MPC852TVR80A vs MPC852TZT80A 比較
詳細並排比較 MPC852TVR80A 由 NXP Semiconductors 與 MPC852TZT80A 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPC852TVR80A | MPC852TZT80A |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 最後購買 | NRND |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series / Family | MPC8xx / PowerQUICC I | — |
| Core | Power Architecture, 32-bit, 1 core | MPC8xx (32-bit Power Architecture) |
| Core Frequency | 80 MHz | 80 MHz |
| 封裝 | 256-PBGA (23x23 mm, 1.27 mm pitch) | — |
| 工作溫度 | 0 °C to +95 °C | 0 °C to +95 °C |
| 供應電壓 | 3.3 V core with 5 V-tolerant I/O option | 3.3 V |
| Instruction/Data Cache | 8 KB unified | — |
| Communications Module | CPM (Communications Processor Module) with HDLC/Ethernet | — |
| Ethernet Support | Up to 3x Fast Ethernet (10/100) | — |
| PCI Bridge | Integrated PCI bridge | — |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| MSL 等級 | 3 (168 hours) | — |
| HTSUS Code | 8542.31.0001 | — |
| RoHS 狀態 | Details not published - verify per lot | Non-Compliant (legacy part) |
| Series | — | PowerQUICC, MPC8xx |
| Core Count | — | 1 |
| Process Technology | — | 0.18 µm CMOS |
| Package Type | — | 256-PBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 23 x 23 mm |
| Tray Packaging | — | Tray (per distributor listing) |
| Product Category | — | Microprocessors (MPU) |
| Lead Finish | — | Contains lead (SnPb or lead-bearing solder profile) |