5CSXFC4C6U23C7N - Cyclone V SX SoC FPGA, 40K LE, 672-UBGA | Intel
MPN: 5CSXFC4C6U23C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $87.5 | $875.00 |
| 100 | $78.2 | $7,820.00 |
| 500 | $71.4 | $35,700.00 |
| 1,000 | $64.95 | $64,950.00 |
Drop-in alternatives for 5CSXFC4C6U23C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →5CSXFC4C6U23C7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SX |
| Device Sub-family | 5CSXFC4C6 (40K Logic Elements) |
| Logic Elements | 40,000 |
| Process Technology | TSMC 28 nm low-power |
| Core Voltage | 1.1 V |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Max Frequency | 800 MHz |
| Package | 672-pin UFBGA (U23, 23x23 mm) |
| Operating Temperature | Commercial (0C to +85C) |
| Speed Grade | C7 (slowest commercial) |
| Mounting Type | Surface Mount (BGA) |
| Memory Interfaces | LPDDR2, DDR2, DDR3, QDRII+ (via HPS and fabric) |
| Transceivers | Integrated multi-gigabit transceivers |
| DSP Blocks | Variable-precision DSP |
| PCIe Hard IP | PCIe Gen2 (x1/x2/x4) |
| RoHS Status | Compliant |
| MSL Level | 3 (168 hours) |
5CSXFC4C6U23C7N 672-pin ufbga (u23, 23x23 mm) Pin Configuration Guide
Complete pinout information for 5CSXFC4C6U23C7N (672-pin ufbga (u23, 23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC4C6U23C7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSXFC4C6U23C7N is suitable for 6 applications: Industrial Motor Control, Video Surveillance and Machine Vision, Automotive Driver Assistance Systems (ADAS), Software Defined Radio (SDR), Embedded Industrial IoT Gateways, Medical Diagnostic Imaging Equipment.
Industrial Motor Control
The 5CSXFC4C6U23C7N is well-suited for industrial motor drives because the integrated dual ARM Cortex-A9 MPCore hard processor subsystem runs real-time control loops, EtherCAT or CANopen protocol stacks, and safety firmware while the 40K logic-element fabric implements field-oriented control (FOC), space-vector PWM, and encoder interfaces. Designers can use the FPGA fabric to accelerate current-sense sampling at sub-microsecond rates while the HPS handles communication and supervisory control. The integrated multi-gigabit transceivers also enable high-speed fieldbus connectivity. The 672-UFBGA package provides sufficient I/O for multi-axis drives with mixed LVDS and LVCMOS signalling.
Recommended
Video Surveillance and Machine Vision
For video surveillance systems, the 5CSXFC4C6U23C7N's 40K logic elements and variable-precision DSP blocks enable real-time image processing pipelines including Bayer demosaicing, noise reduction, motion detection, and H.264 compression pre-processing. The integrated ARM Cortex-A9 HPS can run Linux with the ONVIF protocol stack, RTSP server, and HTTP web interface. The hard memory controller supports DDR3 for frame buffers while LVDS I/O links to image sensors at rates up to 1080p60. This combination reduces BOM cost versus using a discrete FPGA plus external CPU, making the device ideal for IP cameras and industrial inspection equipment.
Recommended
Automotive Driver Assistance Systems (ADAS)
The Cyclone V SX family including 5CSXFC4C6U23C7N is commonly used in entry-level ADAS designs such as rear-view cameras, surround-view processing, and lane-departure warning. The hard ARM Cortex-A9 cores handle perception algorithms and CAN/LIN vehicle networking, while the 40K LE fabric implements ISP functions, lens distortion correction, and sensor fusion preprocessing. Designers should pair this device with the automotive-grade speed grade variant 5CSXFC4C6U23A7N for production automotive platforms. The hard PCIe Gen2 controller supports connection to external radar or lidar sensor modules.
Recommended
Software Defined Radio (SDR)
The 5CSXFC4C6U23C7N serves well in small-form-factor software defined radio platforms where its integrated multi-gigabit transceivers support ADC/DAC sample streams, the FPGA fabric implements channelizers and FFT engines, and the ARM Cortex-A9 HPS runs GNU Radio or custom DSP frameworks. The hard DDR3 controller provides the high-bandwidth memory interface required for streaming RF samples, while the compact 672-UFBGA package fits portable tactical or commercial radio enclosures. Power consumption is significantly lower than competing FPGA families in this process node.
Recommended
Embedded Industrial IoT Gateways
For edge IoT gateway designs, the 5CSXFC4C6U23C7N's dual ARM Cortex-A9 cores run Linux with protocol stacks including MQTT, OPC-UA, and Modbus-TCP, while the FPGA fabric offloads real-time data preprocessing, signal conditioning, and high-speed sensor aggregation. The hard PCIe Gen2 controller supports Wi-Fi 6 or 5G modem modules, and the integrated multi-gigabit transceivers enable industrial Ethernet protocols like EtherCAT, PROFINET, and TSN. The commercial temperature range suits indoor control cabinets and DIN-rail mounted gateways.
Recommended
Medical Diagnostic Imaging Equipment
The 5CSXFC4C6U23C7N is deployed in portable medical imaging devices such as ultrasound systems and patient monitors. The FPGA fabric implements beamforming, FIR filtering, and image reconstruction at line rates exceeding 200 MHz, while the ARM Cortex-A9 HPS runs the UI stack, storage management, and network connectivity. The hard memory controller supports DDR3 for image frame buffers, and the integrated transceivers connect to high-speed ADCs and DACs. The compact 23x23 mm UFBGA package allows integration into handheld probe enclosures and bedside monitors.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC4C6U23C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC4C6U23C6N | 5CSXFC4C6U23A7N | 5CSXFC2C6U23C7N | 5CSXFC2C6U23C6N | 5CSXFC4C6U23I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23) - same | 672-UBGA (U23) - same | 672-UBGA (U23) - same | 672-UBGA (U23) - same | 672-UBGA (U23) - same |
| Logic Elements | 40,000 | 40,000 | 40,000 | 25,000 | 25,000 | 40,000 |
| Speed Grade | C7 | C6 (faster) | A7 (automotive) | C7 | C6 (faster) | I7 (industrial temp) |
| Operating Temperature | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive (-40C to +125C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Hard Processor Subsystem | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz |
| PCIe Hard IP | PCIe Gen2 (x1/x2/x4) | PCIe Gen2 (x1/x2/x4) | PCIe Gen2 (x1/x2/x4) | PCIe Gen2 (x1/x2/x4) | PCIe Gen2 (x1/x2/x4) | PCIe Gen2 (x1/x2/x4) |
| Process Technology | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power |
| Approx. Unit Price @ 100 pcs | $78.20 USD | $82.50 USD | $95.00 USD | $68.40 USD | $72.00 USD | $92.00 USD |
Key Differentiators
- Smaller U23 package enables compact designs versus 5CSEBA6 25 mm variants (vs 5CSEBA6U23C7N)
- Lowest-cost speed grade variant in the SX family with same U23 footprint (vs 5CSXFC4C6U23C6N)
- Integrated ARM Cortex-A9 HPS eliminates external processor BOM (vs 5CEBA4F23C8N (Cyclone V E, no HPS))
Design Notes
Estimated: The 5CSXFC4C6U23C7N at 40% logic utilization with full HPS active dissipates approximately 1.8 W typical and up to 3.5 W peak. Use the Intel Quartus Prime PowerPlay analyzer early in the design flow to obtain device-specific power estimates, and design the PCB power distribution network to deliver at least 5 A on each of the 1.1 V VCCINT, 2.5 V VCCAUX, and 3.3 V VCCIO rails to accommodate transient loading from simultaneous HPS, transceiver, and fabric switching events.
The 672-UFBGA package uses a 1.0 mm ball pitch requiring microvia-in-pad PCB technology for breakout. Use a minimum 4-layer stack-up with continuous GND and PWR planes adjacent to the outer signal layers. Place decoupling capacitors directly under or as close as possible to the BGA on the bottom side of the package, with high-frequency 100 nF X7R ceramics at every four-ball cluster and bulk 22 uF tantalum or polymer capacitors on each supply rail within 25 mm of the package.
For DDR3 interfaces, enforce matched-length routing on the byte groups with skew less than 5 ps between byte lanes and address/command traces matched to within 25 ps. Use fly-by topology on the address/command lines with proper termination at the last DRAM device. The Cyclone V External Memory Interface Toolkit in Quartus Prime provides automated PHY tuning to optimize write and read margins across PVT corners.
Estimated: Engineers commonly underestimate the BGA assembly complexity; plan for at least 6 PCB layout iterations and ensure MSL3 dry-pack handling is observed. Do not configure the HPS boot mode resistors until firmware has validated the boot source - mis-configured BOOTSEL pins can brick the device. Always hold nCONFIG low during power-up until all rails are stable, and use the POR delay feature to avoid in-rush current glitches.
Compliance Information
RoHS compliant per Intel Cyclone V product declaration. The C7 variant is commercial temperature grade; the A7 speed grade variant 5CSXFC4C6U23A7N is AEC-Q100 qualified for automotive applications.
