5CSEBA2U19A7N - Cyclone V SE SoC FPGA 25K LE, A7 Automotive | Altera
MPN: 5CSEBA2U19A7N ✓ Nakahanda5CSEBA2U19A7N Ulas
The Cyclone V SE SoC family occupies the mid-range position in the broader Cyclone V SoC taxonomy, sitting between the smaller Cyclone V SX (lower power, lower LE) and higher-capacity Cyclone V ST/GT variants. An SoC FPGA is a heterogeneous computing device that pairs a deterministic, parallel programmable-logic fabric with a sequential, software-driven application processor subsystem on a single die, enabling designers to partition tasks between hardware acceleration in the FPGA and software execution on the ARM cores.
Key specifications include 25K logic elements, automotive A7 temperature grade support, integrated dual ARM Cortex-A9 cores with NEON media engine and single/double-precision floating-point unit, variable-precision DSP blocks for fixed- and floating-point signal processing, and on-chip memory with embedded ECC for high-reliability applications. The 28nm low-power process targets industrial, automotive, and vision applications where thermal envelope and power budget are constrained.
This SoC FPGA is engineered for the intersection of programmable logic and embedded Linux/Android workloads. The dual 32-bit ARM cores operate up to 700 MHz with tightly-coupled memory and shared L2 cache, while the FPGA fabric delivers deterministic, low-latency I/O handling for high-speed sensors and parallel data acquisition. The hard memory controller, external memory interfaces, and peripheral bridges are integrated to minimize external component count.
Typical applications include automotive Advanced Driver Assistance Systems (ADAS) sensor fusion, industrial machine vision and robotics controllers, factory automation gateways, and embedded vision for medical imaging or surveillance. The AEC-Q100 automotive qualification and extended temperature support also suit chassis electronics, body controllers, and HMI systems.
When designing with this device, plan power sequencing for the FPGA core, HPS I/O, and PLL rails independently, and follow Altera's Cyclone V SE hardware reference manual for DDR3/LPDDR2 bring-up. The 19x19 mm UBGApackage requires a multilayer PCB with via-in-pad and controlled-impedance traces for high-speed transceivers.
This page synthesizes distributor pricing, AEC-Q100 cross-references, and practical HPS/FPGA integration guidance not collected in any single source on the web today.
Mga alternatibo na pwedeng ilagay na 5CSEBA2U19A7N — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok 5CSEBA2U19A7N (parehas na form factor at footprint) — pagkakaiba sa Package, Logic Elements, Process Technology, DSP Blocks, Operating Temperature.
5CSEBA2U19C8N
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Tingnan ang Datasheet →5CSEBA2U19I7N
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Tingnan ang Datasheet →5CSEBA2U19C7N
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Tingnan ang Datasheet →5CGTFD7D5F27I7N
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Tingnan ang Datasheet →5CSEBA2U19A7N Mga Pinakamataas na Rating at Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Device Variant | 5CSEA2 (U19 device) |
| Logic Elements | 25,000 |
| Process Technology | 28 nm low-power |
| HPS Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 700 MHz |
| Core Voltage (VCCINT) | 1.1 V |
| Temperature Grade | Automotive A7 |
| AEC-Q100 | Qualified |
| Packhaging | 484-UBGA (U19), 19x19 mm |
| Uri ng Pagpapasok | Surface Mount (FBGA) |
| User I/O Pins | 161 |
| Memory | Embedded SRAM + DDR3/LPDDR2 controller (HPS) |
| DSP Blocks | Variable-precision, embedded multiplier/accumulator |
| Tindminan RoHS | Compliant |
| Lead-Free | Yes |
Gabay sa Pin Configuration ng 5CSEBA2U19A7N 484-ubga (u19), 19x19 mm
Pin configuration para sa 5CSEBA2U19A7N (484-ubga (u19), 19x19 mm package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa 5CSEBA2U19A7N.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
5CSEBA2U19A7N ay nararapat para sa 7 aplikasyons: Automotive ADAS Sensor Fusion, Industrial Machine Vision Controller, Motor Control and Drive Inverter, Automotive HMI / Infotainment Controller, Factory Automation Gateway / Edge Controller, Medical Imaging / Diagnostic Equipment, Surveillance / Smart Camera Edge AI.
Automotive ADAS Sensor Fusion
The 5CSEBA2U19A7N's AEC-Q100 qualification, dual ARM Cortex-A9 HPS, and 25K-logic-element FPGA fabric make it well-suited to automotive ADAS sensor-fusion front-ends. The HPS runs the real-time operating system and sensor calibration, while the FPGA fabric performs low-latency object detection, radar preprocessing, and CAN-FD bridging. The 28nm low-power process keeps junction temperature manageable in sealed ECU enclosures. Compared to discrete MCU + FPGA solutions, the integrated SoC reduces board area, BOM count, and inter-IC latency.
Inirekomenda
Industrial Machine Vision Controller
The 5CSEBA2U19A7N pairs deterministic FPGA fabric parallelism with Linux-capable HPS processing, ideal for industrial machine vision controllers handling MIPI CSI-2, GigE Vision, or parallel CMOS image sensors. The variable-precision DSP blocks accelerate Bayer demosaicing, edge detection, and CNN inference at the edge, while the Cortex-A9 cores run OpenCV and factory-floor protocol stacks (OPC-UA, Modbus/TCP). The 161 user I/O support multiple camera lanes and GPIO for lighting control.
Inirekomenda
Motor Control and Drive Inverter
The 5CSEBA2U19A7N's combination of high-speed FPGA I/O, deterministic timing, and an embedded HPS makes it a strong fit for industrial motor-control and drive inverter designs. The FPGA fabric implements field-oriented control (FOC), PWM generation, and encoder interfaces at sub-microsecond latency, while the ARM cores execute supervisory control loops, communication stacks, and fault diagnostics. Automotive A7 temperature grade also enables use in traction inverters and servo drives with extended thermal envelopes.
Inirekomenda
Automotive HMI / Infotainment Controller
The 5CSEBA2U19A7N's dual ARM Cortex-A9 cores running Android or Linux, combined with FPGA-accelerated display pipelines, suit automotive HMI and infotainment controllers. The HPS handles graphics stacks, touch input, and Bluetooth/Wi-Fi host bridging, while the FPGA fabric drives LVDS or OpenLDI displays, performs pixel-level compositing, and offloads video decode. AEC-Q100 qualification plus the U19 UBGApackage fit behind the dashboard where thermal and EMI budgets are tight.
Inirekomenda
Factory Automation Gateway / Edge Controller
The 5CSEBA2U19A7N serves as an edge-of-network gateway in Industry 4.0 deployments, with the HPS running containerized workloads (Docker on Linux) and the FPGA fabric accelerating industrial protocols like PROFINET, EtherCAT, or EtherNet/IP in hardware. The 25K LE capacity allows simultaneous bridging of multiple real-time Ethernet channels without external ASICs, while the integrated Cortex-A9 cores handle secure boot, TLS, and MQTT messaging. The UBGApackage is robust against factory-floor vibration and thermal cycling.
Inirekomenda
Medical Imaging / Diagnostic Equipment
The 5CSEBA2U19A7N's deterministic FPGA fabric accelerates ultrasound beamforming, CT reconstruction pre-processing, and digital X-ray pipeline stages in medical imaging equipment. The dual ARM cores host the patient UI, DICOM storage, and clinician-facing controls. AEC-Q100 is not directly applicable, but the automotive A7 temperature range and extended reliability testing make the part attractive for medical designs demanding long product life cycles and high MTBF.
Inirekomenda
Surveillance / Smart Camera Edge AI
The 5CSEBA2U19A7N's FPGA fabric implements low-latency video pre-processing (HDR merge, lens correction, motion detection) while the ARM cores run edge AI inference (TensorFlow Lite, ONNX) for surveillance and smart camera applications. The 161 user I/O support multiple sensor lanes, IR illumination control, and PTZ motor drivers. Compared to ASIC-based SoCs, the FPGA portion lets OEMs differentiate with proprietary analytics without respinning silicon.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for 5CSEBA2U19A7N — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | 5CSEBA2U19C8N | 5CSEBA4U19C8N | 5CSEBA2U19I7N | 5CSEBA2U19C7N | 5CGTFD7D5F27I7N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 484-UBGA (U19) 19x19 mm | 484-UBGA (U19) - same | 484-UBGA (U19) - same | 484-UBGA (U19) - same | 484-UBGA (U19) - same | 672-FBGA - larger |
| Family | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V GT SoC (with transceivers) |
| Logic Elements | 25,000 | 25,000 | 40,000 | 25,000 | 25,000 | ~150,000 |
| HPS Processor | Dual ARM Cortex-A9 700 MHz | Dual ARM Cortex-A9 700 MHz | Dual ARM Cortex-A9 925 MHz | Dual ARM Cortex-A9 700 MHz | Dual ARM Cortex-A9 700 MHz | Dual ARM Cortex-A9 925 MHz |
| Temperature Grade | Automotive A7 (-40C to +125C) | Commercial C8 (0C to +85C) | Commercial C8 (0C to +85C) | Industrial I7 (-40C to +100C) | Commercial C7 | Industrial I7 |
| AEC-Q100 | Qualified | Not qualified | Not qualified | Not qualified | Not qualified | Not qualified |
| Transceivers | None (SE family) | None | None | None | None | 3.125 Gbps transceivers |
Pangunahing mga Pagkakaiba
- Automotive AEC-Q100 A7 qualification at 25K LE capacity (kumpara sa5CSEBA2U19C8N)
- Highest LE capacity in pin-compatible U19 UBGApackage (kumpara sa5CSEBA2U19C8N)
- Cyclone V SE: zero high-speed transceivers, lower power than GT (kumpara sa5CGTFD7D5F27I7N)
- Integrated HPS eliminates external processor + bus bridge (kumpara sa5CEFA9F23I7N (Cyclone V E, FPGA-only))
Talaan ng Disenyo
Estimated: with VCCINT 1.1V at typical SoC operation (FPGA fabric ~50% utilization + HPS active), the 5CSEBA2U19A7N draws approximately 3-5W from the core rail plus HPS I/O and FPGA I/O bank supplies. Design a 6+ layer PCB with separate planes for VCCINT, VCCPD, VCC_HPS, and VCCAUX to minimize switching noise. Decoupling follows Altera's Cyclone V hardware reference manual: place 0.1uF X7R caps at every VCCINT pin within 100 mils, plus bulk 47-100uF polymer caps per supply plane.
The 484-UBGA U19 package (19x19 mm, 0.8 mm ball pitch) requires via-in-pad technology with laser-drilled microvias and 4-mil/4-mil trace/space design rules. Maintain a continuous GND pour under the package and stitch vias on a 200-mil grid around the BGA perimeter. Length-match DDR3/LPDDR2 traces per the Cyclone V SE external memory interface guidelines - mismatch beyond 25 ps risks setup/hold violations at 400 MHz.
Estimated: at 5W total dissipation on the 484-UBGA (theta_JA ~15-20 C/W on a 6-layer JEDEC test board, per Altera thermal model), the junction-to-ambient temperature rise is 75-100 C above ambient. For automotive A7 grade with 125 C junction limit, derate ambient to ~25-50 C max without airflow. Apply thermal vias under the exposed die region and consider a heat spreader for sealed ECU enclosures.
Common pitfalls include: (1) not sequencing the FPGA core, HPS, and I/O rails independently - the HPS can boot before the FPGA fabric is configured if rails are not ordered, leading to bus contention; (2) omitting the external clock reference - the HPS requires a 25-50 MHz reference for its PLL chain before the Cortex-A9 cores can boot; (3) using a non-AEC-Q100 part in automotive safety-critical paths - always verify the ordering code ends in A7N for AEC-Q100 compliance.
Impormasyon ng Pagsunod sa Kautusan
AEC-Q100 qualified per datasheets.com catalog entry. RoHS and lead-free confirmed per Altera product page. Halogen-free status not explicitly published in available data.
