5CSXFC2C6U23I7N - Cyclone V SX SoC FPGA 25K LE | Altera | UBGA-672
MPN: 5CSXFC2C6U23I7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $380 | $380.00 |
| 10 | $360 | $3,600.00 |
| 100 | $335 | $33,500.00 |
| 500 | $310 | $155,000.00 |
| 1,000 | $285 | $285,000.00 |
Drop-in alternatives for 5CSXFC2C6U23I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSXFC2C6U23I7LN
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →5CSXFC2C6U23C8N
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$105 / Unit
View Datasheet →5CSXFC2C6U23C7N
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$18.9 / Unit
View Datasheet →5CSXFC2C6U23C6N
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$142 / Unit
View Datasheet →5CSXFC2C6U23A7N
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$31.75 / Unit
View Datasheet →5CSXFC2C6U23I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SX SoC FPGA |
| Series | 5CSX |
| Device Variant | 5CSXC2 (U23) |
| Logic Elements | 25,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore |
| Processor Frequency | Up to 800 MHz |
| Embedded RAM | 5.5 Mbits (M10K blocks) |
| DSP Blocks | 66 (variable precision) |
| Transceivers | 3.125 Gbps |
| User I/Os | 364 (max, package dependent) |
| Package | 672-UBGA (23x23 mm) |
| Mounting Type | Surface Mount (BGA) |
| Process Node | 28 nm low-power |
| Operating Temperature | -40 C to +100 C (Industrial) |
| Hard Memory Controller | DDR3/DDR2/LPDDR2 |
| RoHS Status | Compliant |
5CSXFC2C6U23I7N 672-ubga (23x23 mm) Pin Configuration Guide
Complete pinout information for 5CSXFC2C6U23I7N (672-ubga (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC2C6U23I7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSXFC2C6U23I7N is suitable for 6 applications: Industrial Machine Vision Camera, Motor Drive and Servo Controller, Broadcast Video Processing Bridge, Industrial IoT Gateway with Protocol Conversion, Software-Defined Radio Baseband, Avionics and Military Single-Board Computer.
Industrial Machine Vision Camera
The 5CSXFC2C6U23I7N fits industrial machine vision cameras because its 25K LE fabric can process sensor pixel streams at line rates exceeding 200 MHz, while the dual ARM Cortex-A9 cores run GigE Vision / USB3 Vision protocol stacks and image pre-processing. Its hard DDR3 controller handles multi-megapixel frame buffers with deterministic latency, and the 3.125 Gbps transceivers support Camera Link HS or CoaXPress uplinks. Industrial -40 C to +100 C operation enables factory-floor deployment without thermal management concerns.
Recommended
Motor Drive and Servo Controller
The 5CSXFC2C6U23I7N excels in motor drive controllers because its FPGA fabric delivers sub-microsecond deterministic PWM and encoder decoding for FOC algorithms, while the ARM cores run EtherCAT master stacks under Linux or RTOS. The hard DDR3 controller manages motion trajectory buffers, and the industrial temperature grade tolerates drive cabinet environments. Coherent ACP interface enables low-latency FPGA-to-CPU data sharing for current-loop feedback without cache thrashing.
Recommended
Broadcast Video Processing Bridge
The 5CSXFC2C6U23I7N suits broadcast video bridging applications because it can simultaneously ingest SDI (HD/3G-SDI) streams via fabric-side SERDES, de-embed audio, perform format conversion (3G-SDI to HDMI or DisplayPort), and output via HPS-controlled HDMI transmitter. The 28 nm low-power process keeps fan-less chassis designs feasible, while the dual Cortex-A9 runs web-based remote management interfaces. Altera's Video and Image Processing Suite accelerates deinterlacing and scaling operations in fabric.
Recommended
Industrial IoT Gateway with Protocol Conversion
The 5CSXFC2C6U23I7N enables ruggedised IoT gateways because the dual Cortex-A9 runs Linux with full TLS/DTLS stacks while the FPGA fabric terminates industrial protocols like PROFINET, EtherCAT, Modbus TCP, or CANopen in hardware for deterministic cycle times. Its 3.125 Gbps transceivers support fibre uplinks to control rooms, and the -40 C to +100 C industrial grade tolerates outdoor cabinet mounting. HPS peripherals (EMAC, USB, SD/MMC) simplify BOM by eliminating external bridge chips.
Recommended
Software-Defined Radio Baseband
The 5CSXFC2C6U23I7N serves SDR baseband platforms because its 66 variable-precision DSP blocks deliver tens of GMACs for FFT, channelisation, and modulation/demodulation at low MHz bandwidths, while the ARM cores handle stack management and remote configuration. Transceivers interface directly to ADCs/DACs at 3.125 Gbps JESD204B rates, eliminating external clock-data recovery chips. The HPS's EMAC enables IP-based remote management of radio parameters.
Recommended
Avionics and Military Single-Board Computer
The 5CSXFC2C6U23I7N is suitable for avionics and military single-board computers because the 28 nm low-power process enables conduction-cooled VPX or VME form factors, while the dual Cortex-A9 with MMU supports secure operating systems like VxWorks 653 or INTEGRITY. The FPGA fabric implements MIL-STD-1553, ARINC 429, or SpaceWire interfaces in hardware, offloading the CPU for flight-critical tasks. Long-life Altera/Intel FPGA supply guarantees 10+ year deployment support.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC2C6U23I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC2C6U23I7LN | 5CSXFC2C6U23C8N | 5CSXFC2C6U23C7N | 5CSXFC2C6U23C6N | 5CSXFC2C6U23A7N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 672-UBGA (23x23 mm) | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 |
| Processor Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Transceivers | Yes (3.125 Gbps) | Yes (3.125 Gbps) | Yes (3.125 Gbps) | Yes (3.125 Gbps) | Yes (3.125 Gbps) | Yes (3.125 Gbps) |
| Temperature Grade | Industrial (-40 C to +100 C) | Industrial (-40 C to +100 C) | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) | Automotive (-40 C to +125 C) |
| Speed Grade | I7N (7 speed, fastest) | I7LN (7 speed) | C8 (8 speed, slower) | C7 (7 speed) | C6 (6 speed, slowest) | A7 (7 speed) |
| Lead-Free Finish | Yes | Yes (lead-free suffix L) | Yes | Yes | Yes | Yes |
Key Differentiators
- Industrial temperature range with same die as commercial variants (vs 5CSXFC2C6U23C7N)
- Automotive temperature grade option for harsh environments (vs 5CSXFC2C6U23A7N)
- Integrated 3.125 Gbps transceivers eliminate external SERDES (vs 5CSEBA6U23I7N (Cyclone V SE))
Design Notes
Plan power sequencing carefully for the 5CSXFC2C6U23I7N: the HPS, FPGA fabric, and transceivers each require separate rail ramp-up per the Cyclone V Power Management User Guide. Use a dedicated power management IC like the LTC3612 or Enpirion EM2xx family with programmable sequencing to avoid latch-up. Total worst-case power budget should allocate ~0.6 W for HPS, 1-2 W for fabric at moderate utilisation, and 0.5 W per active transceiver channel.
At typical industrial workloads the 5CSXFC2C6U23I7N dissipates 3-6 W total, which the 672-UBGA package can handle with a 4-layer FR4 PCB and adequate thermal vias. Reference Altera's thermal management guidelines: place a thermal via array (0.3 mm pitch, 0.2 mm drill) under the centre thermal pad, connect inner copper planes with at least 2 oz copper weight. For conduction-cooled VPX chassis, use the package's exposed thermal pad with a thermal interface material (TIM) rated for at least 5 W/mK thermal conductivity.
Use a 12-layer or 14-layer stack-up for the 5CSXFC2C6U23I7N to provide dedicated ground and power planes for the 672-BGA escape. The 1.0 mm ball pitch demands laser-drilled microvias or 4 mil via-in-pad for inner-row BGA breakouts. Route all HPS MIO signals on the top layer with length matching; assign FPGA user I/O flexibly but reserve differential pairs for transceivers and DDR3 with 100-ohm controlled impedance. Estimate: each BGA escape uses approximately 8 routing layers minimum.
Estimated: when porting a 5CSXFC2C6U23I7N design to the commercial-grade 5CSXFC2C6U23C8N, the lower temperature limit (0 C vs -40 C) means chassis-mount cold-start environments (outdoor cabinets, unheated warehouses) will fail - always match temperature grade to deployment. Do not confuse the I7N and I7LN suffixes: both are industrial-temperature, but LN denotes lead-free finish per the historical Cyclone V nomenclature. The trailing N indicates RoHS compliance.
Compliance Information
RoHS compliant per Altera/Intel product page. Industrial temperature grade -40 C to +100 C. Not AEC-Q100 qualified - choose 5CSXFC2C6U23A7N automotive variant for AEC-Q100 contexts.
