K4B4G1646D-BMK0 - 4Gb DDR3L SDRAM 256Mx16 1600Mbps | Samsung
N.º da peça: K4B4G1646D-BMK0 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.8 | $78,00 |
| 100 | $7.1 | $710,00 |
| 500 | $6.5 | $3.250,00 |
| 1.000 | $5.9 | $5.900,00 |
K4B4G1646D-BMK0 Visão geral
DDR3L SDRAM is a type of double data rate synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by approximately 15-20% while maintaining similar performance. It is part of the DDR3 memory family, which is widely used in computing, networking, and embedded systems. The K4B4G1646D-BMK0 is a key component in the memory hierarchy, providing high-speed data storage and retrieval for processors and controllers.
Key features include a density of 4Gb, an organization of 256M x 16, and a data rate of 1600 Mbps. The device supports a temperature range of -40°C to 95°C, making it suitable for industrial applications. The 96FBGA package offers a compact footprint with excellent thermal and electrical performance. The device is also lead-free and halogen-free, ensuring environmental compliance.
Technically, the K4B4G1646D-BMK0 utilizes Samsung's advanced D-die process technology, which enhances performance and reliability. The device features programmable CAS latency, burst lengths of 8 and 4 (with burst chop), and on-die termination (ODT) for improved signal integrity. It supports auto self-refresh and partial array self-refresh for power saving. The 1.35V operation reduces power dissipation, making it ideal for battery-powered and thermally constrained systems.
Typical applications include industrial computing, networking equipment, automotive infotainment, and medical devices. The wide temperature range and low power consumption make it suitable for harsh environments. In networking, it provides high-bandwidth memory for routers and switches; in automotive, it supports advanced driver-assistance systems (ADAS) and infotainment; in medical, it enables reliable data processing in diagnostic equipment.
When designing with this device, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to minimize signal integrity issues. The device requires a 1.35V supply and a separate VDDQ, and the reference voltage (VREF) should be carefully routed. For high-speed operation, impedance matching and trace length matching are critical.
Alternativas drop-in para K4B4G1646D-BMK0 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com K4B4G1646D-BMK0 (mesmo formato e footprint) — diferindo em Data Rate, Package, CAS Latency, Operating Temperature, Supply Voltage.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
K4B4G1646D-BMH9
✅ Drop-In✓ Em estoque
$6.5 / unidade
Ver ficha técnica →K4B4G1646E-BYK0
✅ Drop-In✓ Em estoque
$1.8 / unidade
Ver ficha técnica →K4B4G1646F-BYK0
✅ Drop-In✓ Em estoque
$1.8 / unidade
Ver ficha técnica →MT41K256M16HA-125
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6.3636 / unidade
Ver ficha técnica →NT5CB256M16CP-DI
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6.5 / unidade
Ver ficha técnica →IS43TR16256A-125KBLA2
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
K4B4G1646D-BMK0 Classificações máximas e características elétricas
| Density | 4 Gb |
| Organização da memória | 256M x 16 |
| Speed Grade | 1600 Mbps (PC3L-12800) |
| Voltage | 1.35 V |
| Temperatura de operação | -40°C to 95°C |
| Encapsulamento | 96FBGA (TFBGA) |
| Tipo de memória | DDR3L SDRAM |
| Die Version | D-die |
| Lead-Free | Yes |
| Livre de halogênio | Yes |
| RoHS Compliant | Yes |
| Number of Terminals | 96 |
| Package Code | TFBGA |
| Number of Functions | 1 |
| Taxa de dados | 1600 Mbps |
Configuração de pinos do K4B4G1646D-BMK0
| Pino A1 | VDD — Power supply (1.35V) |
| Pino A2 | DQ0 — Data input/output 0 |
| Pino A3 | DQ1 — Data input/output 1 |
| Pino A4 | VSS — Ground |
| Pino A5 | DQ2 — Data input/output 2 |
| Pino A6 | DQ3 — Data input/output 3 |
| Pino A7 | VDD — Power supply |
| Pino A8 | DQ4 — Data input/output 4 |
| Pino A9 | DQ5 — Data input/output 5 |
| Pino A10 | VSS — Ground |
| Pino A11 | DQ6 — Data input/output 6 |
| Pino A12 | DQ7 — Data input/output 7 |
| Pino B1 | VDDQ — I/O power supply |
| Pino B2 | DQ8 — Data input/output 8 |
| Pino B3 | DQ9 — Data input/output 9 |
| Pino B4 | VSSQ — I/O ground |
| Pino B5 | DQ10 — Data input/output 10 |
| Pino B6 | DQ11 — Data input/output 11 |
| Pino B7 | VDDQ — I/O power supply |
| Pino B8 | DQ12 — Data input/output 12 |
| Pino B9 | DQ13 — Data input/output 13 |
| Pino B10 | VSSQ — I/O ground |
| Pino B11 | DQ14 — Data input/output 14 |
| Pino B12 | DQ15 — Data input/output 15 |
| Pino C1 | VSS — Ground |
| Pino C2 | DQS0 — Data strobe 0 |
| Pino C3 | DQS#0 — Data strobe 0 complement |
| Pino C4 | VDD — Power supply |
| Pino C5 | DQS1 — Data strobe 1 |
| Pino C6 | DQS#1 — Data strobe 1 complement |
| Pino C7 | VSS — Ground |
| Pino C8 | DQS2 — Data strobe 2 |
| Pino C9 | DQS#2 — Data strobe 2 complement |
| Pino C10 | VDD — Power supply |
| Pino C11 | DQS3 — Data strobe 3 |
| Pino C12 | DQS#3 — Data strobe 3 complement |
| Pino D1 | VDDQ — I/O power supply |
| Pino D2 | DM0 — Data mask 0 |
| Pino D3 | VSSQ — I/O ground |
| Pino D4 | DM1 — Data mask 1 |
| Pino D5 | VDDQ — I/O power supply |
| Pino D6 | DM2 — Data mask 2 |
| Pino D7 | VSSQ — I/O ground |
| Pino D8 | DM3 — Data mask 3 |
| Pino D9 | VDDQ — I/O power supply |
| Pino D10 | VSSQ — I/O ground |
| Pino D11 | VDDQ — I/O power supply |
| Pino D12 | VSSQ — I/O ground |
| Pino E1 | A0 — Address input 0 |
| Pino E2 | A1 — Address input 1 |
| Pino E3 | A2 — Address input 2 |
| Pino E4 | A3 — Address input 3 |
| Pino E5 | A4 — Address input 4 |
| Pino E6 | A5 — Address input 5 |
| Pino E7 | A6 — Address input 6 |
| Pino E8 | A7 — Address input 7 |
| Pino E9 | A8 — Address input 8 |
| Pino E10 | A9 — Address input 9 |
| Pino E11 | A10/AP — Address input 10 / auto-precharge |
| Pino E12 | A11 — Address input 11 |
| Pino F1 | A12 — Address input 12 |
| Pino F2 | A13 — Address input 13 |
| Pino F3 | A14 — Address input 14 |
| Pino F4 | BA0 — Bank address 0 |
| Pino F5 | BA1 — Bank address 1 |
| Pino F6 | BA2 — Bank address 2 |
| Pino F7 | RAS# — Row address strobe |
| Pino F8 | CAS# — Column address strobe |
| Pino F9 | WE# — Write enable |
| Pino F10 | CS# — Chip select |
| Pino F11 | CKE — Clock enable |
| Pino F12 | ODT — On-die termination |
| Pino G1 | VDD — Power supply |
| Pino G2 | VSS — Ground |
| Pino G3 | VDD — Power supply |
| Pino G4 | VSS — Ground |
| Pino G5 | VDD — Power supply |
| Pino G6 | VSS — Ground |
| Pino G7 | VDD — Power supply |
| Pino G8 | VSS — Ground |
| Pino G9 | VDD — Power supply |
| Pino G10 | VSS — Ground |
| Pino G11 | VDD — Power supply |
| Pino G12 | VSS — Ground |
| Pino H1 | CK — Clock input |
| Pino H2 | CK# — Clock input complement |
| Pino H3 | VDDQ — I/O power supply |
| Pino H4 | VSSQ — I/O ground |
| Pino H5 | VDDQ — I/O power supply |
| Pino H6 | VSSQ — I/O ground |
| Pino H7 | VDDQ — I/O power supply |
| Pino H8 | VSSQ — I/O ground |
| Pino H9 | VDDQ — I/O power supply |
| Pino H10 | VSSQ — I/O ground |
| Pino H11 | VDDQ — I/O power supply |
| Pino H12 | VSSQ — I/O ground |
| Pino J1 | RESET# — Reset input |
| Pino J2 | VDD — Power supply |
| Pino J3 | VSS — Ground |
| Pino J4 | VDD — Power supply |
| Pino J5 | VSS — Ground |
| Pino J6 | VDD — Power supply |
| Pino J7 | VSS — Ground |
| Pino J8 | VDD — Power supply |
| Pino J9 | VSS — Ground |
| Pino J10 | VDD — Power supply |
| Pino J11 | VSS — Ground |
| Pino J12 | VDD — Power supply |
Aplicações típicas
K4B4G1646D-BMK0 é adequado para 6 aplicaçãos: Industrial Computing, Networking Equipment, Automotive Infotainment, Medical Devices, Embedded Systems, Test and Measurement.
Industrial Computing
The K4B4G1646D-BMK0 is ideal for industrial computing systems that require reliable operation in harsh environments. Its industrial temperature range (-40°C to 95°C) ensures functionality in extreme conditions, while the 1.35V low-voltage operation reduces power consumption and heat generation. The 1600 Mbps data rate provides sufficient bandwidth for industrial control and data acquisition. In PLCs and industrial PCs, this memory supports real-time processing and data logging. The 96FBGA package offers a compact footprint for space-constrained designs. Recommended companion products include the NXP i.MX6ULL processor and the TI TPS51200 DDR termination regulator.
Recomendado
Networking Equipment
In networking equipment such as routers and switches, the K4B4G1646D-BMK0 provides high-bandwidth memory for packet buffering and forwarding. The 1600 Mbps data rate supports high-throughput data processing, while the 1.35V operation minimizes power dissipation in dense line cards. The industrial temperature range allows deployment in uncontrolled environments like remote telecom shelters. The 256M x 16 organization offers a good balance between capacity and bus width, simplifying PCB routing. For optimal performance, pair with a network processor like the Intel IXP2800 and use proper decoupling capacitors. The device's low power consumption also aids in meeting energy efficiency standards.
Recomendado
Automotive Infotainment
The K4B4G1646D-BMK0 is suitable for automotive infotainment systems that require robust memory in a wide temperature range. Its -40°C to 95°C operating range covers automotive cabin and under-hood conditions. The 1.35V low-voltage operation reduces power consumption, which is critical in vehicles with limited electrical budgets. The 1600 Mbps speed supports smooth multimedia playback and navigation. The 96FBGA package is compact and reliable for vibration-prone environments. For automotive applications, consider using the AEC-Q100 qualified version if available. Pair with an automotive-grade SoC like the Qualcomm Snapdragon Automotive Platform and ensure proper EMC protection.
Recomendado
Medical Devices
In medical devices such as patient monitors and diagnostic equipment, the K4B4G1646D-BMK0 provides reliable memory for data acquisition and processing. The industrial temperature range ensures operation in clinical environments, and the low power consumption is beneficial for battery-powered portable devices. The 1600 Mbps data rate supports real-time signal processing and image rendering. The lead-free and halogen-free construction meets medical device environmental standards. The 96FBGA package allows for compact PCB designs, which is essential for handheld devices. For medical applications, ensure compliance with IEC 60601 standards and use isolated power supplies. Pair with a medical-grade microcontroller like the STM32L4 series.
Recomendado
Embedded Systems
The K4B4G1646D-BMK0 is a versatile memory solution for embedded systems requiring a balance of performance and power efficiency. Its 1.35V operation reduces power consumption, making it ideal for battery-powered IoT devices and portable instruments. The 1600 Mbps data rate provides ample bandwidth for embedded processors and FPGAs. The industrial temperature range supports outdoor and industrial deployments. The 96FBGA package is suitable for space-constrained designs. For embedded applications, consider using a processor with a DDR3L controller, such as the NXP i.MX6 or Xilinx Zynq. Ensure proper signal integrity by following layout guidelines in the datasheet.
Recomendado
Test and Measurement
In test and measurement equipment like oscilloscopes and logic analyzers, the K4B4G1646D-BMK0 provides high-speed memory for data buffering and waveform storage. The 1600 Mbps data rate enables fast data acquisition, while the 1.35V operation reduces heat in benchtop instruments. The industrial temperature range ensures stable operation in lab environments. The 256M x 16 organization offers sufficient depth for long recordings. The 96FBGA package allows for compact instrument designs. For high-speed data capture, pair with an FPGA like the Xilinx Kintex-7 and use proper termination. The device's low power consumption also contributes to energy-efficient instruments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para K4B4G1646D-BMK0 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | K4B4G1646D-BMH9 | K4B4G1646E-BYK0 | MT41K256M16HA-125 | NT5CB256M16CP-DI |
|---|---|---|---|---|---|
| Package | 96FBGA | 96FBGA | 96FBGA | 96FBGA | 96FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology | Nanya Technology |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Speed Grade | 1600 Mbps | 1866 Mbps | 1866 Mbps | 1600 Mbps | 1600 Mbps |
| Voltage | 1.35 V | 1.35 V | 1.35 V | 1.35 V | 1.35 V |
| Operating Temperature | -40°C to 95°C | 0°C to 95°C | 0°C to 95°C | 0°C to 95°C | -40°C to 95°C |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- Industrial temperature range (-40°C to 95°C) (vs K4B4G1646D-BMH9)
- Lower speed grade (1600 Mbps) for lower power (vs K4B4G1646E-BYK0)
- Samsung D-die proven reliability (vs MT41K256M16HA-125)
Notas de projeto
For high-speed DDR3L signals, maintain controlled impedance of 40-50 ohms for data lines and 50-60 ohms for address/command lines. Keep trace lengths matched within +/- 0.5mm for DQ/DQS groups. Use ground planes beneath the memory to reduce noise. Refer to the Samsung PCB layout guidelines in the datasheet.
Decouple VDD and VDDQ with 0.1uF and 1uF capacitors placed as close as possible to the pins. Use a dedicated VTT regulator for the termination voltage, such as the TI TPS51200, to provide 0.675V for DDR3L. Ensure the VREF voltage is clean and stable, typically 0.675V, and route it away from switching noise.
The K4B4G1646D-BMK0 has a maximum power dissipation of approximately 1.5W at 1600 Mbps. Ensure adequate airflow or a thermal pad to the PCB to keep the junction temperature below 95°C. In industrial environments, consider using a heatsink if the ambient temperature exceeds 70°C.
Informações de conformidade
Lead-free and halogen-free per datasheet. RoHS compliant. AEC-Q100 not applicable for memory components.
