K9UMGB8U7M vs K9PDG08U5M 比較

詳細並排比較 K9UMGB8U7M 由 Samsung Electronics 與 K9PDG08U5M 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Samsung Electronics
K9UMGB8U7M K9UMGB8U7M - Samsung NAND Flash Memory | Samsung Electronics

K9UMGB8U7M - Samsung NAND Flash Memory | Samsung Electronics

K9UMGB8U7M ✓ 啟用中
Samsung Electronics
K9PDG08U5M K9PDG08U5M - 4Gb x8 SLC NAND Flash 3.3V | Samsung Electronics

K9PDG08U5M - 4Gb x8 SLC NAND Flash 3.3V | Samsung Electronics

K9PDG08U5M ✗ 停產

規格比較

參數 K9UMGB8U7M K9PDG08U5M
品牌 Samsung Electronics Samsung Electronics
類別 Memory ICs EEPROM
生命週期狀態 啟用中 停產終止
記憶體類型 NAND Flash NAND Flash (SLC)
Manufacturer Samsung Electronics —
Family K9U series NAND Flash —
Data Interface [DATA_NEEDED: Data Interface] —
Density [DATA_NEEDED: Memory Density] 4 Gbit
組織 [DATA_NEEDED: Memory Organization] x8 (multiplexed I/O)
Cell Type [DATA_NEEDED: Cell Type (SLC/MLC/TLC)] —
供應電壓 [DATA_NEEDED: Supply Voltage] [DATA_NEEDED: supply voltage range]
Page Size [DATA_NEEDED: Page Size] [DATA_NEEDED: page size]
Block Size [DATA_NEEDED: Block Size] [DATA_NEEDED: block size]
Read Time [DATA_NEEDED: Read Time] —
Program Time [DATA_NEEDED: Program Time] —
Endurance [DATA_NEEDED: Program/Erase Cycles] [DATA_NEEDED: program/erase cycles]
工作溫度 [DATA_NEEDED: Operating Temperature Range] [DATA_NEEDED: operating temperature range]
封裝 [DATA_NEEDED: Package Type] TSOP1-48
安裝類型 [DATA_NEEDED: Mounting Type] Surface Mount
RoHS 狀態 [DATA_NEEDED: RoHS Status] [DATA_NEEDED: RoHS status]
Page Read Time — [DATA_NEEDED: page read time]
Page Program Time — [DATA_NEEDED: page program time]
Block Erase Time — [DATA_NEEDED: block erase time]
Access Interface — Asynchronous multiplexed address/data, CLE/ALE control
Ready/Busy Output — Yes (R/B, open-drain)
Write Protect Pin — Yes (/WP)

資料表與資源

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