XC6SLX75-3FGG484C vs XC6SLX75-3FG484I 比較

詳細並排比較 XC6SLX75-3FGG484C 由 AMD 與 XC6SLX75-3FG484I 由 AMD. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 XC6SLX75-3FGG484C XC6SLX75-3FG484I
品牌 AMD AMD
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 Unknown
Device Type Field Programmable Gate Array (FPGA) FPGA
Series Spartan-6 LX —
Logic Cells 74,637 74,637 cells
User I/O Count 280 —
Package Type 484-ball FBGA (MS-034) —
Package Body Size 23 x 23 mm —
Package Pitch 1.0 mm 1 mm
Internal Clock Frequency 667 MHz —
Speed Grade -3 (highest performance in Spartan-6 LX family) -3 highest-performance family grade
工作溫度範圍 0 °C to 85 °C (commercial grade) —
安裝類型 Surface Mount (SMD) Surface mount
供應電壓 [DATA_NEEDED: supply voltage range] 1.2 V
Block RAM [DATA_NEEDED: block RAM capacity] —
DSP Slices [DATA_NEEDED: DSP48A slice count] —
Configuration Memory [DATA_NEEDED: configuration memory type] —
I/O Standards [DATA_NEEDED: supported I/O standards per bank] —
Manufacturer AMD (formerly Xilinx) —
RoHS 狀態 unknown [DATA_NEEDED: RoHS status]
Order Code Suffix C = commercial temperature grade —
FPGA Family — Spartan-6 LX
Configurable Logic Blocks — 5,831 CLBs
Process Technology — 45 nm CMOS
User I/O — 280 I/O
Internal Frequency — 667 MHz
Catalog Maximum Frequency — 862 MHz
Temperature Grade — Industrial
工作溫度 — 0°C to 85°C (32°F to 185°F)
封裝 — FBGA-484
Package Dimensions — 23 mm × 23 mm
Terminal Count — 484 balls
REACH Status — [DATA_NEEDED: REACH status]

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