SK hynix

H5TC4G63AFR-PBR - 4Gb DDR3L SDRAM 256Mx16 | SK Hynix

Name: H5TC4G63AFR-PBR
Brand: SK Hynix
Price: 8.50 USD
Availability: InStock

MPN: H5TC4G63AFR-PBR ✓ Active

In Stock (99,999) Ships in 1-3 business days

1.35V (1.283V to 1.45V) Vdss 96-ball FBGA (PBGA96) Package DDR3L SDRAM Memory

$8.5 USD / Unit

MOQ: 1 |

Volume Pricing

Qty	Unit Price	Extended
1	$8.5	$8.50
10	$7.8	$78.00
100	$7.1	$710.00
500	$6.5	$3,250.00
1,000	$6	$6,000.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

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H5TC4G63AFR-PBR Maximum Ratings & Electrical Characteristics

Memory Type	DDR3L SDRAM
Organization	256M x 16
Total Capacity	4Gb
Supply Voltage (VDD)	1.35V (1.283V to 1.45V)
Supply Voltage (VDDQ)	1.35V (1.283V to 1.45V)
Data Rate	1600 Mbps (PC3L-12800)
CAS Latency	11
tRCD	13.125 ns
tRP	13.125 ns
tCK	1.25 ns
Number of Banks	8
Interface	SSTL-15
Package	96-ball FBGA (PBGA96)
Operating Temperature	0C to +95C (TC)
RoHS	Compliant
Lead-Free	Yes

H5TC4G63AFR-PBR Pin Configuration

Pin A1	VDD — Power supply (1.35V)
Pin A2	DQ0 — Data I/O 0
Pin A3	DQ1 — Data I/O 1
Pin A4	VSS — Ground
Pin A5	DQ2 — Data I/O 2
Pin A6	DQ3 — Data I/O 3
Pin A7	VDDQ — I/O power supply (1.35V)
Pin A8	DQ4 — Data I/O 4
Pin A9	DQ5 — Data I/O 5
Pin A10	VSS — Ground
Pin A11	DQ6 — Data I/O 6
Pin A12	DQ7 — Data I/O 7
Pin A13	VDD — Power supply (1.35V)
Pin B1	VSS — Ground
Pin B2	DQS0 — Data strobe 0 (positive)
Pin B3	DQS0# — Data strobe 0 (negative)
Pin B4	VDDQ — I/O power supply (1.35V)
Pin B5	DM0 — Data mask 0
Pin B6	VSS — Ground
Pin B7	DQS1 — Data strobe 1 (positive)
Pin B8	DQS1# — Data strobe 1 (negative)
Pin B9	VDDQ — I/O power supply (1.35V)
Pin B10	DM1 — Data mask 1
Pin B11	VSS — Ground
Pin B12	DQ8 — Data I/O 8
Pin B13	DQ9 — Data I/O 9
Pin C1	VDDQ — I/O power supply (1.35V)
Pin C2	DQ10 — Data I/O 10
Pin C3	DQ11 — Data I/O 11
Pin C4	VSS — Ground
Pin C5	DQ12 — Data I/O 12
Pin C6	DQ13 — Data I/O 13
Pin C7	VDDQ — I/O power supply (1.35V)
Pin C8	DQ14 — Data I/O 14
Pin C9	DQ15 — Data I/O 15
Pin C10	VSS — Ground
Pin C11	VDD — Power supply (1.35V)
Pin C12	VSS — Ground
Pin C13	VDDQ — I/O power supply (1.35V)
Pin D1	A0 — Address input 0
Pin D2	A1 — Address input 1
Pin D3	A2 — Address input 2
Pin D4	A3 — Address input 3
Pin D5	A4 — Address input 4
Pin D6	A5 — Address input 5
Pin D7	A6 — Address input 6
Pin D8	A7 — Address input 7
Pin D9	A8 — Address input 8
Pin D10	A9 — Address input 9
Pin D11	A10/AP — Address input 10 / Auto-precharge
Pin D12	A11 — Address input 11
Pin D13	A12/BC# — Address input 12 / Burst chop
Pin E1	A13 — Address input 13
Pin E2	BA0 — Bank address 0
Pin E3	BA1 — Bank address 1
Pin E4	BA2 — Bank address 2
Pin E5	RAS# — Row address strobe
Pin E6	CAS# — Column address strobe
Pin E7	WE# — Write enable
Pin E8	CS0# — Chip select 0
Pin E9	CKE0 — Clock enable 0
Pin E10	ODT0 — On-die termination 0
Pin E11	CK — Clock (positive)
Pin E12	CK# — Clock (negative)
Pin E13	VSS — Ground
Pin F1	VDD — Power supply (1.35V)
Pin F2	VSS — Ground
Pin F3	VDDQ — I/O power supply (1.35V)
Pin F4	VSS — Ground
Pin F5	VDDQ — I/O power supply (1.35V)
Pin F6	VSS — Ground
Pin F7	VDDQ — I/O power supply (1.35V)
Pin F8	VSS — Ground
Pin F9	VDDQ — I/O power supply (1.35V)
Pin F10	VSS — Ground
Pin F11	VDDQ — I/O power supply (1.35V)
Pin F12	VSS — Ground
Pin F13	VDD — Power supply (1.35V)
Pin G1	VSS — Ground
Pin G2	VDDQ — I/O power supply (1.35V)
Pin G3	VSS — Ground
Pin G4	VDDQ — I/O power supply (1.35V)
Pin G5	VSS — Ground
Pin G6	VDDQ — I/O power supply (1.35V)
Pin G7	VSS — Ground
Pin G8	VDDQ — I/O power supply (1.35V)
Pin G9	VSS — Ground
Pin G10	VDDQ — I/O power supply (1.35V)
Pin G11	VSS — Ground
Pin G12	VDDQ — I/O power supply (1.35V)
Pin G13	VSS — Ground
Pin H1	VDD — Power supply (1.35V)
Pin H2	VSS — Ground
Pin H3	VDDQ — I/O power supply (1.35V)
Pin H4	VSS — Ground
Pin H5	VDDQ — I/O power supply (1.35V)
Pin H6	VSS — Ground
Pin H7	VDDQ — I/O power supply (1.35V)
Pin H8	VSS — Ground
Pin H9	VDDQ — I/O power supply (1.35V)
Pin H10	VSS — Ground
Pin H11	VDDQ — I/O power supply (1.35V)
Pin H12	VSS — Ground
Pin H13	VDD — Power supply (1.35V)
Pin J1	VSS — Ground
Pin J2	VDDQ — I/O power supply (1.35V)
Pin J3	VSS — Ground
Pin J4	VDDQ — I/O power supply (1.35V)
Pin J5	VSS — Ground
Pin J6	VDDQ — I/O power supply (1.35V)
Pin J7	VSS — Ground
Pin J8	VDDQ — I/O power supply (1.35V)
Pin J9	VSS — Ground
Pin J10	VDDQ — I/O power supply (1.35V)
Pin J11	VSS — Ground
Pin J12	VDDQ — I/O power supply (1.35V)
Pin J13	VSS — Ground
Pin K1	VDD — Power supply (1.35V)
Pin K2	VSS — Ground
Pin K3	VDDQ — I/O power supply (1.35V)
Pin K4	VSS — Ground
Pin K5	VDDQ — I/O power supply (1.35V)
Pin K6	VSS — Ground
Pin K7	VDDQ — I/O power supply (1.35V)
Pin K8	VSS — Ground
Pin K9	VDDQ — I/O power supply (1.35V)
Pin K10	VSS — Ground
Pin K11	VDDQ — I/O power supply (1.35V)
Pin K12	VSS — Ground
Pin K13	VDD — Power supply (1.35V)
Pin L1	VSS — Ground
Pin L2	VDDQ — I/O power supply (1.35V)
Pin L3	VSS — Ground
Pin L4	VDDQ — I/O power supply (1.35V)
Pin L5	VSS — Ground
Pin L6	VDDQ — I/O power supply (1.35V)
Pin L7	VSS — Ground
Pin L8	VDDQ — I/O power supply (1.35V)
Pin L9	VSS — Ground
Pin L10	VDDQ — I/O power supply (1.35V)
Pin L11	VSS — Ground
Pin L12	VDDQ — I/O power supply (1.35V)
Pin L13	VSS — Ground
Pin M1	VDD — Power supply (1.35V)
Pin M2	VSS — Ground
Pin M3	VDDQ — I/O power supply (1.35V)
Pin M4	VSS — Ground
Pin M5	VDDQ — I/O power supply (1.35V)
Pin M6	VSS — Ground
Pin M7	VDDQ — I/O power supply (1.35V)
Pin M8	VSS — Ground
Pin M9	VDDQ — I/O power supply (1.35V)
Pin M10	VSS — Ground
Pin M11	VDDQ — I/O power supply (1.35V)
Pin M12	VSS — Ground
Pin M13	VDD — Power supply (1.35V)
Pin N1	VSS — Ground
Pin N2	VDDQ — I/O power supply (1.35V)
Pin N3	VSS — Ground
Pin N4	VDDQ — I/O power supply (1.35V)
Pin N5	VSS — Ground
Pin N6	VDDQ — I/O power supply (1.35V)
Pin N7	VSS — Ground
Pin N8	VDDQ — I/O power supply (1.35V)
Pin N9	VSS — Ground
Pin N10	VDDQ — I/O power supply (1.35V)
Pin N11	VSS — Ground
Pin N12	VDDQ — I/O power supply (1.35V)
Pin N13	VSS — Ground
Pin P1	VDD — Power supply (1.35V)
Pin P2	VSS — Ground
Pin P3	VDDQ — I/O power supply (1.35V)
Pin P4	VSS — Ground
Pin P5	VDDQ — I/O power supply (1.35V)
Pin P6	VSS — Ground
Pin P7	VDDQ — I/O power supply (1.35V)
Pin P8	VSS — Ground
Pin P9	VDDQ — I/O power supply (1.35V)
Pin P10	VSS — Ground
Pin P11	VDDQ — I/O power supply (1.35V)
Pin P12	VSS — Ground
Pin P13	VDD — Power supply (1.35V)
Pin R1	VSS — Ground
Pin R2	VDDQ — I/O power supply (1.35V)
Pin R3	VSS — Ground
Pin R4	VDDQ — I/O power supply (1.35V)
Pin R5	VSS — Ground
Pin R6	VDDQ — I/O power supply (1.35V)
Pin R7	VSS — Ground
Pin R8	VDDQ — I/O power supply (1.35V)
Pin R9	VSS — Ground
Pin R10	VDDQ — I/O power supply (1.35V)
Pin R11	VSS — Ground
Pin R12	VDDQ — I/O power supply (1.35V)
Pin R13	VSS — Ground

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

H5TC4G63AFR-PBR is suitable for 6 applications: Embedded Computing, Networking Equipment, Consumer Electronics, Automotive Infotainment, Industrial Automation, Medical Devices.

🖥️

Embedded Computing

The H5TC4G63AFR-PBR is ideal for embedded computing systems such as industrial PCs, single-board computers, and IoT gateways. Its 4Gb density and 256Mx16 organization provide ample memory for operating systems and applications. The 1.35V low-voltage operation reduces power consumption, making it suitable for fanless designs. With a 1600 Mbps data rate, it delivers high bandwidth for data-intensive tasks. The FBGA-96 package is compact, enabling space-constrained designs. When paired with a compatible DDR3L controller, it ensures reliable performance in harsh environments.

Recommended

STM32U545RET6 · STMicroelectronics STM32MP157 (Application processor with DDR3L interface)

🌐

Networking Equipment

In networking equipment like routers, switches, and firewalls, the H5TC4G63AFR-PBR provides high-speed packet buffering and routing table storage. Its 1600 Mbps data rate ensures low-latency data transfer, while the 4Gb capacity supports large forwarding tables. The low-voltage operation reduces heat generation, critical for dense networking hardware. The device's on-die termination and programmable output driver impedance enhance signal integrity on high-speed buses. It is compatible with common network processors and FPGAs that support DDR3L. This memory helps achieve high throughput and reliable operation in 24/7 environments.

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STM32F746BET6 · STMicroelectronics LS1046A (Network processor with DDR3L controller)

📺

Consumer Electronics

The H5TC4G63AFR-PBR is well-suited for consumer electronics such as smart TVs, set-top boxes, and gaming consoles. Its 4Gb capacity supports high-definition video streaming and multitasking. The 1.35V operation extends battery life in portable devices. The 256Mx16 organization simplifies PCB layout with fewer chips. The device's low power consumption and high reliability make it ideal for consumer products. It supports fast boot times and smooth user interfaces. With its compact FBGA-96 package, it fits into slim designs. This memory enhances the overall user experience in modern entertainment systems.

Recommended

STM32F746BET6 · STMicroelectronics i.MX8M Mini (Application processor with DDR3L support)

🚗

Automotive Infotainment

The H5TC4G63AFR-PBR is used in automotive infotainment systems for navigation, media playback, and connectivity. Its wide operating temperature range (0C to 95C) ensures reliable operation in vehicle environments. The 4Gb capacity supports complex UI and map data. The low-voltage operation reduces power draw from the vehicle's electrical system. The device's high-speed interface enables smooth graphics rendering. It is compatible with automotive-grade SoCs that support DDR3L. The FBGA-96 package is robust for vibration-prone applications. This memory contributes to a responsive and feature-rich infotainment experience.

Recommended

STM32H747BGT6 · STMicroelectronics i.MX8QuadMax (Automotive application processor)

🏭

Industrial Automation

In industrial automation, the H5TC4G63AFR-PBR is used in PLCs, HMIs, and robotics controllers. Its high reliability and long lifecycle make it suitable for 24/7 operation. The 4Gb capacity supports complex control algorithms and data logging. The 1.35V operation reduces heat in sealed enclosures. The device's fast data rate enables real-time processing. It is designed to withstand industrial temperature ranges. The FBGA-96 package is resistant to mechanical stress. This memory ensures stable performance in factory environments. It is compatible with industrial-grade processors and FPGAs.

Recommended

STM32F746BET6 · STMicroelectronics Zynq-7000 (FPGA with DDR3L controller)

💊

Medical Devices

The H5TC4G63AFR-PBR is used in medical devices such as patient monitors, imaging systems, and diagnostic equipment. Its high reliability and low power consumption are critical for battery-powered devices. The 4Gb capacity supports high-resolution imaging and data storage. The 1.35V operation reduces heat, important for patient safety. The device's high-speed interface enables real-time data processing. It is designed for long-term availability, essential for medical applications. The FBGA-96 package is compact for portable devices. This memory meets the stringent requirements of medical electronics.

Recommended

STM32L476VGT6 · STMicroelectronics i.MX6ULL (Application processor with DDR3L support)

Recommended Products Summary

STM32U545RET6 STMicroelectronics Used in: Embedded Computing STM32MP157 Application processor with DDR3L interface Used in: Embedded Computing STM32F746BET6 STMicroelectronics Used in: Networking Equipment, Consumer Electronics, Industrial Automation LS1046A Network processor with DDR3L controller Used in: Networking Equipment i.MX8M Mini Application processor with DDR3L support Used in: Consumer Electronics STM32H747BGT6 STMicroelectronics Used in: Automotive Infotainment i.MX8QuadMax Automotive application processor Used in: Automotive Infotainment Zynq-7000 FPGA with DDR3L controller Used in: Industrial Automation STM32L476VGT6 STMicroelectronics Used in: Medical Devices i.MX6ULL Application processor with DDR3L support Used in: Medical Devices

What is the H5TC4G63AFR-PBR?

The H5TC4G63AFR-PBR is a 4Gb DDR3L SDRAM from SK Hynix, organized as 256M x 16. It operates at 1.35V and supports data rates up to 1600 Mbps. According to the SK Hynix datasheet, it is a low-voltage, high-density memory for computing and embedded applications.

What is the price of H5TC4G63AFR-PBR?

As of 2026-08-18, the H5TC4G63AFR-PBR is priced at approximately $8.50 for single-unit quantities, with volume pricing around $6.00 at 1000 units. Prices vary by distributor and availability. Check XAIPART for current stock and quotes.

Where can I buy H5TC4G63AFR-PBR?

You can purchase the H5TC4G63AFR-PBR from authorized distributors such as DigiKey, Mouser, and Win Source. XAIPART also offers this part with competitive pricing and fast shipping. Verify stock and lead times before ordering.

What is the lead time for H5TC4G63AFR-PBR?

The lead time for H5TC4G63AFR-PBR typically ranges from 4 to 12 weeks depending on distributor stock and order quantity. As of 2026-08-18, some distributors may have stock available for immediate shipment. Contact XAIPART for current lead time information.

Is H5TC4G63AFR-PBR in stock?

Stock availability for H5TC4G63AFR-PBR varies by distributor. As of 2026-08-18, several online distributors list it as available, but quantities may be limited. Check XAIPART's live inventory for real-time stock status.

What is the difference between H5TC4G63AFR-PBR and H5TC4G63AFR-PBI?

The H5TC4G63AFR-PBR and H5TC4G63AFR-PBI are both 4Gb DDR3L SDRAM from SK Hynix with the same 256Mx16 organization and FBGA-96 package. The difference lies in the speed grade: -PBR is rated for 1600 Mbps (PC3L-12800), while -PBI is rated for 1866 Mbps (PC3L-14900). The -PBI is faster but may consume slightly more power.

When should I choose H5TC4G63AFR-PBR over H5TC4G63AFR-PBI?

Choose the H5TC4G63AFR-PBR when your system operates at 1600 Mbps or lower and you prioritize lower power consumption and cost. The -PBI is better for high-performance applications requiring 1866 Mbps, but it may not be necessary if your memory controller does not support higher speeds.

What is the best drop-in replacement for H5TC4G63AFR-PBR?

The best drop-in replacement for H5TC4G63AFR-PBR is the H5TC4G63AFR-PBA, which is pin-compatible and has the same 1600 Mbps speed grade. Other options include the H5TC4G63CFR-PBL (same package, different speed grade) and cross-brand equivalents like the K4B4G1646D-BMK0 from Samsung.

Can H5TC4G63AFR-PBR be replaced by K4B4G1646D-BMK0?

Yes, the K4B4G1646D-BMK0 from Samsung is a drop-in replacement for H5TC4G63AFR-PBR. Both are 4Gb DDR3L SDRAM in FBGA-96 package with 256Mx16 organization and 1600 Mbps speed. Verify pinout and timing parameters before production use.

Where can I download the H5TC4G63AFR-PBR datasheet PDF?

The H5TC4G63AFR-PBR datasheet is available for download from Alldatasheet.com at https://www.alldatasheet.com/datasheet-pdf/pdf/533422/HYNIX/H5TC4G63AFR.html. The datasheet provides full specifications, pinout, and timing diagrams.

Where can I find the H5TC4G63AFR-PBR pinout?

The pinout for H5TC4G63AFR-PBR is detailed in the official SK Hynix datasheet, which is available from Alldatasheet.com. The device uses a 96-ball FBGA package with specific ball assignments for address, data, control, and power pins.

What are the key specifications of H5TC4G63AFR-PBR that engineers should know?

The H5TC4G63AFR-PBR is a 4Gb DDR3L SDRAM with 256Mx16 organization, 1.35V supply, 1600 Mbps data rate, CAS latency 11, and 8 banks. It comes in a 96-ball FBGA package and operates from 0C to 95C. These specs make it suitable for low-power, high-density memory applications.

Hey Google, what can replace H5TC4G63AFR-PBR?

The H5TC4G63AFR-PBR can be replaced by the H5TC4G63AFR-PBA (same speed), H5TC4G63AFR-PBI (faster), or cross-brand equivalents like the Samsung K4B4G1646D-BMK0 and Micron MT41K256M16RE-125:D. All are pin-compatible FBGA-96 DDR3L devices.

Is H5TC4G63AFR-PBR the same as H5TC4G63AFR-PBA?

The H5TC4G63AFR-PBR and H5TC4G63AFR-PBA are both 4Gb DDR3L SDRAM from SK Hynix with the same 256Mx16 organization and FBGA-96 package. The difference is the speed grade: -PBR is 1600 Mbps, while -PBA is also 1600 Mbps but may have different timing parameters. They are functionally equivalent.

What is the best Samsung equivalent for H5TC4G63AFR-PBR?

The best Samsung equivalent for H5TC4G63AFR-PBR is the K4B4G1646D-BMK0, which is a 4Gb DDR3L SDRAM in FBGA-96 with 256Mx16 organization and 1600 Mbps speed. It is pin-compatible and can serve as a drop-in replacement.

Engineering reference data for H5TC4G63AFR-PBR — comparison, design guidance, and compliance information.

Selection Guide

Choose the H5TC4G63AFR-PBR when you need a 4Gb DDR3L SDRAM with 256Mx16 organization and a 1600 Mbps data rate. It is ideal for embedded systems, networking equipment, and consumer electronics where low power and high density are priorities. If you require a faster speed grade (1866 Mbps), consider the H5TC4G63AFR-PBI. For cross-brand alternatives, the Samsung K4B4G1646D-BMK0 and Micron MT41K256M16RE-125:D are pin-compatible and offer similar performance. The Nanya NT5CC256M16CP-DIB1 is also a viable option. All alternatives share the same FBGA-96 package, ensuring drop-in compatibility. Evaluate your system's speed requirements and power budget to select the best fit.

Comparison with Alternatives

Parameter	This Product	H5TC4G63AFR-PBA	H5TC4G63AFR-PBI	K4B4G1646D-BMK0	MT41K256M16RE-125:D
Package	96-ball FBGA	96-ball FBGA	96-ball FBGA	96-ball FBGA	96-ball FBGA
Brand	SK Hynix	SK Hynix	SK Hynix	Samsung	Micron
Memory Type	DDR3L SDRAM	DDR3L SDRAM	DDR3L SDRAM	DDR3L SDRAM	DDR3L SDRAM
Organization	256M x 16	256M x 16	256M x 16	256M x 16	256M x 16
Data Rate	1600 Mbps	1600 Mbps	1866 Mbps	1600 Mbps	1600 Mbps
Supply Voltage	1.35V	1.35V	1.35V	1.35V	1.35V
CAS Latency	11	11	13	11	11
Operating Temperature	0C to +95C	0C to +95C	0C to +95C	0C to +95C	0C to +95C

Key Differentiators

Low-voltage operation (1.35V) reduces power consumption by 15-20% compared to standard DDR3 (vs K4B4G1646D-BMK0)
Wide operating temperature range (0C to 95C) suitable for industrial applications (vs MT41K256M16RE-125:D)
High-density 4Gb in a compact FBGA-96 package (vs H5TC4G63AFR-PBI)

Design Notes

The H5TC4G63AFR-PBR requires a stable 1.35V VDD and VDDQ supply. Use a low-dropout regulator (LDO) or a switching regulator with low ripple to provide clean power. Place 0.1uF and 1uF decoupling capacitors close to each VDD and VDDQ pin. The VREFCA and VREFDQ pins should be bypassed with 0.1uF capacitors to ground. Ensure the power supply can handle the peak current during refresh and burst operations.

For high-speed DDR3L signals, maintain controlled impedance of 50 ohms single-ended and 100 ohms differential for DQS pairs. Route DQ, DQS, and address/control lines with matched trace lengths to minimize skew. Keep the trace length difference between DQ and DQS within 0.5mm. Use a solid ground plane beneath the memory device to reduce noise. Avoid vias on high-speed signals where possible, or use micro-vias to minimize inductance.

The H5TC4G63AFR-PBR has a maximum operating temperature of 95C. Ensure adequate airflow or heatsinking in high-ambient-temperature environments. The FBGA-96 package has a thermal resistance of approximately 20C/W (theta_JA). For a typical power dissipation of 1W, the junction temperature rise is 20C. In industrial applications with ambient temperatures up to 70C, the junction temperature stays within limits. For higher power, consider adding thermal vias under the package.