10AX090S3F45E2LG vs 10AX090S2F45E2SG 比較

詳細並排比較 10AX090S3F45E2LG 由 Intel 與 10AX090S2F45E2SG 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
10AX090S2F45E2SG 10AX090S2F45E2SG - Arria 10 GX FPGA 900K LE | Intel FPGA

10AX090S2F45E2SG - Arria 10 GX FPGA 900K LE | Intel FPGA

10AX090S2F45E2SG ✓ 啟用中

規格比較

參數 10AX090S3F45E2LG 10AX090S2F45E2SG
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Series Arria 10 GX Arria 10 GX
Logic Elements 900,000 900,000
Adaptive Logic Modules (ALMs) 339,620 —
Embedded Memory (bits) 59,234,304 59,234,304
DSP Blocks 1,518 [DATA_NEEDED: variable-precision DSP count]
Transceivers 624 (per package aggregate channels) [DATA_NEEDED: number of transceiver channels]
Maximum Transceiver Data Rate 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT) —
封裝 1932-ball FCBGA (F45, 45mm flip-chip BGA) —
Process Node TSMC 20nm 20nm TSMC
Core Voltage (nominal) 0.9 V —
User I/O Banks 12 —
Maximum User I/O 624 —
工作溫度範圍 0C to 100C (E2 commercial) —
Speed Grade S3 (-2 speed grade equivalent) -2 (mid)
安裝類型 Surface Mount (BGA) Surface Mount
RoHS 狀態 Compliant Compliant
Memory Interfaces DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3 —
User I/O Count — 624
Logic Blocks — [DATA_NEEDED: ALM count]
Package Type — 1932-BBGA, FCBGA
工作溫度 — -40C to +100C (E2 = extended)
MSL 等級 — [DATA_NEEDED: moisture sensitivity level]
Lead-Free — Yes
Family — Arria 10
Device Variant — GX (transceiver-equipped)
Ball Count — 1932

資料表與資源

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