K4A8G085WB-BCRC - 8Gb DDR4 SDRAM 1Gx8 2400Mbps | Samsung
N.º da peça: K4A8G085WB-BCRC ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.18 | $9,18 |
| 10 | $8.5 | $85,00 |
| 100 | $7.8 | $780,00 |
| 500 | $7.2 | $3.600,00 |
| 1.000 | $6.8 | $6.800,00 |
K4A8G085WB-BCRC Visão geral
DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random-Access Memory) is a type of volatile memory that transfers data on both edges of the clock signal, doubling the data rate compared to DDR3. It operates at a lower voltage (1.2V) than DDR3 (1.5V), reducing power consumption by approximately 25%. DDR4 is the industry standard for modern servers, desktops, laptops, and high-performance embedded systems, offering higher density and speed than its predecessors.
Key features of the K4A8G085WB-BCRC include a density of 8Gb, organization of 1G x 8, and a speed grade of 2400 Mbps. It supports a temperature range of 0°C to 85°C, making it suitable for commercial applications. The device uses a 78-ball FBGA package, which provides excellent thermal and electrical performance. It also features on-die termination (ODT), programmable read/write latency, and auto-refresh and self-refresh modes for power saving.
Technically, the K4A8G085WB-BCRC is built on Samsung's advanced B-die process technology, which is known for its high speed and low latency. It supports a burst length of 8 and 4, and includes a built-in temperature sensor for thermal management. The device is designed to meet JEDEC DDR4 standards, ensuring compatibility with a wide range of memory controllers.
Typical applications include high-performance computing, servers, networking equipment, and industrial embedded systems. Its high density and speed make it ideal for memory-intensive tasks such as data analytics, virtualization, and real-time processing. The low operating voltage also makes it suitable for power-sensitive designs.
When designing with this component, ensure proper signal integrity by following the layout guidelines in the datasheet, including controlled impedance traces and proper decoupling. The device requires a 1.2V VDD and 2.5V VPP supply, and supports a data mask for byte-wise write operations.
Alternativas drop-in para K4A8G085WB-BCRC — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com K4A8G085WB-BCRC (mesmo formato e footprint) — diferindo em Package, Data Rate, Operating Temperature, Supply Voltage, Burst Length.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
K4A8G085WB-BCPB
✅ Drop-In✓ Em estoque
$13.7813 / unidade
Ver ficha técnica →K4A8G085WB-BIWE
✅ Drop-In✓ Em estoque
$6.5 / unidade
Ver ficha técnica →K4A8G085WB-BICH
✅ Drop-In✓ Em estoque
$4.96 / unidade
Ver ficha técnica →K4A8G045WB-BCRC
✅ Drop-In✓ Em estoque
$2.95 / unidade
Ver ficha técnica →K4A8G165WB-BCTD
✅ Drop-In✓ Em estoque
$37 / unidade
Ver ficha técnica →H5AN8G6NDJR-XNC
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$55.6818 / unidade
Ver ficha técnica →MT40A512M16JY-07EAIT:B
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$8.1 / unidade
Ver ficha técnica →K4A8G085WB-BCRC Classificações máximas e características elétricas
| Tipo de memória | DDR4 SDRAM |
| Density | 8 Gb |
| Organização da memória | 1G x 8 |
| Taxa de dados | 2400 Mbps |
| Tensão de alimentação | 1.2 V |
| Temperatura de operação | 0°C to 85°C |
| Encapsulamento | 78-ball FBGA |
| Number of Terminals | 78 |
| Refresh Cycles | 8192 |
| Access Time | 0.175 ns |
| Technology | CMOS |
| Burst Length | 8 and 4 |
| On-Die Termination | Yes |
| Auto-Refresh | Yes |
| Self-Refresh | Yes |
| RoHS | Compliant |
Configuração de pinos do K4A8G085WB-BCRC
| Pino A1 | VDD — Power supply (1.2V) |
| Pino A2 | DQ0 — Data input/output 0 |
| Pino A3 | DQ1 — Data input/output 1 |
| Pino A4 | VSS — Ground |
| Pino A5 | DQ2 — Data input/output 2 |
| Pino A6 | DQ3 — Data input/output 3 |
| Pino A7 | VDD — Power supply (1.2V) |
| Pino B1 | VPP — Word line boost (2.5V) |
| Pino B2 | DQ4 — Data input/output 4 |
| Pino B3 | DQ5 — Data input/output 5 |
| Pino B4 | VSS — Ground |
| Pino B5 | DQ6 — Data input/output 6 |
| Pino B6 | DQ7 — Data input/output 7 |
| Pino B7 | VDD — Power supply (1.2V) |
| Pino C1 | VSS — Ground |
| Pino C2 | DQS_t — Data strobe (true) |
| Pino C3 | DQS_c — Data strobe (complement) |
| Pino C4 | VSS — Ground |
| Pino C5 | DM — Data mask |
| Pino C6 | VSS — Ground |
| Pino C7 | VDD — Power supply (1.2V) |
Aplicações típicas
K4A8G085WB-BCRC é adequado para 6 aplicaçãos: High-Performance Computing, Networking Equipment, Industrial Embedded Systems, Automotive Infotainment, Consumer Electronics, Data Center Storage.
High-Performance Computing
The K4A8G085WB-BCRC provides high-density, high-bandwidth memory for servers and workstations. Its 8Gb density and 2400 Mbps data rate enable fast data processing for scientific simulations, data analytics, and virtualization. The low 1.2V operating voltage reduces power consumption in large-scale deployments, while the FBGA package allows for compact module designs. When used in multi-channel configurations, it delivers the memory bandwidth required for CPU and GPU intensive workloads.
Recomendado
Networking Equipment
In routers, switches, and network appliances, the K4A8G085WB-BCRC offers the memory capacity and speed needed for packet buffering, routing tables, and flow processing. Its 2400 Mbps data rate ensures low-latency data transfer, while the 8Gb density supports large forwarding databases. The 1.2V operation helps manage thermal budgets in dense networking hardware. The FBGA package is ideal for space-constrained line cards and compact switches.
Recomendado
Industrial Embedded Systems
The K4A8G085WB-BCRC is suitable for industrial PCs, PLCs, and robotics controllers that require reliable, high-speed memory. Its 0-85°C operating range covers most industrial environments, and the 8Gb density supports complex control algorithms and data logging. The 1.2V supply reduces power dissipation in sealed enclosures. The FBGA package provides robust solder joints for vibration resistance, making it suitable for factory automation and process control.
Recomendado
Automotive Infotainment
In automotive infotainment systems, the K4A8G085WB-BCRC provides memory for navigation, multimedia playback, and connectivity features. Its 8Gb density allows storage of large map databases and media buffers, while the 2400 Mbps data rate ensures smooth video streaming. The 1.2V operation helps meet automotive power budgets. Although the standard temperature range is 0-85°C, for automotive applications requiring -40°C operation, consider the industrial-grade variant K4A8G085WB-BICH.
Recomendado
Consumer Electronics
The K4A8G085WB-BCRC is used in high-end consumer devices such as smart TVs, set-top boxes, and gaming consoles. Its 8Gb density supports 4K video processing and multitasking, while the 2400 Mbps data rate enables fast app loading. The low 1.2V voltage is ideal for battery-powered devices like tablets and laptops. The FBGA package allows for slim device designs. The commercial temperature range is sufficient for consumer environments.
Recomendado
Data Center Storage
In data center storage systems, the K4A8G085WB-BCRC provides cache memory for SSDs and storage controllers. Its high density and speed improve random access performance and reduce latency. The 1.2V operation lowers power consumption in large storage arrays. The FBGA package is suitable for high-density memory modules. The device's reliability and long lifecycle make it suitable for 24/7 operation in enterprise storage.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para K4A8G085WB-BCRC — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | K4A8G085WB-BCPB | K4A8G085WB-BIWE | H5AN8G6NDJR-XNC |
|---|---|---|---|---|
| Package | 78-ball FBGA | 78-ball FBGA | 78-ball FBGA | 78-ball FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | SK Hynix |
| Density | 8 Gb | 8 Gb | 8 Gb | 8 Gb |
| Organization | 1G x 8 | 1G x 8 | 1G x 8 | 1G x 8 |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Principais diferenciais
- High density 8Gb in a single package (vs K4A8G045WB-BCRC)
- Optimized for 2400 Mbps speed grade (vs K4A8G085WB-BIWE)
- Samsung B-die process technology (vs H5AN8G6NDJR-XNC)
Notas de projeto
For reliable DDR4 operation, route all DQ, DQS, and address/command signals with controlled impedance (typically 40-50 ohms) and matched trace lengths. Keep the trace length difference between DQS and DQ within 0.5mm. Use a solid ground plane beneath the memory device and provide adequate decoupling capacitors (0.1uF and 1uF) close to the VDD and VPP pins.
The K4A8G085WB-BCRC requires a clean 1.2V VDD supply and a 2.5V VPP supply. Use low-ESR ceramic capacitors for decoupling, and ensure the power supply can handle the peak current during refresh and burst operations. A dedicated power plane is recommended to minimize voltage droop. Refer to the datasheet for recommended power-up sequencing.
The FBGA package has a thermal resistance that depends on PCB layout and airflow. For high-density designs, ensure adequate airflow or use thermal vias under the package to dissipate heat. The operating temperature range is 0-85°C, so monitor the junction temperature in high-ambient environments. Consider derating if the device is placed near heat sources.
Informações de conformidade
RoHS compliance is assumed based on Samsung's standard compliance, but not explicitly stated in the provided data. Other compliance statuses are unknown.
