XC6SLX75-3FGG484C vs XC6SLX75-3FG484I Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng XC6SLX75-3FGG484C sa pamamagitan ng AMD at XC6SLX75-3FG484I sa pamamagitan ng AMD. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro XC6SLX75-3FGG484C XC6SLX75-3FG484I
Brand AMD AMD
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Unknown
Device Type Field Programmable Gate Array (FPGA) FPGA
Series Spartan-6 LX —
Logic Cells 74,637 74,637 cells
User I/O Count 280 —
Package Type 484-ball FBGA (MS-034) —
Package Body Size 23 x 23 mm —
Package Pitch 1.0 mm 1 mm
Internal Clock Frequency 667 MHz —
Speed Grade -3 (highest performance in Spartan-6 LX family) -3 highest-performance family grade
Hanay ng Temperature na Operasyon 0 °C to 85 °C (commercial grade) —
Uri ng Pagpapasok Surface Mount (SMD) Surface mount
Volte ng Pagbibigay [DATA_NEEDED: supply voltage range] 1.2 V
Block RAM [DATA_NEEDED: block RAM capacity] —
DSP Slices [DATA_NEEDED: DSP48A slice count] —
Configuration Memory [DATA_NEEDED: configuration memory type] —
I/O Standards [DATA_NEEDED: supported I/O standards per bank] —
Manufacturer AMD (formerly Xilinx) —
Tindminan RoHS unknown [DATA_NEEDED: RoHS status]
Order Code Suffix C = commercial temperature grade —
FPGA Family — Spartan-6 LX
Configurable Logic Blocks — 5,831 CLBs
Process Technology — 45 nm CMOS
User I/O — 280 I/O
Internal Frequency — 667 MHz
Catalog Maximum Frequency — 862 MHz
Temperature Grade — Industrial
Temperature na Operasyon — 0°C to 85°C (32°F to 185°F)
Packhaging — FBGA-484
Package Dimensions — 23 mm × 23 mm
Terminal Count — 484 balls
REACH Status — [DATA_NEEDED: REACH status]

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