EP3SE260F1517C3N vs EP3SE260F1517C4 比較

詳細並排比較 EP3SE260F1517C3N 由 Intel 與 EP3SE260F1517C4 由 Altera. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE260F1517C3N EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel

EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel

EP3SE260F1517C3N ⚠ 最後購買機會

規格比較

參數 EP3SE260F1517C3N EP3SE260F1517C4
品牌 Intel Altera
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 NRND
Family Stratix III E Stratix® III E FPGA
Logic Elements 254,400 —
Embedded Memory 16,672,768 bits (16.7 Mbits) —
User I/Os 976 —
DSP Blocks (18x18 Multipliers) 816 —
M9K Memory Blocks 1,040 —
Maximum Transceiver Data Rate 600 Mbps —
PLLs 4 —
Global Clock Networks 16 —
封裝 1517-BBGA (FCBGA) 1517-BBGA, FCBGA
Process Technology 65 nm TSMC low-power CMOS —
Speed Grade C3 (commercial) -4
工作接面溫度 0 C to +85 C (commercial) —
安裝類型 Surface Mount Surface Mount
RoHS 狀態 Compliant Compliant (per Altera product page)
External Memory Interfaces DDR3, DDR2, QDRII+, RLDRAM2 —
Series — Stratix III E
Logic Elements (LE) — 255,000
Adaptive Logic Modules (ALM) — 10,200 LABs / 10200 ALMs (per Mouser listing)
Embedded Memory (bits) — 16,672,768
User I/O Count — 976
DSP Blocks — 768 (18x18 multipliers per Mouser listing)
Ball Count — 1517
Package Style — Flip-Chip BGA
工作溫度 — Commercial (0C to +85C) - inferred from C4 suffix
Process Node — 40 nm
Lead-Free — Yes

資料表與資源

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