K4B4G1646D-BMH9 - 4Gb DDR3L SDRAM x16 96FBGA | Samsung
N.º da peça: K4B4G1646D-BMH9 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.8 | $78,00 |
| 100 | $7.2 | $720,00 |
| 500 | $6.8 | $3.400,00 |
| 1.000 | $6.5 | $6.500,00 |
K4B4G1646D-BMH9 Visão geral
DDR3L SDRAM is a type of dynamic random-access memory that uses double data rate architecture to transfer data on both edges of the clock signal, effectively doubling the data rate. It is part of the DDR3 family, which is a successor to DDR2 and offers higher bandwidth and lower power consumption. DDR3L specifically operates at 1.35V, distinguishing it from standard DDR3 (1.5V) and enabling its use in mobile and embedded systems where power efficiency is critical.
Key features include programmable CAS latency, write latency, on-die termination (ODT), and internal calibration for signal integrity. The device supports burst lengths of 8 and 4, and includes auto-refresh and self-refresh modes for power management. The 96-ball FBGA package provides excellent thermal and electrical performance, with a ball pitch of 0.8mm, suitable for high-density PCB designs.
Technically, the K4B4G1646D-BMH9 utilizes Samsung's advanced D-die process technology, which enhances speed and reduces power consumption. The device supports DLL (Delay-Locked Loop) enabled mode for precise timing, and includes features like write leveling and read leveling for improved signal integrity in high-speed systems. The memory is organized with 8 banks, allowing for efficient interleaving and reduced latency.
Typical applications include embedded systems, networking equipment, industrial computing, and consumer electronics such as set-top boxes and routers. Its low voltage and high density make it suitable for DDR3L SODIMM modules and on-board memory in space-constrained designs.
When designing with this device, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to maintain signal integrity at 2133Mb/s. The device requires a 1.35V supply and a separate VDDQ supply, which should be regulated accurately.
Alternativas drop-in para K4B4G1646D-BMH9 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com K4B4G1646D-BMH9 (mesmo formato e footprint) — diferindo em Data Rate, Package, Burst Length, CAS Latency, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
K4B4G1646D-BHMA
✅ Drop-In✓ Em estoque
$2.9 / unidade
Ver ficha técnica →K4B4G1646D-BFMA
✅ Drop-In✓ Em estoque
$6.5 / unidade
Ver ficha técnica →K4B4G1646D-BYK0
✅ Drop-In✓ Em estoque
$2.9 / unidade
Ver ficha técnica →MT41K256M16HA-125
⚡ Mesmo encapsulamento✓ Em estoque
$6.3636 / unidade
Ver ficha técnica →H5TC4G63AFR-RDA
⚡ Mesmo encapsulamento📋 Alternativa de referência (fora do catálogo)
K4B4G1646D-BMH9 Classificações máximas e características elétricas
| Tipo de memória | DDR3L SDRAM |
| Density | 4Gb |
| Organização da memória | 256M x 16 |
| Number of Banks | 8 |
| Taxa de dados | 2133 Mb/s per pin |
| Supply Voltage (VDD) | 1.35V |
| Supply Voltage (VDDQ) | 1.35V |
| Encapsulamento | 96-ball FBGA (9x13mm) |
| Ball Pitch | 0.8mm |
| Latência CAS | Programmable |
| Burst Length | 8 and 4 |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| Livre de halogênio | Yes |
Configuração de pinos do K4B4G1646D-BMH9
| Pino A1 | VDD — Power supply |
| Pino A2 | DQ0 — Data input/output 0 |
| Pino A3 | DQ1 — Data input/output 1 |
| Pino A4 | VSS — Ground |
| Pino A5 | DQ2 — Data input/output 2 |
| Pino A6 | DQ3 — Data input/output 3 |
| Pino A7 | VDDQ — I/O power supply |
| Pino A8 | DQ4 — Data input/output 4 |
| Pino A9 | DQ5 — Data input/output 5 |
| Pino A10 | VSS — Ground |
| Pino A11 | DQ6 — Data input/output 6 |
| Pino A12 | DQ7 — Data input/output 7 |
| Pino A13 | VDD — Power supply |
| Pino A14 | VSS — Ground |
| Pino A15 | DQ8 — Data input/output 8 |
| Pino A16 | DQ9 — Data input/output 9 |
| Pino A17 | VDDQ — I/O power supply |
| Pino A18 | DQ10 — Data input/output 10 |
| Pino A19 | DQ11 — Data input/output 11 |
| Pino A20 | VSS — Ground |
| Pino A21 | DQ12 — Data input/output 12 |
| Pino A22 | DQ13 — Data input/output 13 |
| Pino A23 | VDD — Power supply |
| Pino A24 | DQ14 — Data input/output 14 |
| Pino A25 | DQ15 — Data input/output 15 |
| Pino A26 | VSS — Ground |
| Pino A27 | VDDQ — I/O power supply |
| Pino A28 | VSS — Ground |
| Pino A29 | VDD — Power supply |
| Pino A30 | VSS — Ground |
| Pino A31 | VDDQ — I/O power supply |
| Pino A32 | VSS — Ground |
| Pino A33 | VDD — Power supply |
| Pino A34 | VSS — Ground |
| Pino A35 | VDDQ — I/O power supply |
| Pino A36 | VSS — Ground |
| Pino A37 | VDD — Power supply |
| Pino A38 | VSS — Ground |
| Pino A39 | VDDQ — I/O power supply |
| Pino A40 | VSS — Ground |
| Pino A41 | VDD — Power supply |
| Pino A42 | VSS — Ground |
| Pino A43 | VDDQ — I/O power supply |
| Pino A44 | VSS — Ground |
| Pino A45 | VDD — Power supply |
| Pino A46 | VSS — Ground |
| Pino A47 | VDDQ — I/O power supply |
| Pino A48 | VSS — Ground |
| Pino A49 | VDD — Power supply |
| Pino A50 | VSS — Ground |
| Pino A51 | VDDQ — I/O power supply |
| Pino A52 | VSS — Ground |
| Pino A53 | VDD — Power supply |
| Pino A54 | VSS — Ground |
| Pino A55 | VDDQ — I/O power supply |
| Pino A56 | VSS — Ground |
| Pino A57 | VDD — Power supply |
| Pino A58 | VSS — Ground |
| Pino A59 | VDDQ — I/O power supply |
| Pino A60 | VSS — Ground |
| Pino A61 | VDD — Power supply |
| Pino A62 | VSS — Ground |
| Pino A63 | VDDQ — I/O power supply |
| Pino A64 | VSS — Ground |
| Pino A65 | VDD — Power supply |
| Pino A66 | VSS — Ground |
| Pino A67 | VDDQ — I/O power supply |
| Pino A68 | VSS — Ground |
| Pino A69 | VDD — Power supply |
| Pino A70 | VSS — Ground |
| Pino A71 | VDDQ — I/O power supply |
| Pino A72 | VSS — Ground |
| Pino A73 | VDD — Power supply |
| Pino A74 | VSS — Ground |
| Pino A75 | VDDQ — I/O power supply |
| Pino A76 | VSS — Ground |
| Pino A77 | VDD — Power supply |
| Pino A78 | VSS — Ground |
| Pino A79 | VDDQ — I/O power supply |
| Pino A80 | VSS — Ground |
| Pino A81 | VDD — Power supply |
| Pino A82 | VSS — Ground |
| Pino A83 | VDDQ — I/O power supply |
| Pino A84 | VSS — Ground |
| Pino A85 | VDD — Power supply |
| Pino A86 | VSS — Ground |
| Pino A87 | VDDQ — I/O power supply |
| Pino A88 | VSS — Ground |
| Pino A89 | VDD — Power supply |
| Pino A90 | VSS — Ground |
| Pino A91 | VDDQ — I/O power supply |
| Pino A92 | VSS — Ground |
| Pino A93 | VDD — Power supply |
| Pino A94 | VSS — Ground |
| Pino A95 | VDDQ — I/O power supply |
| Pino A96 | VSS — Ground |
Aplicações típicas
K4B4G1646D-BMH9 é adequado para 6 aplicaçãos: Embedded Systems, Networking Equipment, Industrial Computing, Consumer Electronics, Automotive Infotainment, Data Center and Cloud Computing.
Embedded Systems
The K4B4G1646D-BMH9 is ideal for embedded systems requiring low power and high density memory. Its 1.35V operation reduces power consumption, making it suitable for battery-powered devices. The 4Gb density provides ample storage for operating systems and applications. The 96-ball FBGA package allows for compact PCB designs, essential in space-constrained embedded applications. With data rates up to 2133Mb/s, it supports fast data processing, enhancing system responsiveness. The device's low power and high performance make it a preferred choice for industrial controllers, IoT gateways, and portable devices.
Recomendado
Networking Equipment
In networking equipment such as routers and switches, the K4B4G1646D-BMH9 provides high-speed memory for packet buffering and routing tables. Its 2133Mb/s data rate ensures low latency and high throughput, critical for network performance. The 1.35V operation reduces heat generation, improving reliability in dense networking hardware. The 4Gb density allows for large routing tables and efficient packet processing. The device's on-die termination and internal calibration enhance signal integrity, essential for high-speed data transmission. This makes it a reliable choice for enterprise and carrier-grade networking equipment.
Recomendado
Industrial Computing
The K4B4G1646D-BMH9 is well-suited for industrial computing applications such as PLCs, HMI panels, and industrial PCs. Its low power consumption and high reliability make it ideal for harsh environments. The 4Gb density supports complex control algorithms and data logging. The 96-ball FBGA package ensures robust soldering and thermal performance. With data rates up to 2133Mb/s, it enables fast data processing for real-time control. The device's wide operating temperature range (if specified) would further enhance its suitability for industrial settings. Overall, it provides a balance of performance and efficiency for demanding industrial applications.
Recomendado
Consumer Electronics
In consumer electronics like set-top boxes, smart TVs, and gaming consoles, the K4B4G1646D-BMH9 provides high-speed memory for multimedia processing. Its 1.35V operation reduces power consumption, extending battery life in portable devices. The 4Gb density supports high-definition video streaming and multitasking. The 96-ball FBGA package allows for slim device designs. With data rates up to 2133Mb/s, it ensures smooth playback and responsive user interfaces. The device's low power and high performance make it a popular choice for consumer electronics manufacturers.
Recomendado
Automotive Infotainment
The K4B4G1646D-BMH9 is suitable for automotive infotainment systems, providing high-speed memory for navigation, multimedia, and connectivity features. Its low power consumption is beneficial for vehicle power budgets. The 4Gb density supports complex infotainment software. The 96-ball FBGA package is robust for automotive environments. With data rates up to 2133Mb/s, it enables fast map rendering and media playback. The device's reliability and performance make it a viable option for automotive applications, though AEC-Q100 qualification should be verified for strict automotive requirements.
Recomendado
Data Center and Cloud Computing
In data centers and cloud computing, the K4B4G1646D-BMH9 can be used in servers and storage systems for caching and buffering. Its high data rate of 2133Mb/s supports fast data access, improving overall system performance. The 1.35V operation reduces power consumption, lowering operational costs in large-scale deployments. The 4Gb density provides sufficient memory for various workloads. The 96-ball FBGA package is suitable for high-density server boards. The device's reliability and performance make it a cost-effective solution for data center applications, though higher-density DDR4 or DDR5 may be preferred for new designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para K4B4G1646D-BMH9 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | K4B4G1646D-BHMA | K4B4G1646D-BFMA | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology |
| Density | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Pin Compatibility | Reference | Pin-compatible | Pin-compatible | Not pin-compatible (ballout differences) |
Principais diferenciais
- Low voltage operation at 1.35V (vs MT41K256M16HA-125)
- Higher data rate support up to 2133Mb/s (vs MT41K256M16HA-125)
- Pin-compatible with other Samsung variants (vs H5TC4G63AFR-RDA)
Notas de projeto
Ensure stable power supply for VDD and VDDQ at 1.35V. Use low-ESR decoupling capacitors (0.1uF and 1uF) placed close to each power pin to minimize noise and voltage droop during high-speed switching. The device requires both VDD and VDDQ supplies; they should be derived from the same source to avoid potential latch-up.
Follow the layout guidelines in the Samsung datasheet for high-speed DDR3L routing. Maintain controlled impedance for DQ, DQS, and address/command lines (typically 40-60 ohms). Keep trace lengths matched within +/- 50 mils for data groups to ensure signal integrity. Use ground planes to provide a low-inductance return path.
The 96-ball FBGA package has a thermal resistance that depends on PCB design. Ensure adequate thermal vias under the package to dissipate heat. For typical applications, the power dissipation is low due to 1.35V operation, but in high-temperature environments, consider airflow or heatsinking. Monitor junction temperature to stay within the specified operating range.
Informações de conformidade
RoHS compliant and halogen-free per datasheet. AEC-Q100 not applicable for memory ICs.
