H5AN4G8NBJR-VKI vs H5AN4G8NBJR-RDC 比較

詳細並排比較 H5AN4G8NBJR-VKI 由 SK hynix 與 H5AN4G8NBJR-RDC 由 SK hynix. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

SK hynix
H5AN4G8NBJR-VKI H5AN4G8NBJR-VKI - 4Gb DDR4 SDRAM x8 2666Mbps | SK hynix

H5AN4G8NBJR-VKI - 4Gb DDR4 SDRAM x8 2666Mbps | SK hynix

H5AN4G8NBJR-VKI ✓ 啟用中
SK hynix
H5AN4G8NBJR-RDC H5AN4G8NBJR-RDC - 4Gb DDR4 SDRAM x8 | SK hynix | Main Memory

H5AN4G8NBJR-RDC - 4Gb DDR4 SDRAM x8 | SK hynix | Main Memory

H5AN4G8NBJR-RDC ✓ 啟用中

規格比較

參數 H5AN4G8NBJR-VKI H5AN4G8NBJR-RDC
品牌 SK hynix SK hynix
類別 Memory ICs Memory ICs
生命週期狀態 啟用中 啟用中
記憶體類型 DDR4 SDRAM DDR4 SDRAM
Density 4 Gb 4 Gbit
組織 512M x 8 512M x 8
資料速率 2666 Mbps [DATA_NEEDED: speed grade Mbps]
供應電壓 1.2 V [DATA_NEEDED: VDD supply voltage]
I/O Voltage 1.2 V (SSTL12) —
封裝 FBGA-78 78-ball FBGA
安裝類型 Surface Mount Surface Mount
Speed Grade V (2666) —
Temperature Grade Industrial (I suffix) [DATA_NEEDED: operating temperature range]
Architecture CMOS, 8n prefetch, bank groups —
Termination On-Die Termination (ODT) On-Die Termination (ODT)
DBI Support Yes (Data Bus Inversion / DM) —
CAS 延遲 [DATA_NEEDED: CAS Latency] —
工作溫度 [DATA_NEEDED: Operating Temperature] —
Refresh [DATA_NEEDED: Refresh specification] Auto-refresh and self-refresh
RoHS 狀態 [DATA_NEEDED: RoHS Status] Lead-Free & Halogen-Free (RoHS Compliant)
介面 — DDR4 (Double Data Rate IV)
Bank Architecture — 8 banks with 4 bank groups (x8)
Process Technology — CMOS
Manufacturer — SK hynix
Family Series — H5AN4G4/8/6NBJR

資料表與資源

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