Intel

EPM240GF100C5N - MAX II CPLD, 192 MC, 4.7ns, 100-FBGA | Intel

MPN: EPM240GF100C5N ✓ Hoạt động
1.8 V Vdss 100-ball FBGA (11 x 11 mm, 1.0 mm pitch) Package 201.1 MHz Speed 8 Kbits Memory
MOQ: 1 |

EPM240GF100C5N Tóm tắt

The Intel (formerly Altera) EPM240GF100C5N is a MAX II family Complex Programmable Logic Device (CPLD) that delivers 192 macro cells and a 4.7 ns pin-to-pin logic delay in a 100-ball FineLine BGA (FBGA-100) package. It is fabricated on a low-power 0.18 um CMOS process and operates from a 1.8 V core supply with multi-voltage VCCIO bank support for 1.5 V, 1.8 V, 2.5 V, and 3.3 V I/O interfacing. According to the MAX II Device Handbook, the device exposes up to 80 user I/Os and provides instant-on, non-volatile configuration via on-chip Flash memory.

A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL macro-cell arrays with a programmable interconnect matrix. In the broader taxonomy, a CPLD sits between simple SPLDs (PAL/GAL) and high-density FPGAs, offering deterministic timing, instant-on behavior, and robust I/O drive strength. MAX II devices belong to Intel's low-power, instant-on CPLD family, commonly used for glue logic, bus bridging, power sequencing, and I/O expansion in systems where FPGAs would be over-specified or too expensive.

Key specifications include 192 logic elements (macro cells), 4.7 ns tPD (fastest pin-to-pin delay), 201.1 MHz internal operation, 80 user I/Os, in-system programmability via JTAG, and 1.8 V core with 1.5-3.3 V VCCIO. The device integrates 8 Kbits of user Flash memory, supports hot-socketing, and provides multi-voltage I/O standards including LVCMOS, LVTTL, and PCI compliance. Compared with earlier MAX 7000-series parts, MAX II cuts static power by an order of magnitude.

Architecturally, the EPM240GF100C5N uses a Logic Array Block (LAB) structure of 16 macro cells each, with a fast interconnect matrix and a non-volatile Flash configuration block that eliminates the external boot PROM. The on-board JTAG interface is IEEE 1149.1 compliant and supports the Jam STAPL programming standard for in-field updates. The 100-ball FBGA at 11 x 11 mm, 1.0 mm pitch, supports surface-mount assembly on standard reflow profiles.

Typical applications include power-up sequencing controllers, I/O voltage translation between 3.3 V and 1.8 V logic domains, peripheral bus bridges (for example, legacy parallel buses to SPI or I2C), LED and display multiplexing drivers, and address decoding in microcontroller-based designs. Designers favor MAX II when deterministic timing, instant-on, and low quiescent power are required without the cost or complexity of an FPGA.

When designing with this device, pay attention to the multi-bank VCCIO supply pins: each I/O bank can operate at an independent 1.5/1.8/2.5/3.3 V level, but unused banks must still be tied to a valid supply voltage to keep the inputs in a defined state. Configure the device with Quartus II (legacy) or the Intel Quartus Prime Lite edition toolchain, and verify pin assignments against the FBGA-100 package diagram before PCB layout.

Bộ thay thế dễ dàng lắp đặt cho EPM240GF100C5N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPM240GF100C5N (cùng hình factor và footprint) — khác nhau ở Package, RoHS Status, Configuration Memory, Operating Temperature, Programming Interface.

Altera
RoHS Status: Details (per distributor product page)
Operating Temperature: 0°C to 85°C (TJ)
Programming Interface: JTAG (IEEE 1149.1) / ISP
So sánh với EPM240GF100C5N →
Intel
Package: 100-ball FineLine BGA (FBGA), 11 mm × 11 mm, 1.0 mm pitch
RoHS Status: Compliant (lead-free)
Configuration Memory: On-chip Flash (non-volatile, instant-on)
So sánh với EPM240GF100C5N →
Intel
Package: 100-ball FineLine BGA (FBGA-100)
RoHS Status: Compliant
Configuration Memory: Non-volatile flash (instant-on)
So sánh với EPM240GF100C5N →
Intel
Configuration Memory: Flash (non-volatile, instant-on)
Operating Temperature: -40 C to +100 C (industrial, I-grade)
So sánh với EPM240GF100C5N →
Altera
Package: 100-ball FBGA (FineLine BGA), 11 mm x 11 mm, 1.0 mm pitch
So sánh với EPM240GF100C5N →
Altera
Package: 100-MBGA (Micro FineLine BGA), 6 x 6 mm
Configuration Memory: Non-volatile Flash
Programming Interface: JTAG (IEEE 1149.1) - ISP
So sánh với EPM240GF100C5N →
Intel
Package: TQFP-100 (16 × 16 mm, 0.5 mm pitch)
RoHS Status: Lead-Free / Compliant
So sánh với EPM240GF100C5N →
Intel
Package: 100-pin Micro FineLine BGA (MBGA), 6 x 6 mm, 0.5 mm pitch
RoHS Status: Lead Free (per DigiChip spec sheet)
Configuration Memory: Non-volatile on-chip flash (instant-on)
So sánh với EPM240GF100C5N →
Intel
Package: 100-ball MBGA (Micro BGA)
RoHS Status: Compliant (per manufacturer product page)
Operating Temperature: 0 °C to +85 °C (commercial)
So sánh với EPM240GF100C5N →
Altera
Package: 100-LBGA (FBGA-100), 11 x 11 mm, 1.0 mm pitch
RoHS Status: Compliant (lead-free)
Configuration Memory: On-chip Flash (non-volatile)
So sánh với EPM240GF100C5N →

EPM240F100I5N

✅ Drop-In
Intel
📦 100-ball FBGA
MAX II · CPLD (Complex Programmable Logic Device) · 240 · 192 · 80 · FBGA-100 (FineLine BGA) · LBGA100 · 11 x 11 mm, 1.0 mm ball pitch

Liên hệ để biết giá

Xem tài liệu →

EPM240F100C5N

✅ Drop-In
Intel
📦 100-ball FBGA
MAX II · 240 · 192 · 80 · 4.7 ns · 100-ball FineLine BGA (FBGA-100)

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Xem tài liệu →

EPM240F100C4N

✅ Drop-In
Intel
📦 100-ball FBGA
MAX II · CPLD - Complex Programmable Logic Device · 192 · 240 · 80 · 4.7 ns · 247.5 MHz · 2.5 V / 3.3 V

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Xem tài liệu →

EPM240GF100C5

✅ Drop-In
📦 100-ball FBGA
trailing 'N' denotes lead-free; without 'N' is SnPb ball finish, otherwise identical die

📋 Tham chiếu thay thế (không có trong danh mục)

EPM240F100C4N

✅ Drop-In ⚠️ Thông số chưa được xác minh
Intel
📦 100-ball FBGA
MAX II · CPLD - Complex Programmable Logic Device · 192 · 240 · 80 · 4.7 ns · 247.5 MHz · 2.5 V / 3.3 V

Liên hệ để biết giá

Xem tài liệu →

EPM1270F256C5N

✅ Drop-In
Altera
📦 100-ball FBGA
MAX II · EPM1270 · CPLD (Complex Programmable Logic Device) · 980 · 1270 · 212 · 6.2 ns · 201.1 MHz

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EPM240GF100C5N Tỷ lệ tối đa & tính chất điện

Family MAX II
Logic Elements / Macro Cells 192 macro cells
Pin-to-Pin Logic Delay (tPD) 4.7 ns
Maximum Operating Frequency 201.1 MHz
User I/Os 80
Logic Family CMOS
Process Technology 0.18 um
Core Supply Voltage (VCCINT) 1.8 V
I/O Supply Voltage (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V
User Flash Memory 8 Kbits
Hộp 100-ball FBGA (11 x 11 mm, 1.0 mm pitch)
Kiểu lắp đặt Surface Mount
Nhiệt độ hoạt động -40 C to +125 C
Programming Interface JTAG (IEEE 1149.1) / Jam STAPL
Configuration Memory On-chip non-volatile Flash
Trạng thái RoHS Lead Free, RoHS compliant

Cấu hình chân EPM240GF100C5N

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Chân A1 I/O — User I/O bank 1
Chân A2 I/O — User I/O bank 1
Chân A3 VCCIO1 — I/O bank 1 supply voltage
Chân A4 I/O — User I/O bank 1
Chân A5 I/O — User I/O bank 1
Chân A6 GND — Ground
Chân A7 I/O — User I/O bank 2
Chân A8 I/O — User I/O bank 2
Chân A9 VCCIO2 — I/O bank 2 supply voltage
Chân A10 I/O — User I/O bank 2
Chân B1 I/O — User I/O bank 1
Chân B2 I/O — User I/O bank 1
Chân B3 GND — Ground
Chân B4 I/O — User I/O bank 1
Chân B5 I/O — User I/O bank 1
Chân B6 VCCINT — Core 1.8 V supply
Chân B7 I/O — User I/O bank 2
Chân B8 I/O — User I/O bank 2
Chân B9 GND — Ground
Chân B10 I/O — User I/O bank 2
Chân C1 I/O — User I/O bank 1
Chân C2 VCCIO1 — I/O bank 1 supply voltage
Chân C3 I/O — User I/O bank 1
Chân C4 GND — Ground
Chân C5 I/O — User I/O bank 1
Chân C6 I/O — User I/O bank 2
Chân C7 GND — Ground
Chân C8 I/O — User I/O bank 2
Chân C9 VCCIO2 — I/O bank 2 supply voltage
Chân C10 I/O — User I/O bank 2
Chân D1 I/O — User I/O bank 3
Chân D2 I/O — User I/O bank 3
Chân D3 I/O — User I/O bank 3
Chân D4 VCCIO3 — I/O bank 3 supply voltage
Chân D5 I/O — User I/O bank 3
Chân D6 I/O — User I/O bank 4
Chân D7 VCCIO4 — I/O bank 4 supply voltage
Chân D8 I/O — User I/O bank 4
Chân D9 I/O — User I/O bank 4
Chân D10 I/O — User I/O bank 4
Chân E1 I/O — User I/O bank 3
Chân E2 GND — Ground
Chân E3 I/O — User I/O bank 3
Chân E4 I/O — User I/O bank 3
Chân E5 GND — Ground
Chân E6 VCCINT — Core 1.8 V supply
Chân E7 I/O — User I/O bank 4
Chân E8 I/O — User I/O bank 4
Chân E9 GND — Ground
Chân E10 I/O — User I/O bank 4
Chân F1 I/O — User I/O bank 3
Chân F2 VCCIO3 — I/O bank 3 supply voltage
Chân F3 I/O — User I/O bank 3
Chân F4 GND — Ground
Chân F5 I/O — User I/O bank 3
Chân F6 I/O — User I/O bank 4
Chân F7 GND — Ground
Chân F8 I/O — User I/O bank 4
Chân F9 VCCIO4 — I/O bank 4 supply voltage
Chân F10 I/O — User I/O bank 4
Chân G1 I/O — User I/O bank 3
Chân G2 I/O — User I/O bank 3
Chân G3 I/O — User I/O bank 3
Chân G4 VCCIO3 — I/O bank 3 supply voltage
Chân G5 I/O — User I/O bank 3
Chân G6 I/O — User I/O bank 4
Chân G7 VCCIO4 — I/O bank 4 supply voltage
Chân G8 I/O — User I/O bank 4
Chân G9 I/O — User I/O bank 4
Chân G10 I/O — User I/O bank 4
Chân H1 I/O — User I/O bank 3
Chân H2 GND — Ground
Chân H3 I/O — User I/O bank 3
Chân H4 TDI — JTAG Test Data In
Chân H5 TMS — JTAG Test Mode Select
Chân H6 TCK — JTAG Test Clock
Chân H7 TDO — JTAG Test Data Out
Chân H8 I/O — User I/O bank 4
Chân H9 GND — Ground
Chân H10 I/O — User I/O bank 4
Chân J1 I/O — User I/O bank 1 (DEV_OE / CONFIG)
Chân J2 I/O — User I/O bank 1
Chân J3 nCONFIG — Configuration control (pull low to reconfigure)
Chân J4 VCCIO1 — I/O bank 1 supply voltage
Chân J5 GND — Ground
Chân J6 CONF_DONE — Configuration status output
Chân J7 nSTATUS — Configuration status output
Chân J8 I/O — User I/O bank 2
Chân J9 VCCIO2 — I/O bank 2 supply voltage
Chân J10 I/O — User I/O bank 2

Ứng dụng tiêu biểu

EPM240GF100C5N phù hợp cho 7 Áp dụngs: Power-Up Sequencing Controller, Multi-Voltage I/O Voltage Translation Bridge, Address Decoding and Chip-Select Glue Logic, LED Display and Multiplexing Driver, Legacy Bus Bridge (PCI/ISA to Local Bus), Peripheral Expansion in MCU-Based Designs, Industrial Control and IoT Edge Gateways.

⚡

Power-Up Sequencing Controller

The EPM240GF100C5N's instant-on Flash configuration boots in microseconds with no external PROM, making it ideal for multi-rail power sequencing in networking switches, servers, and ATCA boards. With 4.7 ns tPD and 80 user I/Os across four independent VCCIO banks (1.5-3.3 V), one CPLD can monitor PG (power-good) signals from 4-6 DC-DC converters and assert enable lines in the correct order. Engineers typically design with a state-machine IP that captures the desired rail-on sequence in less than 50 macro cells, leaving headroom for fault-handling and watchdog logic.

🌐

Multi-Voltage I/O Voltage Translation Bridge

Each of the four I/O banks on the EPM240GF100C5N accepts an independent VCCIO of 1.5 V, 1.8 V, 2.5 V, or 3.3 V, enabling bidirectional voltage translation between legacy 3.3 V MCUs and modern 1.8 V SoCs without external level shifters. Combined with 80 user I/Os and 4.7 ns propagation delay, a single device can bridge an 8-bit parallel bus, an SPI port, and an I2C bus between three different voltage domains simultaneously. The non-volatile configuration means no boot delay when the rail comes up, simplifying system bring-up.

🏭

Address Decoding and Chip-Select Glue Logic

In microcontroller-based designs with external SRAM, Flash, and peripherals, the EPM240GF100C5N provides deterministic 4.7 ns address decoding to generate chip-select signals faster than software-driven GPIO toggling. The 192 macro cells comfortably hold 6-8 chip-select decoders plus a wait-state generator for slow peripherals, and the JTAG programmability lets designers iterate on decoding tables without board rework. The industrial -40 to +125 C temperature range supports deployment in automotive under-hood and outdoor industrial enclosures.

💡

LED Display and Multiplexing Driver

The EPM240GF100C5N drives multiplexed LED matrices, seven-segment displays, and Charlieplexed arrays with up to 80 outputs and 201 MHz internal performance, well above the scan-rate needs of typical 100-1000 Hz refresh designs. The deterministic 4.7 ns delay supports bit-banged protocols such as WS2812B, APA102, and DMX512 directly from macro-cell state machines, eliminating a dedicated LED driver IC. Flash-based configuration means the animation pattern is retained across power cycles with zero boot latency.

🖥️

Legacy Bus Bridge (PCI/ISA to Local Bus)

Industrial PCs and factory automation controllers still rely on legacy parallel buses (PCI, ISA, PC/104), and the EPM240GF100C5N bridges these to modern SPI, I2C, or local-bus peripherals. With 4.7 ns tPD and 80 I/Os, the device can implement a 16-bit PCI target state machine plus dual-port SRAM handshaking in under 100 macro cells. The 3.3 V PCI-compliant I/O bank interfaces directly to legacy backplanes, while a 1.8 V bank connects to a modern SoC, all inside one BGA-100 package.

🔧

Peripheral Expansion in MCU-Based Designs

When an 8-bit or 32-bit MCU runs out of GPIO, the EPM240GF100C5N adds 80 individually programmable I/Os with edge-triggered interrupts, PWM generators, and quadrature decoders in firmware-upgradable logic. Designers map up to 16 PWM channels at 100 kHz with 10-bit resolution directly into macro-cell state machines, freeing the MCU's CPU cycles for application code. The non-volatile Flash storage means peripheral personality is preserved across brown-out events with no external boot loader required.

🧩

Industrial Control and IoT Edge Gateways

In Industry-4.0 edge gateways, the EPM240GF100C5N aggregates sensor data from Modbus, CAN, and RS-485 networks and presents a unified SPI or I2C interface to the host SoC. The deterministic 4.7 ns logic delay ensures protocol timing compliance on CAN (1 Mbps) and RS-485 (10 Mbps) without software jitter. Its industrial -40 to +125 C temperature range, 1.8 V low-power core, and 8 Kbits user Flash for parameter storage make it a workhorse in compact, fan-less gateway enclosures.

What is the maximum pin-to-pin logic delay of EPM240GF100C5N?
The EPM240GF100C5N delivers a worst-case pin-to-pin logic delay (tPD) of 4.7 ns, per the MAX II Device Handbook specification table. This places it in the high-performance tier of the MAX II family and makes it suitable for glue logic that must complete within one clock cycle of an adjacent ASIC or microcontroller. Source: Altera MAX II Device Handbook, DC Characteristics section.
How many user I/O pins does the EPM240GF100C5N provide?
The EPM240GF100C5N exposes 80 user I/O pins routed through four I/O banks, each capable of independent 1.5 V, 1.8 V, 2.5 V, or 3.3 V operation. According to the device pin-out file, all 80 I/Os are available in the 100-ball FBGA package, with the remaining 20 balls dedicated to supplies, JTAG, and configuration pins. This makes the part attractive for voltage-translation and bus-bridging designs.
What is the difference between EPM240GF100C5N and EPM240F100C5N?
The EPM240GF100C5N uses a 100-ball FineLine BGA (FBGA) package while the EPM240F100C5N uses a 100-pin plastic TQFP (also called 'F100'). Functionally both share the same MAX II die with 192 macro cells, 4.7 ns tPD, and 80 user I/Os, so logic designs transfer unchanged. The BGA version offers smaller board area and better signal integrity at high switching rates but requires vias and BGA assembly capability.
Where can I download the EPM240GF100C5N datasheet PDF?
The official EPM240GF100C5N datasheet (MAX II Device Handbook) is hosted on the Intel Programmable Solutions Group website at intel.com under the MAX II product family documentation. Third-party sites such as alldatasheet.com also mirror the PDF, but always cross-check against the intel.com source for the latest revision. Datasheet document number is the MAX II Device Handbook.
What is the price of EPM240GF100C5N at quantity 100?
As of 2026-09-12, the EPM240GF100C5N lists at approximately $11.45 per unit at a 100-piece quantity break, based on aggregated distributor pricing from DigiKey and Mouser. Pricing at 1-piece quantity averages $14.85. Volume discounts above 1000 pieces can reduce the unit price to roughly $8.92. Stock across major distributors is stable with 32,260 pieces reported on Octopart.
Is EPM240GF100C5N in stock at major distributors?
Yes, the EPM240GF100C5N is currently in stock at DigiKey, Mouser, Arrow, and several authorized resellers, with Octopart reporting 32,260 pieces across the supply chain as of June 2026. Lead time for production quantities is typically 6-10 weeks direct from Intel, but distributor stock ships same-day for orders under 1,000 pieces. No shortage or allocation notice is currently in effect for this part.
What is the best drop-in replacement for EPM240GF100C5N?
The best drop-in replacement is the EPM240GF100C5N itself sourced from a second distributor, since the MAX II CPLD family has no exact second-source equivalent. Same-brand pin-compatible alternatives in the same FBGA-100 footprint include EPM240F100I5N (industrial temperature variant) and the speed-grade EPM240GF100C4N (faster -4 speed bin with shorter tPD). Cross-brand BGA-100 CPLDs from Lattice and Xilinx exist but require PCB re-layout.
Can the EPM240GF100C5N be used for voltage translation between 3.3 V and 1.8 V?
Yes, the EPM240GF100C5N is an excellent voltage-translation bridge because each of its four I/O banks supports an independent VCCIO of 1.5 V, 1.8 V, 2.5 V, or 3.3 V. A 3.3 V MCU on bank A can communicate bidirectionally with a 1.8 V sensor on bank B without external level shifters. The MAX II core runs at 1.8 V regardless, while I/O banks adapt their reference voltage through internal soft-pull and PCI-clamp circuitry documented in the datasheet.
EPM240GF100C5N vs EPM1270F256C5N - which is better for I/O expansion?
For raw I/O count, the EPM1270F256C5N (MAX II, 1270 macro cells, 212 user I/Os, 256-ball FBGA) wins easily with roughly 2.5x more I/Os than the EPM240GF100C5N. However, the EPM240GF100C5N is the better choice when board area is tight and the design needs only 80 I/Os, since its 11 x 11 mm FBGA-100 is significantly smaller than the EPM1270's 17 x 17 mm FBGA-256. Choose the EPM1270F256C5N for high-density designs and EPM240GF100C5N for compact, lower-cost boards.
When should I choose EPM240GF100C5N over a small FPGA?
Choose EPM240GF100C5N over a small FPGA when your design needs fewer than 192 macro cells, requires instant-on non-volatile configuration (no external boot PROM), and must fit within a tight power budget. The MAX II CPLD consumes roughly an order of magnitude less static power than a comparable Cyclone FPGA and boots in microseconds rather than milliseconds. Conversely, an FPGA is the right choice when you need block RAM, DSP, SERDES, or more than ~5,000 logic elements.
What software is required to program the EPM240GF100C5N?
The EPM240GF100C5N is programmed using the Intel Quartus Prime Lite Edition (free) or the legacy Altera Quartus II 13.0 web-edition toolchain. Designs are entered as VHDL, Verilog, or schematic capture, then compiled to a Jam STAPL or JIC file that is downloaded via USB-Blaster or ByteBlaster through the JTAG pins. The same toolchain supports simulation with ModelSim-Intel FPGA Starter Edition, included free with Quartus.
Is the EPM240GF100C5N RoHS compliant and lead-free?
Yes, the EPM240GF100C5N is fully RoHS compliant and lead-free per the device datasheet's compliance table. The FBGA-100 package uses NiPdAu lead-finish balls suitable for lead-free reflow profiles up to 260 C peak. The device also meets REACH requirements; no conflict-mineral declarations are publicly flagged for this part.
What is the difference between MAX II and MAX V CPLDs?
MAX V is the newer, lower-power evolution of MAX II, built on a 0.18 um process with up to 980 macro cells and an internal oscillator. MAX II (which includes EPM240GF100C5N) typically offers more logic density per package (192 macro cells in the EPM240) and longer production history. Both families share the Quartus toolchain and JTAG programming flow, so design IP transfers with minimal effort. New designs generally favor MAX V for new BOMs unless MAX II is already in production.
What is the key specification of EPM240GF100C5N that engineers should know?
Three key specifications dominate EPM240GF100C5N design decisions: 192 macro cells of logic capacity, 4.7 ns pin-to-pin delay enabling high-speed glue logic, and 80 user I/Os across four independent voltage banks (1.5 V to 3.3 V). The combination of instant-on Flash configuration, 1.8 V core, and industrial -40 C to +125 C temperature range makes it uniquely suited for compact, deterministic, low-power logic-replacement tasks in industrial and embedded designs.
What is the best Lattice equivalent for EPM240GF100C5N?
The closest Lattice cross-brand equivalent is the ispMACH 4000 family, for example the LC4128V-75T100I in a 100-pin TQFP, or the LC4064ZE-7TN100C in a 100-ball BGA package. Both share 64-128 macro cells and JTAG programmability with the EPM240GF100C5N but use a different BGA pin-out, so they are NOT drop-in replacements on the same PCB. A board redesign is required if you migrate from EPM240GF100C5N to Lattice.

Dữ liệu tham khảo kỹ thuật cho EPM240GF100C5N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose EPM240GF100C5N when you need a compact, non-volatile, instant-on CPLD with up to 192 macro cells and 80 user I/Os across four independent voltage banks in a 11x11 mm FBGA-100 footprint. It excels in power-sequencing controllers, multi-voltage I/O bridges, address decoders, and LED-multiplexing drivers where deterministic 4.7 ns timing matters more than raw logic density. If you need a hand-solderable TQFP package for prototypes, choose EPM240F100C5N instead (same die, larger board area). For designs that need more than ~250 macro cells, step up to the EPM1270F256C5N or EPM2210 family. If you require faster logic delay below 4 ns in the same BGA footprint, use the -4 speed grade EPM240F100C4N (~3.7 ns tPD). For migration to a non-Altera CPLD on the same PCB, no true cross-brand drop-in exists - a board redesign to Lattice ispMACH 4000 or Xilinx XC9500XL is required.

So sánh với các sản phẩm thay thế

Tham số Sản phẩm này EPM240F100I5N EPM240F100C5N EPM240F100C4N EPM240GF100C5 EPM1270F256C5N
Package 100-ball FBGA (11 x 11 mm) 100-ball FBGA - same 100-pin TQFP - different 100-ball FBGA - same 100-ball FBGA - same (SnPb balls) 256-ball FBGA - different
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Macro Cells 192 192 192 192 192 1270
Pin-to-Pin Delay (tPD) 4.7 ns 4.7 ns 4.7 ns ~3.7 ns (-4 speed grade) 4.7 ns 6.2 ns
User I/Os 80 80 80 80 80 212
Core Voltage 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
Operating Temperature -40 C to +125 C -40 C to +100 C (industrial) -40 C to +125 C -40 C to +125 C -40 C to +125 C -40 C to +125 C

Bảo phân biệt quan trọng

  • Lowest pin-to-pin delay in the MAX II EPM240 family in BGA (vsEPM240F100C4N)
  • Compact 11x11 mm FBGA footprint (vsEPM240F100C5N)
  • Four independent VCCIO banks in a single 100-ball package (vsEPM1270F256C5N)
  • Non-volatile Flash configuration with instant-on (vsLattice ispMACH 4000 (LC4064ZE))

Ghi chú thiết kế

The EPM240GF100C5N requires two separate supply rails: a 1.8 V VCCINT for the core logic and one or more VCCIO rails (1.5/1.8/2.5/3.3 V) for the I/O banks. Decouple each VCCINT and VCCIO pin with a 0.1 uF X7R ceramic capacitor placed within 100 mils of the ball, and add a single 10 uF bulk capacitor near the supply entry point. All four VCCIO banks must be powered even if unused - leaving a VCCIO bank floating causes input-pin leakage and indeterminate I/O behavior on power-up.

The 100-ball FBGA at 1.0 mm pitch requires a 4-layer PCB minimum, with the inner layers acting as ground and power planes directly beneath the BGA. Use 0.5 mm via-pad diameter, 0.25 mm via-drill, and microvia-in-pad if budget allows, to route signals out of the inner rows. Match trace impedance to 50 ohms single-ended for clock and JTAG signals, and provide a continuous ground pour under the BGA for thermal dissipation (~1 W max on this 0.18 um part).

Do not confuse the EPM240GF100C5N (FBGA package) with the EPM240F100C5N (TQFP-100 package). Both share the same die but have completely different PCB footprints. Verify the package code on the incoming-receiving inspection label and on the device top marking. Another common mistake is connecting JTAG pins (TDI, TMS, TCK, TDO) directly to a 3.3 V MCU without a level shifter when VCCIO1 is set to 1.8 V - the 3.3 V signals will exceed absolute-max ratings on the I/O bank. Always tie nCONFIG high through a 10 kohm pull-up and provide a push-button to ground for manual reconfiguration.

Although the MAX II CPLD is a relatively slow device by FPGA standards, the simultaneous-switching output (SSO) limit on each VCCIO bank should still be respected. Bank 1 and Bank 3 each support 24 mA drive strength per pin in PCI mode; avoid driving more than 16 outputs simultaneously at full strength to stay within the GND/VCC bounce budget. For clock outputs, use the dedicated CLK input pin and a global clock buffer to minimize skew - software tools like Quartus' fitter report will flag any timing violations automatically.

Thông tin tuân thủ

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Không chì
Yes
Không halogen
Unknown
Khoáng vật xung đột
Compliant

Lead-free FBGA balls with NiPdAu finish, RoHS compliant per device datasheet. Industrial -40 to +125 C temperature range but not AEC-Q100 qualified for automotive - use automotive-grade MAX V or Cyclone family for AEC-Q100 applications.

Dữ liệu được xác minh vào: 2026-09-12 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

Tìm kiếm liên quan

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