MPC852TVR80A vs MPC852TZT80A Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MPC852TVR80A sa pamamagitan ng NXP Semiconductors at MPC852TZT80A sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MPC852TVR80A MPC852TVR80A - 80MHz PowerQUICC MPU, 256-PBGA | NXP

MPC852TVR80A - 80MHz PowerQUICC MPU, 256-PBGA | NXP

MPC852TVR80A ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro MPC852TVR80A MPC852TZT80A
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Huling Pagbili NRND
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors (formerly Freescale Semiconductor)
Series / Family MPC8xx / PowerQUICC I —
Core Power Architecture, 32-bit, 1 core MPC8xx (32-bit Power Architecture)
Core Frequency 80 MHz 80 MHz
Packhaging 256-PBGA (23x23 mm, 1.27 mm pitch) —
Temperature na Operasyon 0 °C to +95 °C 0 °C to +95 °C
Volte ng Pagbibigay 3.3 V core with 5 V-tolerant I/O option 3.3 V
Instruction/Data Cache 8 KB unified —
Communications Module CPM (Communications Processor Module) with HDLC/Ethernet —
Ethernet Support Up to 3x Fast Ethernet (10/100) —
PCI Bridge Integrated PCI bridge —
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Level ng MSL 3 (168 hours) —
HTSUS Code 8542.31.0001 —
Tindminan RoHS Details not published - verify per lot Non-Compliant (legacy part)
Series — PowerQUICC, MPC8xx
Core Count — 1
Process Technology — 0.18 µm CMOS
Package Type — 256-PBGA (Plastic Ball Grid Array)
Package Dimensions — 23 x 23 mm
Tray Packaging — Tray (per distributor listing)
Product Category — Microprocessors (MPU)
Lead Finish — Contains lead (SnPb or lead-bearing solder profile)

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