K9XXG08U0M vs K9PDG08U5M 比較

詳細並排比較 K9XXG08U0M 由 Samsung Electronics 與 K9PDG08U5M 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Samsung Electronics
K9XXG08U0M K9XXG08U0M - 8Gbit SLC NAND Flash 3.3V | Samsung

K9XXG08U0M - 8Gbit SLC NAND Flash 3.3V | Samsung

K9XXG08U0M Obsolete
Samsung Electronics
K9PDG08U5M K9PDG08U5M - 4Gb x8 SLC NAND Flash 3.3V | Samsung Electronics

K9PDG08U5M - 4Gb x8 SLC NAND Flash 3.3V | Samsung Electronics

K9PDG08U5M ✗ 停產

規格比較

參數 K9XXG08U0M K9PDG08U5M
品牌 Samsung Electronics Samsung Electronics
類別 Memory ICs EEPROM
生命週期狀態 Obsolete 停產終止
記憶體類型 NAND Flash NAND Flash (SLC)
Density 8 G-bit 4 Gbit
組織 1G x 8 bit x8 (multiplexed I/O)
Spare Area 256 M-bit (per K9K8G08U0M) —
供應電壓 2.7 V to 3.6 V (3.3V device) [DATA_NEEDED: supply voltage range]
介面 8-bit parallel NAND (command/address/data multiplexed) —
Page Read Time 20 us [DATA_NEEDED: page read time]
封裝 48-pin TSOP-I TSOP1-48
安裝類型 Surface Mount Surface Mount
工作溫度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Access Interface Standard Samsung legacy NAND command set —
Bad Block Management Factory bad block marking (host-managed ECC required) —
Cell Type SLC (K9K8G08U0M) / MLC (K9G8G08U0M variants) —
ECC Requirement External ECC by host controller —
RoHS 狀態 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
MSL 等級 [DATA_NEEDED: moisture sensitivity level] —
Page Size — [DATA_NEEDED: page size]
Block Size — [DATA_NEEDED: block size]
Page Program Time — [DATA_NEEDED: page program time]
Block Erase Time — [DATA_NEEDED: block erase time]
Access Interface — Asynchronous multiplexed address/data, CLE/ALE control
Ready/Busy Output — Yes (R/B, open-drain)
Write Protect Pin — Yes (/WP)
Endurance — [DATA_NEEDED: program/erase cycles]

資料表與資源

瀏覽所有產品 建立 BOM 索取報價