K4B4G1646D-BCK0 - 4Gb DDR3L SDRAM 256Mx16 | Samsung
N.º da peça: K4B4G1646D-BCK0 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.5 | $3,50 |
| 10 | $3.2 | $32,00 |
| 100 | $2.9 | $290,00 |
| 500 | $2.6 | $1.300,00 |
| 1.000 | $2.3 | $2.300,00 |
K4B4G1646D-BCK0 Visão geral
DDR3L SDRAM is a type of double data rate synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption while maintaining high bandwidth. It is part of the DDR3 memory family, which is widely used in computing, networking, and embedded systems. DDR3L is backward compatible with DDR3, allowing flexible system design.
Key features include programmable CAS latency, write latency, on-die termination (ODT), and internal calibration for signal integrity. The device supports burst lengths of 8 and 4, and features auto-refresh and self-refresh modes for power saving. The 96-ball FBGA package provides excellent thermal and electrical performance, making it suitable for space-constrained designs.
The K4B4G1646D-BCK0 utilizes Samsung's advanced D-die process technology, offering improved performance and lower power consumption compared to previous generations. The device includes a temperature-compensated self-refresh (TCSR) feature that adjusts refresh rate based on temperature, enhancing reliability in varying thermal conditions.
Typical applications include DDR3L memory modules for laptops, servers, networking equipment, and embedded systems. It is also used in industrial and automotive applications where low power and high reliability are critical. The device's 1.35V operation makes it ideal for battery-powered devices.
When designing with this device, ensure proper decoupling capacitors are placed near the power pins to minimize noise. The VDD and VDDQ supplies should be filtered with 0.1uF and 10uF capacitors. Also, follow the PCB layout guidelines in the datasheet to maintain signal integrity at high speeds.
Alternativas drop-in para K4B4G1646D-BCK0 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com K4B4G1646D-BCK0 (mesmo formato e footprint) — diferindo em Package, CAS Latency, Operating Temperature, Data Rate, Supply Voltage.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
K4B4G1646E-BYK0
✅ Drop-In✓ Em estoque
$1.8 / unidade
Ver ficha técnica →K4B4G1646D-BMK0
✅ Drop-In✓ Em estoque
$5.9 / unidade
Ver ficha técnica →K4B4G1646D-BYK00
✅ Drop-In✓ Em estoque
$7.5 / unidade
Ver ficha técnica →MT41K256M16HA-125
✅ Drop-In✓ Em estoque
$6.3636 / unidade
Ver ficha técnica →MT41K256M16TW-107
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$14.1 / unidade
Ver ficha técnica →AS4C256M16D3L-12BCN
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6 / unidade
Ver ficha técnica →K4B4G1646D-BCK0 Classificações máximas e características elétricas
| Tipo de memória | DDR3L SDRAM |
| Density | 4 Gb |
| Organização da memória | 256M x 16 |
| Number of Banks | 8 |
| Taxa de dados | 1600 Mbps per pin |
| Clock Frequency | 800 MHz |
| Supply Voltage (VDD) | 1.35V (1.283V to 1.45V) |
| Supply Voltage (VDDQ) | 1.35V (1.283V to 1.45V) |
| Latência CAS | 11 (programmable) |
| Burst Length | 8, 4 |
| Encapsulamento | 96-ball FBGA (13 x 9 mm, 0.8 mm pitch) |
| Temperatura de operação | 0°C to 95°C (Tc) |
| RoHS | Compliant |
| Lead-Free | Yes |
| Livre de halogênio | Yes |
Configuração de pinos do K4B4G1646D-BCK0
| Pino A1 | VDD — Power supply |
| Pino A2 | DQ0 — Data input/output 0 |
| Pino A3 | DQ1 — Data input/output 1 |
| Pino A4 | VSS — Ground |
| Pino A5 | DQ2 — Data input/output 2 |
| Pino A6 | DQ3 — Data input/output 3 |
| Pino A7 | VDDQ — I/O power supply |
| Pino A8 | DQ4 — Data input/output 4 |
| Pino A9 | DQ5 — Data input/output 5 |
| Pino A10 | VSS — Ground |
| Pino A11 | DQ6 — Data input/output 6 |
| Pino A12 | DQ7 — Data input/output 7 |
| Pino B1 | VSS — Ground |
| Pino B2 | DQ8 — Data input/output 8 |
| Pino B3 | DQ9 — Data input/output 9 |
| Pino B4 | VDD — Power supply |
| Pino B5 | DQ10 — Data input/output 10 |
| Pino B6 | DQ11 — Data input/output 11 |
| Pino B7 | VSS — Ground |
| Pino B8 | DQ12 — Data input/output 12 |
| Pino B9 | DQ13 — Data input/output 13 |
| Pino B10 | VDDQ — I/O power supply |
| Pino B11 | DQ14 — Data input/output 14 |
| Pino B12 | DQ15 — Data input/output 15 |
Aplicações típicas
K4B4G1646D-BCK0 é adequado para 6 aplicaçãos: Laptop Memory Modules, Networking Equipment, Embedded Systems, Automotive Infotainment, Industrial PCs, Consumer Electronics.
Laptop Memory Modules
The K4B4G1646D-BCK0 is ideal for laptop memory modules (SO-DIMM) due to its 1.35V low-voltage operation, which reduces power consumption and extends battery life. Its 4Gb density and x16 organization allow for compact module designs. The DDR3-1600 speed meets the performance requirements of mainstream laptops, providing a balance between speed and power efficiency. When used in a SO-DIMM, the device's 96-ball FBGA package enables high-density assembly on small PCBs. The low operating voltage also reduces heat generation, improving thermal management in thin laptops.
Recomendado
Networking Equipment
In networking equipment such as routers and switches, the K4B4G1646D-BCK0 provides high-bandwidth memory for packet buffering and routing tables. Its 1600 Mbps data rate ensures fast data throughput, while the 1.35V operation reduces power consumption in always-on devices. The 96-ball FBGA package allows for compact PCB layouts, essential for high-port-count designs. The device's on-die termination and internal calibration features help maintain signal integrity in high-speed digital environments, reducing bit errors and improving reliability. This makes it suitable for enterprise and carrier-grade networking hardware.
Recomendado
Embedded Systems
The K4B4G1646D-BCK0 is well-suited for embedded systems like single-board computers and industrial controllers. Its 4Gb density provides ample memory for operating systems and applications, while the x16 interface simplifies connection to microprocessors. The 1.35V operation is compatible with low-power embedded processors, and the commercial temperature range (0°C to 95°C) covers typical indoor environments. The device's self-refresh and auto-refresh modes help reduce power in idle states, which is critical for battery-powered or energy-efficient embedded designs. The FBGA package is robust for industrial environments.
Recomendado
Automotive Infotainment
In automotive infotainment systems, the K4B4G1646D-BCK0 provides reliable memory for navigation, multimedia, and connectivity features. Its 1.35V operation reduces power draw from the vehicle's electrical system, and the commercial temperature range is suitable for cabin environments. The device's high-speed data transfer supports smooth video playback and responsive user interfaces. The 96-ball FBGA package withstands vibration and thermal cycling typical in automotive applications. While not AEC-Q100 qualified, it can be used in non-safety-critical infotainment systems where standard commercial components are acceptable.
Recomendado
Industrial PCs
The K4B4G1646D-BCK0 is used in industrial PCs for factory automation and process control. Its 4Gb density supports multitasking and data logging, while the 1.35V operation reduces heat in sealed enclosures. The device's reliability and long lifecycle make it suitable for industrial applications where downtime is costly. The FBGA package provides good thermal dissipation, and the device's internal calibration ensures stable operation over temperature variations. It is compatible with industrial-grade motherboards that support DDR3L memory.
Recomendado
Consumer Electronics
In consumer electronics like smart TVs and set-top boxes, the K4B4G1646D-BCK0 provides cost-effective memory for streaming and app execution. Its 1.35V operation reduces power consumption, contributing to energy-efficient designs. The 4Gb density is sufficient for modern consumer applications, and the x16 interface simplifies PCB routing. The device's small FBGA package enables slim product designs. The commercial temperature range covers typical home environments, and the RoHS compliance meets environmental regulations.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para K4B4G1646D-BCK0 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | K4B4G1646E-BYK0 | K4B4G1646D-BMK0 | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Data Rate | 1600 Mbps | 1866 Mbps | 1866 Mbps | 1600 Mbps |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Operating Temperature | 0°C to 95°C | 0°C to 95°C | 0°C to 95°C | 0°C to 95°C |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- Lower operating voltage (1.35V) compared to standard DDR3 (1.5V) (vs MT41K256M16HA-125)
- D-die process technology (vs K4B4G1646E-BYK0)
- Wide availability and ecosystem support (vs AS4C256M16D3L-12BCN)
Notas de projeto
Ensure stable power supply to VDD and VDDQ pins. Use 0.1uF ceramic capacitors close to each power pin and a 10uF bulk capacitor per supply rail. The DDR3L operates at 1.35V, so verify the power supply can provide adequate current during burst operations. Follow the power-up sequence specified in the datasheet to avoid latch-up.
Maintain controlled impedance for DQ, DQS, and address/command lines. Use 50-ohm single-ended and 100-ohm differential traces. Keep trace lengths matched within 50 mils for data lines and 100 mils for address/command. Place the device close to the memory controller to minimize propagation delay. Use ground planes to reduce noise.
The K4B4G1646D-BCK0 has a maximum power dissipation of approximately 1.5W during active operation. Ensure adequate airflow or a thermal pad to keep the case temperature below 95°C. In high-density designs, consider thermal vias under the FBGA package to improve heat transfer to the PCB.
Informações de conformidade
RoHS compliant and halogen-free per datasheet. Not AEC-Q100 qualified.
