M29W160EB70N3E vs M29W800FB70N3F Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M29W160EB70N3E sa pamamagitan ng Micron Technology at M29W800FB70N3F sa pamamagitan ng Micron Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Micron Technology
M29W160EB70N3E - 16Mbit NOR Flash 70ns 48-TSOP | Micron
M29W160EB70N3E ✓ NakahandaMicron Technology
M29W800FB70N3F - 8Mb Parallel NOR Flash 70ns TSOP-48 | Micron
M29W800FB70N3F ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M29W160EB70N3E | M29W800FB70N3F |
|---|---|---|
| Brand | Micron Technology | Micron Technology |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Uri ng Memory | FLASH - NOR | NOR Flash (Boot Block) |
| Laki ng Memory | 16 Mbit (2M x8, 1M x16) | — |
| Organisasyon | 2M x8 / 1M x16 | 512K x 16 / 1M x 8 |
| Access Time | 70 ns | 70 ns |
| Interface | Parallel | — |
| Supply Voltage (VCC) | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Programming Time | 10 us (typical) | 10 us per byte/word (typical) |
| Cell Type | SLC NOR | — |
| Temperature na Operasyon | -40C to +125C | [DATA_NEEDED: Operating Temperature Range] |
| Packhaging / Kaso | 48-TFSOP (0.724 in, 18.40 mm width) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tray | Tape & Reel |
| Speed Grade | -70 | — |
| FBGA Code | N/A (TSOP package) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Level ng MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Density | — | 8 Mbit |
| Uri ng Interface | — | Parallel |
| Boot Block Location | — | Bottom |
| Block Count | — | 19 memory blocks (1 boot, 3 parameter, 15 main) |
| Bus Width Selection | — | x8 / x16 via BYTE# pin |
| CFI Compliant | — | Yes |
| Erase Suspend/Resume | — | Yes |
| Packhaging | — | TSOP-48 (12 x 20 mm) |