5CSEBA4U23C6N vs 5CSEBA4U23C7SN 比較

詳細並排比較 5CSEBA4U23C6N 由 Intel 與 5CSEBA4U23C7SN 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 5CSEBA4U23C6N 5CSEBA4U23C7SN
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Cyclone V SE SoC FPGA Cyclone V SE SoC FPGA
Logic Elements 40,000 —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] [DATA_NEEDED: ALM count]
Embedded Memory (M10K + MLAB) 2,460 Kbits —
DSP Blocks (18x18 Multipliers) 112 —
HPS Processor Cores Dual ARM Cortex-A9 MPCore —
HPS Maximum CPU Clock 925 MHz —
Hard Memory Controller DDR3 / DDR3L / LPDDR2 —
Process Technology TSMC 28 nm low-power —
Core Voltage (VCC) 1.1 V —
General-Purpose FPGA I/Os 188 —
Transceivers Not integrated on SE device —
封裝 672-pin UFBGA / UBGA, 23 x 23 mm, 0.8 mm pitch 672-ball UBGA, 23x23 mm
安裝類型 Surface Mount (BGA) —
工作接面溫度 -40 C to +100 C (typical SE spec; exact C6 grade per datasheet) —
Configuration Modes JTAG (IEEE 1149.1), Active Serial (AS) via EPCS/EPCQ JTAG, serial passive/active
RoHS 狀態 Compliant Compliant
Device Logic Elements — 40,000
Hard Processor System — Dual-core ARM Cortex-A9 MPCore with CoreSight
HPS Maximum Frequency — 800 MHz
Embedded Memory (Kbits) — 2,460
DSP Blocks (18x18) — 112
Maximum User I/Os — 364
Ball Pitch — 0.8 mm
Process Node — TSMC 28 nm low-power
工作溫度 — -40C to +85C (industrial)
Memory Interfaces — DDR2, DDR3, LPDDR2 (hard controller)
Peripherals (HPS) — USB 2.0 OTG, GbE MAC, CAN, SPI, I2C, UART
Speed Grade — C7

資料表與資源

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