforms.
Recomendado
Industrial Motor Control and Robotics
In industrial servo and multi-axis robot controllers the 10AS066K3F35E2SG's combination of 660K LE FPGA fabric and a deterministic ARM Cortex-A9 HPS lets engineers implement high-rate current/torque control loops in hardware while running trajectory planning and EtherCAT/CAN-FD stacks on the HPS. The extended (E) temperature grade supports factory-floor environments. Real-time interrupt latency from the FPGA fabric to the HPS via the AXI bridge is typically sub-microsecond, well within the closed-loop period of modern servo drives at 32 kHz PWM. The 1152-FCBGA package and high pin count (396 user I/O) accommodate the many encoder, resolver, and gate-driver interfaces of multi-axis systems.
Recomendado
Medical Imaging Accelerators
Ultrasound beamformers and CT image-reconstruction pipelines benefit from the 10AS066K3F35E2SG's parallel DSP and on-chip memory bandwidth, while the Cortex-A9 HPS handles the user interface, DICOM networking, and patient-data management. The deterministic ARM cores are suitable for IEC 62304 software lifecycle processes required in medical devices. Hardware-accelerated FIR filtering, FFT-based Doppler processing, and back-projection kernels map efficiently onto the FPGA fabric, leaving the HPS free for application-layer software. Single-chip integration simplifies IEC 60601-1 EMI/EMC compliance by reducing external interconnect.
Recomendado
Broadcast Video Processing
For 4K/UHD broadcast routers, multiviewers, and IP-to-SDI gateway products the 10AS066K3F35E2SG provides enough logic and DSP to handle multi-channel HEVC/H.264 encode or decode at broadcast frame rates, with the dual Cortex-A9 HPS running control-plane software, NMOS IS-04/IS-05 discovery, and redundant stream management. SMPTE ST 2110 IP-based video flows can be processed directly on-chip via the integrated transceivers, eliminating external NIC silicon. The 660K LE budget accommodates multi-channel HDR/WCG conversion pipelines in parallel.
Recomendado
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol testers leverage the 10AS066K3F35E2SG's parallel fabric for waveform capture, triggering, and protocol decoding while the Cortex-A9 HPS hosts the UI, file system, and remote control (LXI, SCPI). Deterministic FPGA-side processing supports deep memory acquisition without jitter, and the rich HPS peripherals (USB, Ethernet, PCIe) simplify instrument I/O. The 396 user I/O pins accommodate high-channel-count logic analyzer probes and mixed-signal front-ends. Single-chip integration reduces instrument cost and improves MTBF.
Recomendado
Aerospace and Defense Signal Intelligence
The 10AS066K3F35E2SG's hardened ARM Cortex-A9 HPS plus 660K LE FPGA fabric suit EW, SIGINT, and radar front-end processing platforms where both cryptographic/security processing and high-rate DSP are required on the same board. Single-chip integration reduces SWaP-C (size, weight, power, and cost) on airborne platforms. Designers can partition classification/encryption workloads onto the HPS running a security-hardened OS while DSP and pulse-compression run on the FPGA. The extended (E) temperature grade supports avionics bay environments; for harsher profiles, I-temp ordering codes are available within the same package.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10AS066K3F35E2SG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10AS066K3F35E2LG | 10AS066K2F35E2SG | 10AS066K2F35E2LG | 10AS066K2F35I2SG | 10AS066K1F35E1HG | 10AS066K3F35I2SG |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1152-FCBGA (35x35 mm) | 1152-FCBGA (35x35 mm) - same | 1152-FCBGA (35x35 mm) - same | 1152-FCBGA (35x35 mm) - same | 1152-FCBGA (35x35 mm) - same | 1152-FCBGA (35x35 mm) - same | 1152-FCBGA (35x35 mm) - same |
| Logic Elements | 660K | 660K | 660K | 660K | 660K | 660K | 660K |
| Speed Grade | 3 | 3 | 2 | 2 | 2 | 1 | 3 |
| Temperature Grade | E (Extended) | I (Industrial) | E (Extended) | I (Industrial) | E (Extended) | H (Hot) | E (Extended) |
| HPS Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| HPS Clock Speed | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Principais diferenciais
- Speed grade 3 (fastest bin in the 10AS066 K-series) (vs 10AS066K2F35E2SG)
- Extended (E) temperature grade for industrial environments (vs 10AS066K3F35I2SG)
- Single-chip SoC integration of dual ARM Cortex-A9 + 660K LE (vs Discrete CPU + separate FPGA approach)
- Rich hardened IP blocks reduce soft-logic overhead (vs Earlier-generation SoC FPGAs (Cyclone V SoC))
Notas de projeto
The 1152-ball FCBGA (F35, 35x35 mm) package requires a microvia/HDI PCB stack-up to fan out the dense ball grid. Designers should plan for at least a 1-2-1 or 2-2-2 build-up structure with via-in-pad for the inner rows, controlled-impedance routing for transceiver lanes (typically 85 ohm differential), and matched-length tuning for DDR3/4 interfaces to the HPS. Verify stack-up early with the Altera Arria 10 F35 package footprint and land pattern recommendations.
At full transceiver utilization and high DSP toggle rates, the 10AS066K3F35E2SG can dissipate 15-25 W typical and require active thermal management. Mount the FCBGA onto a high-performance thermal interface material with a heatsink or top-side cold plate. Estimated: theta_JA of the FCBGA package on a JEDEC 8-layer test board is roughly 8-12 C/W without airflow, implying junction temperature rise of 120-300 C at 15-25 W - clearly above the 100 C junction limit without forced airflow.
The 10AS066K3F35E2SG requires multiple supply rails: VCC (core), VCCP (periphery), VCC_HPS, VCC_HPS_IO, transceiver supplies, and auxiliary rails. Each rail has strict sequencing requirements per the Arria 10 family datasheet. Use PMBus-controlled point-of-load regulators with the Intel-recommended power-tree reference design. Decoupling must include 0.1 uF X7R near each power pin and bulk capacitors per the pin connection guidelines. Inrush current during configuration can exceed 4 A and must be considered in the upstream converter design.
Common pitfalls include: (1) omitting the external configuration flash (EPCQ) bitstream, causing the FPGA to fail on every cold boot; (2) neglecting HPS boot-mode strap pins, locking the device out of SD or QSPI boot; (3) ignoring transceiver reference-clock jitter, which can degrade multi-gigabit link margin; (4) using non-Intel-qualified DDR3/4 memory parts without running the Quartus memory IP calibration; (5) failing to apply the latest Arria 10 errata sheet updates before tape-out. Always run Quartus fitter with the device-specific pin assignments and review the Pin Connection Guidelines document.
Informações de conformidade
RoHS compliant per Altera/Intel product page. The SG suffix typically denotes lead-free finish. AEC-Q100 not applicable as this is a high-density FPGA/SoC, not an automotive-grade qualified IC.
