H5TC4G63AFR-H9A - 4Gb DDR3L SDRAM 256Mx16 | SK hynix
MPN: H5TC4G63AFR-H9A ✓ NakahandaH5TC4G63AFR-H9A Ulas
DDR3L (Double Data Rate 3 Low Voltage) SDRAM is a type of synchronous dynamic random-access memory that operates at 1.35V, reducing power consumption by about 15% compared to standard 1.5V DDR3. It is part of the DDR3 memory family, which uses double data rate signaling to transfer data on both edges of the clock, and is widely used in laptops, embedded systems, and networking equipment where power efficiency is critical.
Key features include a 4Gb density, 16-bit I/O width, 1.35V core and I/O supply, and a 96-ball FBGA package. The device offers programmable CAS latency, burst lengths of 8 and 4, and on-die termination (ODT) for signal integrity. It supports auto-refresh and self-refresh modes, and includes a temperature-compensated self-refresh (TCSR) feature for low-power standby.
Technically, the H5TC4G63AFR-H9A uses a 30nm-class process technology, achieving high density with low power. The -H9A speed grade indicates a tCK of 1.07ns (DDR3L-1866) and CL13. The device features a 16n prefetch architecture, enabling high bandwidth. It also includes programmable impedance calibration (ZQ calibration) for improved signal quality.
Typical applications include main memory for ultra-thin laptops, embedded computing, networking routers, and industrial PCs. Its low voltage and high density make it ideal for space-constrained designs where power and performance are balanced.
When designing with this device, ensure proper decoupling with 0.1uF and 1uF capacitors near the power pins, and follow the PCB layout guidelines for DDR3 routing to maintain signal integrity at 1866 Mbps.
Mga alternatibo na pwedeng ilagay na H5TC4G63AFR-H9A — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok H5TC4G63AFR-H9A (parehas na form factor at footprint) — pagkakaiba sa Package, Supply Voltage, Burst Length, Data Rate, Operating Temperature.
H5TC4G63AFR-H9I
✅ Drop-In📋 Alternatibo na Reference (hindi sa katalogo)
H5TC4G63AFR-RDL
✅ Drop-In📋 Alternatibo na Reference (hindi sa katalogo)
H5TC4G63AFR-PBR
✅ Drop-In✗ Wala sa Stock
$5.9091 / Yunit
Tingnan ang Datasheet →MT41K256M16HA-125
✅ Drop-In ⚠️ Mga Talaan Hindi Naiwerikmo✗ Wala sa Stock
$6.3636 / Yunit
Tingnan ang Datasheet →K4B4G1646E-BYMA
✅ Drop-In ⚠️ Mga Talaan Hindi Naiwerikmo✗ Wala sa Stock
$14.3182 / Yunit
Tingnan ang Datasheet →H5TC4G63AFR-H9A Mga Pinakamataas na Rating at Electrical Characteristics
| Uri ng Memory | DDR3L SDRAM |
| Density | 4 Gb |
| Organisasyon | 256M x 16 |
| Volte ng Pagbibigay | 1.35 V |
| Rate ng Data | 1866 Mbps (PC3-14900) |
| Latensya ng CAS | 13 |
| Packhaging | 96-ball FBGA |
| Temperature na Operasyon | 0C to +95C (TC) |
| Lead-Free | Yes |
| Wala sa Halogen | Yes |
| RoHS Compliant | Yes |
| Burst Length | 8, 4 |
| On-Die Termination | Yes |
| Self-Refresh | Yes |
| Auto-Refresh | Yes |
Pin Configuration ng H5TC4G63AFR-H9A
| Pin A1 | VDD — Power supply (1.35V) |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin A4 | VSS — Ground |
| Pin A5 | DQ2 — Data input/output 2 |
| Pin A6 | DQ3 — Data input/output 3 |
| Pin A7 | VDD — Power supply (1.35V) |
| Pin A8 | DQ4 — Data input/output 4 |
| Pin A9 | DQ5 — Data input/output 5 |
| Pin A10 | VSS — Ground |
| Pin A11 | DQ6 — Data input/output 6 |
| Pin A12 | DQ7 — Data input/output 7 |
Tipikal na mga Gamit
H5TC4G63AFR-H9A ay nararapat para sa 6 aplikasyons: Ultra-Thin Laptops, Embedded Computing, Networking Equipment, Industrial PCs, Consumer Electronics, Automotive Infotainment.
Ultra-Thin Laptops
The H5TC4G63AFR-H9A's 1.35V operation and 4Gb density make it ideal for ultra-thin laptops where power efficiency and space are critical. Its 1866 Mbps data rate ensures smooth multitasking and fast application loading. The 96-ball FBGA package allows for compact PCB designs, and the low voltage reduces heat generation, extending battery life. Designers can pair it with low-power processors like Intel Core U-series to achieve optimal performance-per-watt.
Inirekomenda
Embedded Computing
In embedded systems, the H5TC4G63AFR-H9A provides high-density memory with low power consumption, making it suitable for industrial PCs, single-board computers, and IoT gateways. Its 1.35V supply reduces overall system power, and the 1866 Mbps bandwidth supports real-time data processing. The device's on-die termination improves signal integrity in noisy environments, and its wide operating temperature range (0C to +95C) ensures reliability in industrial settings.
Inirekomenda
Networking Equipment
The H5TC4G63AFR-H9A is well-suited for networking routers and switches that require high-bandwidth memory for packet buffering and routing tables. Its 1866 Mbps data rate enables fast data throughput, while the 1.35V operation reduces power consumption in always-on equipment. The 96-ball FBGA package is compatible with standard PCB layouts, and the device's low power helps meet energy efficiency regulations. It can be used alongside network processors to handle high traffic loads.
Inirekomenda
Industrial PCs
For industrial PCs used in automation and control, the H5TC4G63AFR-H9A offers reliable memory with a wide temperature range and low power. Its 4Gb density supports demanding applications like machine vision and data logging. The 1.35V supply reduces heat, which is crucial in sealed enclosures. The device's high bandwidth ensures fast data access, and its RoHS compliance meets environmental standards. It can be paired with industrial-grade processors for robust performance.
Inirekomenda
Consumer Electronics
The H5TC4G63AFR-H9A is used in consumer devices like smart TVs, set-top boxes, and gaming consoles where high memory bandwidth and low power are essential. Its 1866 Mbps data rate supports 4K video streaming and smooth gaming. The 1.35V operation reduces energy consumption, contributing to Energy Star compliance. The compact FBGA package allows for slim device designs, and the device's reliability ensures long product life.
Inirekomenda
Automotive Infotainment
In automotive infotainment systems, the H5TC4G63AFR-H9A provides high-density memory for navigation, media playback, and connectivity. Its 1.35V operation reduces power draw from the vehicle's electrical system, and the 1866 Mbps bandwidth supports high-resolution displays. The device's operating temperature range (0C to +95C) is suitable for cabin environments. It can be used with automotive-grade processors to deliver a responsive user experience.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for H5TC4G63AFR-H9A — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | H5TC4G63AFR-H9I | H5TC4G63AFR-RDL | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | SK hynix | SK hynix | SK hynix | Micron |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35 V | 1.35 V | 1.35 V | 1.35 V |
| Data Rate | 1866 Mbps | 1866 Mbps | 1600 Mbps | 1866 Mbps |
| CAS Latency | 13 | 13 | 11 | 13 |
| Operating Temperature | 0C to +95C | -40C to +95C | 0C to +95C | 0C to +95C |
Pangunahing mga Pagkakaiba
- Higher data rate than -RDL and -PBR variants (kumpara saH5TC4G63AFR-RDL)
- Commercial temperature range vs industrial (kumpara saH5TC4G63AFR-H9I)
- Same-brand availability and compatibility (kumpara saMT41K256M16HA-125)
Talaan ng Disenyo
For DDR3L routing at 1866 Mbps, maintain controlled impedance of 40-50 ohms for single-ended signals and 80-100 ohms for differential pairs. Keep trace lengths matched within 0.5mm for data and address/command groups. Use a solid ground plane and place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin to minimize power supply noise.
The H5TC4G63AFR-H9A has a maximum operating temperature of +95C. Ensure adequate airflow or heatsinking in high-ambient environments. The 1.35V operation reduces power dissipation, but at high data rates, the device can still generate significant heat. Use thermal vias under the FBGA package to improve heat transfer to the PCB.
Use on-die termination (ODT) settings to match the motherboard's impedance and reduce reflections. For 1866 Mbps, set ODT to 40 ohms for data signals. Also, enable ZQ calibration during initialization to compensate for process variations. Follow the JEDEC DDR3L guidelines for VREF training to ensure reliable operation.
Impormasyon ng Pagsunod sa Kautusan
Lead-free and halogen-free per datasheet. RoHS compliant. REACH and conflict minerals status not specified in provided data.
